| Message ID | 20191216140622.25467-1-lukasz.luba@arm.com (mailing list archive) |
|---|---|
| Headers | show |
| Series | Thermal extensions for flexibility in cooling device bindings | expand |
Hi Lukasz, On 16/12/2019 15:06, lukasz.luba@arm.com wrote: > From: Lukasz Luba <lukasz.luba@arm.com> > > Hi all, > > This patch set adds extensions to existing thermal zones and cooling devices > binding. Currently they are pinned using static definitions e.g. DT cooling > maps. These changes enable userspace like trusted middleware to change the > layout of cooling maps unbinding and binding the cooling devices. > It might be helpful for drivers loaded as a modules. They can be added to > existing thermal zones to take part of the power split. > It is based on the current work in thermal branch thermal/linux-next > https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next I've been keeping this series out of the previous merge because it did not raise any comments and we are touching the sysfs. For this release, I still don't know what to do with it. Anyone a comment on this series? Rui ? > Lukasz Luba (3): > docs: thermal: Add bind, unbind information together with trip point > thermal: Make cooling device trip point writable from sysfs > thermal: Add sysfs binding for cooling device and thermal zone > > .../driver-api/thermal/sysfs-api.rst | 30 +++++++- > drivers/thermal/thermal_core.c | 3 +- > drivers/thermal/thermal_core.h | 2 + > drivers/thermal/thermal_sysfs.c | 77 +++++++++++++++++++ > 4 files changed, 109 insertions(+), 3 deletions(-) >
Hi Daniel, On 3/13/20 1:33 PM, Daniel Lezcano wrote: > > Hi Lukasz, > > On 16/12/2019 15:06, lukasz.luba@arm.com wrote: >> From: Lukasz Luba <lukasz.luba@arm.com> >> >> Hi all, >> >> This patch set adds extensions to existing thermal zones and cooling devices >> binding. Currently they are pinned using static definitions e.g. DT cooling >> maps. These changes enable userspace like trusted middleware to change the >> layout of cooling maps unbinding and binding the cooling devices. >> It might be helpful for drivers loaded as a modules. They can be added to >> existing thermal zones to take part of the power split. >> It is based on the current work in thermal branch thermal/linux-next >> https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next > > I've been keeping this series out of the previous merge because it did > not raise any comments and we are touching the sysfs. > > For this release, I still don't know what to do with it. Thank you for bringing this back. > > Anyone a comment on this series? Rui ? > Regards, Lukasz
From: Lukasz Luba <lukasz.luba@arm.com> Hi all, This patch set adds extensions to existing thermal zones and cooling devices binding. Currently they are pinned using static definitions e.g. DT cooling maps. These changes enable userspace like trusted middleware to change the layout of cooling maps unbinding and binding the cooling devices. It might be helpful for drivers loaded as a modules. They can be added to existing thermal zones to take part of the power split. It is based on the current work in thermal branch thermal/linux-next https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next Regards, Lukasz Luba Lukasz Luba (3): docs: thermal: Add bind, unbind information together with trip point thermal: Make cooling device trip point writable from sysfs thermal: Add sysfs binding for cooling device and thermal zone .../driver-api/thermal/sysfs-api.rst | 30 +++++++- drivers/thermal/thermal_core.c | 3 +- drivers/thermal/thermal_core.h | 2 + drivers/thermal/thermal_sysfs.c | 77 +++++++++++++++++++ 4 files changed, 109 insertions(+), 3 deletions(-)