| Message ID | 1498102923-68481-1-git-send-email-kevin.wangtao@hisilicon.com (mailing list archive) |
|---|---|
| State | New, archived |
| Headers | show |
On Thu, Jun 22, 2017 at 11:42:01AM +0800, Tao Wang wrote: > This adds documentation of device tree bindings for the > thermal sensor controller of hi3660 SoC. > > Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com> > --- > Changes in v2: > - remove redundant property > > .../devicetree/bindings/thermal/hi3660-thermal.txt | 16 ++++++++++++++++ > 1 file changed, 16 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt > > diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt > new file mode 100644 > index 0000000..f3dddcf > --- /dev/null > +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt > @@ -0,0 +1,16 @@ > +* Temperature Sensor on hisilicon hi3660 SoC > + Would you mind add some more description of the sensors/where to find further hardware documentation? > +** Required properties : > + > +- compatible: "hisilicon,thermal-hi3660". > +- reg: physical base address of thermal sensor and length of memory mapped > + region. > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. > + > +Example : > + > + tsensor: tsensor { > + compatible = "hisilicon,thermal-hi3660"; > + reg = <0x0 0xfff30000 0x0 0x1000>; > + #thermal-sensor-cells = <1>; > + }; > -- > 1.7.9.5 >
On 2017/7/1 11:06, "Eduardo Valentin" <edubezval@gmail.com> wrote: > > On Thu, Jun 22, 2017 at 11:42:01AM +0800, Tao Wang wrote: > > This adds documentation of device tree bindings for the > > thermal sensor controller of hi3660 SoC. > > > > Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com> > > --- > > Changes in v2: > > - remove redundant property > > > > .../devicetree/bindings/thermal/hi3660-thermal.txt | 16 > ++++++++++++++++ > > 1 file changed, 16 insertions(+) > > create mode 100644 Documentation/devicetree/bindings/thermal/hi3660- > thermal.txt > > > > diff --git a/Documentation/devicetree/bindings/thermal/hi3660- > thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660- > thermal.txt > > new file mode 100644 > > index 0000000..f3dddcf > > --- /dev/null > > +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt > > @@ -0,0 +1,16 @@ > > +* Temperature Sensor on hisilicon hi3660 SoC > > + > > Would you mind add some more description of the sensors/where to find > further hardware documentation? Sure, documentation is on https://github.com/96boards/documentation/blob/master/ConsumerEdition/HiKey960/HardwareDocs/HiKey960_SoC_Reference_Manual.pdf > > > +** Required properties : > > + > > +- compatible: "hisilicon,thermal-hi3660". > > +- reg: physical base address of thermal sensor and length of memory > mapped > > + region. > > +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. > > + > > +Example : > > + > > + tsensor: tsensor { > > + compatible = "hisilicon,thermal-hi3660"; > > + reg = <0x0 0xfff30000 0x0 0x1000>; > > + #thermal-sensor-cells = <1>; > > + }; > > -- > > 1.7.9.5 > >
From: Tao Wang <kevin.wangtao@linaro.org>
This series adds thermal support for Hi3660 Soc, which support
all the hardware temperture sensors and two virtual sensors(one
for maximum value of all and one for average value of all).
Patch 1 add dt-binding document to describe how to config dt
for the driver.
Patch 2 introduces the thermal sensor driver.
Patch 3 add dts for the thermal senor driver on Hi3660.
hardware document can be found on
https://github.com/96boards/documentation/blob/master/ConsumerEdition/HiKey960/HardwareDocs/HiKey960_SoC_Reference_Manual.pdf
Changes in v2:
- correct alphabet order
- correct compatible name
- remove redundant property
- rebase changes on linux next
Changes in v3:
- remove unnecessary log print
- described all platform related parameters in DT
- make the driver forward compatible
Tao Wang (3):
dt-bindings: Document the hi3660 thermal sensor bindings
thermal: hisilicon: add thermal sensor driver for Hi3660
arm64: dts: register Hi3660's thermal sensor
.../devicetree/bindings/thermal/hisi-tsensor.txt | 23 +++
arch/arm64/boot/dts/hisilicon/hi3660.dtsi | 10 +
drivers/thermal/Kconfig | 13 ++
drivers/thermal/Makefile | 1 +
drivers/thermal/hisi_tsensor.c | 223 +++++++++++++++++++++
include/dt-bindings/thermal/hi3660-thermal.h | 30 +++
6 files changed, 300 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
create mode 100644 drivers/thermal/hisi_tsensor.c
create mode 100644 include/dt-bindings/thermal/hi3660-thermal.h
diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt new file mode 100644 index 0000000..f3dddcf --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt @@ -0,0 +1,16 @@ +* Temperature Sensor on hisilicon hi3660 SoC + +** Required properties : + +- compatible: "hisilicon,thermal-hi3660". +- reg: physical base address of thermal sensor and length of memory mapped + region. +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. + +Example : + + tsensor: tsensor { + compatible = "hisilicon,thermal-hi3660"; + reg = <0x0 0xfff30000 0x0 0x1000>; + #thermal-sensor-cells = <1>; + };
This adds documentation of device tree bindings for the thermal sensor controller of hi3660 SoC. Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com> --- Changes in v2: - remove redundant property .../devicetree/bindings/thermal/hi3660-thermal.txt | 16 ++++++++++++++++ 1 file changed, 16 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt