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[v3,0/3] arm64: dts: ti: add verdin am62 mallow board

Message ID 20231205184605.35225-1-francesco@dolcini.it (mailing list archive)
Headers show
Series arm64: dts: ti: add verdin am62 mallow board | expand

Message

Francesco Dolcini Dec. 5, 2023, 6:46 p.m. UTC
From: Francesco Dolcini <francesco.dolcini@toradex.com>

Add Toradex Verdin AM62 Mallow carrier board support. Mallow is a
low-cost carrier board in the Verdin family with a small form factor and
build for volume production making it ideal for industrial and embedded
applications.

https://www.toradex.com/products/carrier-board/mallow-carrier-board

v1:
 - https://lore.kernel.org/all/20231123112826.16549-1-francesco@dolcini.it/

v2:
 - https://lore.kernel.org/all/20231201145551.23337-1-francesco@dolcini.it/
 - fixed temperature sensor compatible (s/tmp75c/tmp1075)
 - add Acked-by: Krzysztof

v3:
 - remove TPM node

Joao Paulo Goncalves (3):
  arm64: dts: ti: verdin-am62: improve spi1 chip-select pinctrl
  dt-bindings: arm: ti: add verdin am62 mallow board
  arm64: dts: ti: add verdin am62 mallow board

 .../devicetree/bindings/arm/ti/k3.yaml        |   2 +
 arch/arm64/boot/dts/ti/Makefile               |   2 +
 .../boot/dts/ti/k3-am62-verdin-mallow.dtsi    | 188 ++++++++++++++++++
 arch/arm64/boot/dts/ti/k3-am62-verdin.dtsi    |  17 +-
 .../dts/ti/k3-am625-verdin-nonwifi-mallow.dts |  22 ++
 .../dts/ti/k3-am625-verdin-wifi-mallow.dts    |  22 ++
 6 files changed, 251 insertions(+), 2 deletions(-)
 create mode 100644 arch/arm64/boot/dts/ti/k3-am62-verdin-mallow.dtsi
 create mode 100644 arch/arm64/boot/dts/ti/k3-am625-verdin-nonwifi-mallow.dts
 create mode 100644 arch/arm64/boot/dts/ti/k3-am625-verdin-wifi-mallow.dts

Comments

Nishanth Menon Dec. 6, 2023, 4:04 p.m. UTC | #1
Hi Francesco Dolcini,

On Tue, 05 Dec 2023 19:46:02 +0100, Francesco Dolcini wrote:
> From: Francesco Dolcini <francesco.dolcini@toradex.com>
> 
> Add Toradex Verdin AM62 Mallow carrier board support. Mallow is a
> low-cost carrier board in the Verdin family with a small form factor and
> build for volume production making it ideal for industrial and embedded
> applications.
> 
> [...]

I have applied the following to branch ti-k3-dts-next on [1].
Thank you!

[1/3] arm64: dts: ti: verdin-am62: improve spi1 chip-select pinctrl
      commit: fcb335934c5132f6f0646475ece5db729fcfbf84
[2/3] dt-bindings: arm: ti: add verdin am62 mallow board
      commit: f9b5aae471dca94de2ea525136a59927e9b1d7cf
[3/3] arm64: dts: ti: add verdin am62 mallow board
      commit: 7698622fbcf4fef2ec7e2fcbae35eb5e503dfddf

All being well this means that it will be integrated into the linux-next
tree (usually sometime in the next 24 hours) and sent up the chain during
the next merge window (or sooner if it is a relevant bug fix), however if
problems are discovered then the patch may be dropped or reverted.

You may get further e-mails resulting from automated or manual testing
and review of the tree, please engage with people reporting problems and
send followup patches addressing any issues that are reported if needed.

If any updates are required or you are submitting further changes they
should be sent as incremental updates against current git, existing
patches will not be replaced.

Please add any relevant lists and maintainers to the CCs when replying
to this mail.

[1] https://git.kernel.org/pub/scm/linux/kernel/git/ti/linux.git