From patchwork Mon Sep 12 08:50:48 2022 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Bhupesh Sharma X-Patchwork-Id: 12973456 Return-Path: X-Spam-Checker-Version: SpamAssassin 3.4.0 (2014-02-07) on aws-us-west-2-korg-lkml-1.web.codeaurora.org Received: from vger.kernel.org (vger.kernel.org [23.128.96.18]) by smtp.lore.kernel.org (Postfix) with ESMTP id 08429C6FA83 for ; Mon, 12 Sep 2022 08:51:38 +0000 (UTC) Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S229990AbiILIvf (ORCPT ); Mon, 12 Sep 2022 04:51:35 -0400 Received: from lindbergh.monkeyblade.net ([23.128.96.19]:55146 "EHLO lindbergh.monkeyblade.net" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S230226AbiILIvT (ORCPT ); Mon, 12 Sep 2022 04:51:19 -0400 Received: from mail-pf1-x434.google.com (mail-pf1-x434.google.com [IPv6:2607:f8b0:4864:20::434]) by lindbergh.monkeyblade.net (Postfix) with ESMTPS id 1A0432BB24 for ; Mon, 12 Sep 2022 01:51:15 -0700 (PDT) Received: by mail-pf1-x434.google.com with SMTP id y136so7959826pfb.3 for ; Mon, 12 Sep 2022 01:51:15 -0700 (PDT) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=content-transfer-encoding:mime-version:references:in-reply-to :message-id:date:subject:cc:to:from:from:to:cc:subject:date; bh=cW0iJRf8+xA5COcXhAJlFmlOVxkiZHTZTL93C3LInnc=; b=srYaZbbQ+5ULu/L0xi/5apWf3Fm7EWWe9T3NJjdWY7T4y1QltC/uAf2AxZK0toIecP EpzyZMldCUZm6CXBfx65FpzzXhsE2BuwX4YvynXPDupeTV2hw1Q0i1PnTBvqcL/7QrGR YQ9fBYNymtPPRGdhKmboNt4/7HjIjqqRBSQt5UIu5sriJAAheKJlED0LmHGiKWFZnlQd INpQBVonBqXENyVM5UAf0H/ftRi9Ujh8vIZKATl/3mdmxncb4qUOzRhITLSE1k+1UtRE iO4HpkUFtobSw8mb+i8HWNzgoLqkRfPmBKdYpxzKzGzz/SmuClIKp9yU+iMNi8C7kr/f Xe2A== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20210112; h=content-transfer-encoding:mime-version:references:in-reply-to :message-id:date:subject:cc:to:from:x-gm-message-state:from:to:cc :subject:date; bh=cW0iJRf8+xA5COcXhAJlFmlOVxkiZHTZTL93C3LInnc=; b=U84RfCnClPaYFhcR5BpwQNmMyDWW3fVInp0roUBDRvmJ00Y/zxUN2Pc78igBBZGSX+ sCFeXLMXAv+LOjVLh36QKZ3fpB67OI/9ResleNieI32kmuxP5w03NCvgPMdPNZhMV3iP YRZEch94/WpiIR4A62S1ekCKKnWMaxz1BjCnssu5BYL8HYdUAVRK7I1zO+bvuwDVYhMQ SHquh2yMUk6VIcJyX3Z1G3b3EWrv2mE+aTHD+MZvuqDjpVgHW18DQKBqUz2OtHiASYj0 e678jP0oGCA+WjFs06jgQgE9nHdBMR18RIhIeHlKzTXU+ohYCD4A94BHUbG+yxxJkLcP JXTQ== X-Gm-Message-State: ACgBeo2jTTK9YDAIMllqz1IqmXRxbSfm8JIKvlQjcuvrSkBJXDuIPTFP ObgIs0rxoZNmr0qWoJ70qC3cyg== X-Google-Smtp-Source: AA6agR4x7RI96Nnn/97AnsXd8xxocHTttbzDxD1tIBMmjqvnswDLArR+mDoLRJ5Q33zDr+pXChusIA== X-Received: by 2002:a63:ff55:0:b0:438:fa5d:af36 with SMTP id s21-20020a63ff55000000b00438fa5daf36mr3754995pgk.533.1662972675200; Mon, 12 Sep 2022 01:51:15 -0700 (PDT) Received: from localhost.localdomain ([2401:4900:1c60:5362:9d7f:2354:1d0a:78e3]) by smtp.gmail.com with ESMTPSA id h13-20020a170902f54d00b00172897952a0sm5326699plf.283.2022.09.12.01.51.11 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Mon, 12 Sep 2022 01:51:14 -0700 (PDT) From: Bhupesh Sharma To: linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org, devicetree@vger.kernel.org Cc: agross@kernel.org, linux-arm-msm@vger.kernel.org, daniel.lezcano@linaro.org, robh@kernel.org, andersson@kernel.org, rafael@kernel.org, bhupesh.sharma@linaro.org, bhupesh.linux@gmail.com Subject: [PATCH 3/4] dt-bindings: thermal: Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings Date: Mon, 12 Sep 2022 14:20:48 +0530 Message-Id: <20220912085049.3517140-4-bhupesh.sharma@linaro.org> X-Mailer: git-send-email 2.37.1 In-Reply-To: <20220912085049.3517140-1-bhupesh.sharma@linaro.org> References: <20220912085049.3517140-1-bhupesh.sharma@linaro.org> MIME-Version: 1.0 Precedence: bulk List-ID: X-Mailing-List: linux-arm-msm@vger.kernel.org Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings. Qualcomm QMI based TMD cooling device(s) are used for various mitigations for remote subsystem(s) including remote processor mitigation, rail voltage restriction etc. Each child node represents one remote subsystem and each child of this subsystem in-turn represents separate TMD cooling device. Cc: daniel.lezcano@linaro.org Cc: rafael@kernel.org Cc: andersson@kernel.org Cc: robh@kernel.org Signed-off-by: Bhupesh Sharma --- .../bindings/thermal/qcom,qmi-tmd-device.yaml | 78 +++++++++++ .../bindings/thermal/qcom,tmd-device.yaml | 122 ++++++++++++++++++ include/dt-bindings/thermal/qcom,tmd.h | 14 ++ 3 files changed, 214 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml create mode 100644 Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml create mode 100644 include/dt-bindings/thermal/qcom,tmd.h diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml new file mode 100644 index 000000000000..dfda5b611a93 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml @@ -0,0 +1,78 @@ +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) + +%YAML 1.2 +--- +$id: "http://devicetree.org/schemas/thermal/qcom,qmi-tmd-device.yaml#" +$schema: "http://devicetree.org/meta-schemas/core.yaml#" + +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices. + +maintainers: + - Bhupesh Sharma + +description: + Qualcomm QMI based TMD cooling device(s) are used for various + mitigations for remote subsystem(s) including remote processor + mitigation, rail voltage restriction etc. + +properties: + $nodename: + const: qmi-tmd-devices + + compatible: + items: + - const: qcom,qmi-tmd-devices + + modem0: + $ref: /schemas/thermal/qcom,tmd-device.yaml# + + adsp: + $ref: /schemas/thermal/qcom,tmd-device.yaml# + + cdsp: + $ref: /schemas/thermal/qcom,tmd-device.yaml# + + slpi: + $ref: /schemas/thermal/qcom,tmd-device.yaml# + +required: + - compatible + +unevaluatedProperties: false + +examples: + - | + #include + qmi-tmd-devices { + compatible = "qcom,qmi-tmd-devices"; + + modem0 { + qcom,instance-id = ; + + modem0_pa: tmd-device0 { + label = "pa"; + #cooling-cells = <2>; + }; + + modem0_proc: tmd-device1 { + label = "modem"; + #cooling-cells = <2>; + }; + + modem0_current: tmd-device2 { + label = "modem_current"; + #cooling-cells = <2>; + }; + + modem0_skin: tmd-device3 { + label = "modem_skin"; + #cooling-cells = <2>; + }; + + modem0_vdd: tmd-device4 { + label = "cpuv_restriction_cold"; + #cooling-cells = <2>; + }; + }; + }; +... diff --git a/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml new file mode 100644 index 000000000000..38ac62f03376 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml @@ -0,0 +1,122 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) + +%YAML 1.2 +--- +$id: "http://devicetree.org/schemas/thermal/qcom,tmd-device.yaml#" +$schema: "http://devicetree.org/meta-schemas/core.yaml#" + +title: Qualcomm thermal mitigation (TMD) cooling devices + +maintainers: + - Bhupesh Sharma + +description: + Qualcomm thermal mitigation (TMD) cooling devices. Each child node + represents one remote subsystem and each child of this subsystem in-turn + represents separate cooling devices. + +properties: + $nodename: + pattern: "^(modem|adsp|cdsp|slpi[0-9])?$" + + qcom,instance-id: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + Remote subsystem QMI server instance id to be used for communicating with QMI. + +patternProperties: + "^tmd-device[0-9]?$": + type: object + description: + Subnodes indicating tmd cooling device of a specific category. + properties: + label: + maxItems: 1 + description: | + Remote subsystem device identifier. Acceptable device names - + "pa" -> for pa cooling device, + "cpuv_restriction_cold" -> for vdd restriction, + "cx_vdd_limit" -> for vdd limit, + "modem" -> for processor passive cooling device, + "modem_current" -> for current limiting device, + "modem_bw" -> for bus bandwidth limiting device, + "cpr_cold" -> for cpr restriction. + + "#cooling-cells": + const: 2 + + required: + - label + - "#cooling-cells" + + additionalProperties: false + +required: + - qcom,instance-id + +additionalProperties: false + +examples: + - | + #include + modem0 { + qcom,instance-id = ; + + modem0_pa: tmd-device0 { + label = "pa"; + #cooling-cells = <2>; + }; + + modem0_proc: tmd-device1 { + label = "modem"; + #cooling-cells = <2>; + }; + + modem0_current: tmd-device2 { + label = "modem_current"; + #cooling-cells = <2>; + }; + + modem0_skin: tmd-device3 { + label = "modem_skin"; + #cooling-cells = <2>; + }; + + modem0_vdd: tmd-device4 { + label = "cpuv_restriction_cold"; + #cooling-cells = <2>; + }; + }; + + - | + #include + adsp { + qcom,instance-id = ; + + adsp_vdd: tmd-device1 { + label = "cpuv_restriction_cold"; + #cooling-cells = <2>; + }; + }; + + - | + #include + cdsp { + qcom,instance-id = ; + + cdsp_vdd: tmd-device1 { + label = "cpuv_restriction_cold"; + #cooling-cells = <2>; + }; + }; + + - | + #include + slpi { + qcom,instance-id = ; + + slpi_vdd: tmd-device1 { + label = "cpuv_restriction_cold"; + #cooling-cells = <2>; + }; + }; diff --git a/include/dt-bindings/thermal/qcom,tmd.h b/include/dt-bindings/thermal/qcom,tmd.h new file mode 100644 index 000000000000..5ede4422e04e --- /dev/null +++ b/include/dt-bindings/thermal/qcom,tmd.h @@ -0,0 +1,14 @@ +/* SPDX-License-Identifier: GPL-2.0 */ +/* + * This header provides constants for the Qualcomm TMD instances. + */ + +#ifndef _DT_BINDINGS_THERMAL_QCOM_TMD_H_ +#define _DT_BINDINGS_THERMAL_QCOM_TMD_H_ + +#define MODEM0_INSTANCE_ID 0x0 +#define ADSP_INSTANCE_ID 0x1 +#define CDSP_INSTANCE_ID 0x43 +#define SLPI_INSTANCE_ID 0x53 + +#endif