| Message ID | e9aacd33071a00568b67e110fa3bcc4d86d3e1e4.1595245166.git.amit.kucheria@linaro.org (mailing list archive) |
|---|---|
| State | Accepted |
| Commit | cff1d293bb3ad35fb1eedb2d2e462935f4a42489 |
| Headers | show |
| Series | dt-bindings: thermal: Get rid of thermal.txt and replace references | expand |
On Mon, Jul 20, 2020 at 5:13 PM Amit Kucheria <amit.kucheria@linaro.org> wrote: > > Now that we have yaml bindings for the thermal subsystem, get rid of the > old bindings (thermal.txt). > > Replace all references to thermal.txt in the Documentation with a link > to the appropriate YAML bindings using the following search and replace > pattern: > - If the reference is specific to the thermal-sensor-cells property, > replace with a pointer to thermal-sensor.yaml > - If the reference is to the cooling-cells property, replace with a > pointer to thermal-cooling-devices.yaml > - If the reference is generic thermal bindings, replace with a > reference to thermal*.yaml. > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> Please ignore. Forgot to add Rob's Ack and annotate with v2. Will resend. > --- > Changes since v1: > - Rebase onto v.5.8-rc6 to make it apply again > - Fix cpufreq/nvidia,tegra20-cpufreq.txt > - Fix bindings/arm/freescale/fsl,scu.txt > > > .../devicetree/bindings/arm/arm,scmi.txt | 2 +- > .../devicetree/bindings/arm/arm,scpi.txt | 2 +- > .../bindings/arm/freescale/fsl,scu.txt | 2 +- > .../arm/marvell/ap80x-system-controller.txt | 2 +- > .../arm/marvell/cp110-system-controller.txt | 2 +- > .../bindings/cpufreq/cpufreq-dt.txt | 3 +- > .../bindings/cpufreq/cpufreq-mediatek.txt | 4 +- > .../cpufreq/nvidia,tegra20-cpufreq.txt | 2 +- > .../devicetree/bindings/hwmon/gpio-fan.txt | 3 +- > .../devicetree/bindings/hwmon/lm90.txt | 4 +- > .../thermal/allwinner,sun8i-a83t-ths.yaml | 2 +- > .../bindings/thermal/amazon,al-thermal.txt | 2 +- > .../bindings/thermal/brcm,avs-ro-thermal.yaml | 2 +- > .../bindings/thermal/brcm,bcm2835-thermal.txt | 2 +- > .../bindings/thermal/hisilicon-thermal.txt | 2 +- > .../bindings/thermal/max77620_thermal.txt | 6 +- > .../bindings/thermal/mediatek-thermal.txt | 2 +- > .../thermal/nvidia,tegra124-soctherm.txt | 10 +- > .../thermal/nvidia,tegra186-bpmp-thermal.txt | 2 +- > .../bindings/thermal/qcom-spmi-temp-alarm.txt | 2 +- > .../bindings/thermal/rockchip-thermal.txt | 2 +- > .../bindings/thermal/tango-thermal.txt | 2 +- > .../bindings/thermal/thermal-generic-adc.txt | 2 +- > .../devicetree/bindings/thermal/thermal.txt | 586 ------------------ > 24 files changed, 34 insertions(+), 616 deletions(-) > delete mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt > > diff --git a/Documentation/devicetree/bindings/arm/arm,scmi.txt b/Documentation/devicetree/bindings/arm/arm,scmi.txt > index 1f293ea24cd85..55deb68230ebb 100644 > --- a/Documentation/devicetree/bindings/arm/arm,scmi.txt > +++ b/Documentation/devicetree/bindings/arm/arm,scmi.txt > @@ -102,7 +102,7 @@ Required sub-node properties: > [0] http://infocenter.arm.com/help/topic/com.arm.doc.den0056a/index.html > [1] Documentation/devicetree/bindings/clock/clock-bindings.txt > [2] Documentation/devicetree/bindings/power/power-domain.yaml > -[3] Documentation/devicetree/bindings/thermal/thermal.txt > +[3] Documentation/devicetree/bindings/thermal/thermal*.yaml > [4] Documentation/devicetree/bindings/sram/sram.yaml > [5] Documentation/devicetree/bindings/reset/reset.txt > > diff --git a/Documentation/devicetree/bindings/arm/arm,scpi.txt b/Documentation/devicetree/bindings/arm/arm,scpi.txt > index dd04d9d9a1b8e..bcd6c3ec471e6 100644 > --- a/Documentation/devicetree/bindings/arm/arm,scpi.txt > +++ b/Documentation/devicetree/bindings/arm/arm,scpi.txt > @@ -108,7 +108,7 @@ Required properties: > > [0] http://infocenter.arm.com/help/topic/com.arm.doc.dui0922b/index.html > [1] Documentation/devicetree/bindings/clock/clock-bindings.txt > -[2] Documentation/devicetree/bindings/thermal/thermal.txt > +[2] Documentation/devicetree/bindings/thermal/thermal*.yaml > [3] Documentation/devicetree/bindings/sram/sram.yaml > [4] Documentation/devicetree/bindings/power/power-domain.yaml > > diff --git a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt > index 10b8459e49f8c..6064d98b10314 100644 > --- a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt > +++ b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt > @@ -176,7 +176,7 @@ Required properties: > "fsl,imx8qxp-sc-thermal" > followed by "fsl,imx-sc-thermal"; > > -- #thermal-sensor-cells: See Documentation/devicetree/bindings/thermal/thermal.txt > +- #thermal-sensor-cells: See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml > for a description. > > Example (imx8qxp): > diff --git a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt > index 098d932fc9630..e31511255d8e3 100644 > --- a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt > +++ b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt > @@ -111,7 +111,7 @@ Thermal: > -------- > > For common binding part and usage, refer to > -Documentation/devicetree/bindings/thermal/thermal.txt > +Documentation/devicetree/bindings/thermal/thermal*.yaml > > The thermal IP can probe the temperature all around the processor. It > may feature several channels, each of them wired to one sensor. > diff --git a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt > index f982a8ed93968..a21f7709596c0 100644 > --- a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt > +++ b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt > @@ -203,7 +203,7 @@ It is possible to setup an overheat interrupt by giving at least one > critical point to any subnode of the thermal-zone node. > > For common binding part and usage, refer to > -Documentation/devicetree/bindings/thermal/thermal.txt > +Documentation/devicetree/bindings/thermal/thermal*.yaml > > Required properties: > - compatible: must be one of: > diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt > index 332aed8f4597a..56f4423743838 100644 > --- a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt > +++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt > @@ -18,7 +18,8 @@ Optional properties: > in unit of nanoseconds. > - voltage-tolerance: Specify the CPU voltage tolerance in percentage. > - #cooling-cells: > - Please refer to Documentation/devicetree/bindings/thermal/thermal.txt. > + Please refer to > + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml. > > Examples: > > diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt > index 0551c78619de8..ea4994b35207d 100644 > --- a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt > +++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt > @@ -21,8 +21,8 @@ Optional properties: > flow is handled by hardware, hence no software "voltage tracking" is > needed. > - #cooling-cells: > - Please refer to Documentation/devicetree/bindings/thermal/thermal.txt > - for detail. > + For details, please refer to > + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml > > Example 1 (MT7623 SoC): > > diff --git a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt > index daeca6ae6b769..52a24b82fd864 100644 > --- a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt > +++ b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt > @@ -5,7 +5,7 @@ Required properties: > - clocks: Must contain an entry for the CPU clock. > See ../clocks/clock-bindings.txt for details. > - operating-points-v2: See ../bindings/opp/opp.txt for details. > -- #cooling-cells: Should be 2. See ../thermal/thermal.txt for details. > +- #cooling-cells: Should be 2. See ../thermal/thermal-cooling-devices.yaml for details. > > For each opp entry in 'operating-points-v2' table: > - opp-supported-hw: Two bitfields indicating: > diff --git a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt > index 2becdcfdc840c..f4cfa350f6a14 100644 > --- a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt > +++ b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt > @@ -12,7 +12,8 @@ Optional properties: > - alarm-gpios: This pin going active indicates something is wrong with > the fan, and a udev event will be fired. > - #cooling-cells: If used as a cooling device, must be <2> > - Also see: Documentation/devicetree/bindings/thermal/thermal.txt > + Also see: > + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml > min and max states are derived from the speed-map of the fan. > > Note: At least one the "gpios" or "alarm-gpios" properties must be set. > diff --git a/Documentation/devicetree/bindings/hwmon/lm90.txt b/Documentation/devicetree/bindings/hwmon/lm90.txt > index c76a7ac47c342..398dcb9657514 100644 > --- a/Documentation/devicetree/bindings/hwmon/lm90.txt > +++ b/Documentation/devicetree/bindings/hwmon/lm90.txt > @@ -34,8 +34,8 @@ Optional properties: > LM90 "-ALERT" pin output. > See interrupt-controller/interrupts.txt for the format. > > -- #thermal-sensor-cells: should be set to 1. See thermal/thermal.txt for > - details. See <include/dt-bindings/thermal/lm90.h> for the > +- #thermal-sensor-cells: should be set to 1. See thermal/thermal-sensor.yaml > + for details. See <include/dt-bindings/thermal/lm90.h> for the > definition of the local, remote and 2nd remote sensor index > constants. > > diff --git a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml > index 87369264feb96..44ba6765697d8 100644 > --- a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml > +++ b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml > @@ -50,7 +50,7 @@ properties: > nvmem-cell-names: > const: calibration > > - # See ./thermal.txt for details > + # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details > "#thermal-sensor-cells": > enum: > - 0 > diff --git a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt > index 703979dbd577d..12fc4ef04837f 100644 > --- a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt > +++ b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt > @@ -6,7 +6,7 @@ transaction. > Required properties: > - compatible: "amazon,al-thermal". > - reg: The physical base address and length of the sensor's registers. > -- #thermal-sensor-cells: Must be 1. See ./thermal.txt for a description. > +- #thermal-sensor-cells: Must be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. > > Example: > thermal: thermal { > diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml > index f3e68ed03abf8..1ab5070c751d5 100644 > --- a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml > +++ b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml > @@ -23,7 +23,7 @@ properties: > compatible: > const: brcm,bcm2711-thermal > > - # See ./thermal.txt for details > + # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details > "#thermal-sensor-cells": > const: 0 > > diff --git a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt > index da8c5b73ad105..a3e9ec5dc7ac4 100644 > --- a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt > +++ b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt > @@ -7,7 +7,7 @@ compatible: should be one of: "brcm,bcm2835-thermal", > "brcm,bcm2836-thermal" or "brcm,bcm2837-thermal" > reg: Address range of the thermal registers. > clocks: Phandle of the clock used by the thermal sensor. > -#thermal-sensor-cells: should be 0 (see thermal.txt) > +#thermal-sensor-cells: should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml) > > Example: > > diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > index cef716a236f1a..4b19d80e6558b 100644 > --- a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt > @@ -9,7 +9,7 @@ > by /SOCTHERM/tsensor. > - clock-names: Input clock name, should be 'thermal_clk'. > - clocks: phandles for clock specified in "clock-names" property. > -- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. > +- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. > > Example : > > diff --git a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt > index 323a3b3822aac..82ed5d4879666 100644 > --- a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt > +++ b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt > @@ -8,12 +8,12 @@ below threshold level. > > Required properties: > ------------------- > -#thermal-sensor-cells: Please refer <devicetree/bindings/thermal/thermal.txt> > - for more details. > +#thermal-sensor-cells: For more details, please refer to > + <devicetree/bindings/thermal/thermal-sensor.yaml> > The value must be 0. > > For more details, please refer generic thermal DT binding document > -<devicetree/bindings/thermal/thermal.txt>. > +<devicetree/bindings/thermal/thermal*.yaml>. > > Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding > document for the MAX77620. > diff --git a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt > index f8d7831f39740..1e249c42fae04 100644 > --- a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt > +++ b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt > @@ -23,7 +23,7 @@ Required properties: > - resets: Reference to the reset controller controlling the thermal controller. > - mediatek,auxadc: A phandle to the AUXADC which the thermal controller uses > - mediatek,apmixedsys: A phandle to the APMIXEDSYS controller. > -- #thermal-sensor-cells : Should be 0. See ./thermal.txt for a description. > +- #thermal-sensor-cells : Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. > > Optional properties: > - nvmem-cells: A phandle to the calibration data provided by a nvmem device. If > diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt > index f02f38527a6b6..db880e7ed713e 100644 > --- a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt > +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt > @@ -28,9 +28,10 @@ Required properties : > See ../reset/reset.txt for details. > - reset-names : Must include the following entries: > - soctherm > -- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description > - of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a > - list of valid values when referring to thermal sensors. > +- #thermal-sensor-cells : Should be 1. For a description of this property, see > + Documentation/devicetree/bindings/thermal/thermal-sensor.yaml. > + See <dt-bindings/thermal/tegra124-soctherm.h> for a list of valid values > + when referring to thermal sensors. > - throttle-cfgs: A sub-node which is a container of configuration for each > hardware throttle events. These events can be set as cooling devices. > * throttle events: Sub-nodes must be named as "light" or "heavy". > @@ -62,7 +63,8 @@ Required properties : > TEGRA_SOCTHERM_THROT_LEVEL_MED (75%), > TEGRA_SOCTHERM_THROT_LEVEL_HIGH (85%). > - #cooling-cells: Should be 1. This cooling device only support on/off state. > - See ./thermal.txt for a description of this property. > + For a description of this property see: > + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml > > Optional properties: The following properties are T210 specific and > valid only for OCx throttle events. > diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt > index e17c07be270b7..fc87f6aa1b8f5 100644 > --- a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt > +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt > @@ -8,7 +8,7 @@ exposed by BPMP. > The BPMP thermal node must be located directly inside the main BPMP node. See > ../firmware/nvidia,tegra186-bpmp.txt for details of the BPMP binding. > > -This node represents a thermal sensor. See thermal.txt for details of the > +This node represents a thermal sensor. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details of the > core thermal binding. > > Required properties: > diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt > index 0273a92a2a849..2d5b2ad03314b 100644 > --- a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt > +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt > @@ -8,7 +8,7 @@ Required properties: > - compatible: Should contain "qcom,spmi-temp-alarm". > - reg: Specifies the SPMI address. > - interrupts: PMIC temperature alarm interrupt. > -- #thermal-sensor-cells: Should be 0. See thermal.txt for a description. > +- #thermal-sensor-cells: Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. > > Optional properties: > - io-channels: Should contain IIO channel specifier for the ADC channel, > diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt > index c6aac9bcacf1c..7f94669e9ebef 100644 > --- a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt > +++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt > @@ -24,7 +24,7 @@ Required properties: > - pinctrl-1 : The "default" pinctrl state, it will be set after reset the > TSADC controller. > - pinctrl-2 : The "sleep" pinctrl state, it will be in for suspend. > -- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description. > +- #thermal-sensor-cells : Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. > > Optional properties: > - rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value. > diff --git a/Documentation/devicetree/bindings/thermal/tango-thermal.txt b/Documentation/devicetree/bindings/thermal/tango-thermal.txt > index 212198d4b9379..2c918d742867a 100644 > --- a/Documentation/devicetree/bindings/thermal/tango-thermal.txt > +++ b/Documentation/devicetree/bindings/thermal/tango-thermal.txt > @@ -4,7 +4,7 @@ The SMP8758 SoC includes 3 instances of this temperature sensor > (in the CPU, video decoder, and PCIe controller). > > Required properties: > -- #thermal-sensor-cells: Should be 0 (see thermal.txt) > +- #thermal-sensor-cells: Should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml) > - compatible: "sigma,smp8758-thermal" > - reg: Address range of the thermal registers > > diff --git a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt > index 691a09db2fefc..e136946a2f4fd 100644 > --- a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt > +++ b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt > @@ -8,7 +8,7 @@ temperature using voltage-temperature lookup table. > Required properties: > =================== > - compatible: Must be "generic-adc-thermal". > -- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description > +- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description > of this property. > Optional properties: > =================== > diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt > deleted file mode 100644 > index f78bec19ca358..0000000000000 > --- a/Documentation/devicetree/bindings/thermal/thermal.txt > +++ /dev/null > @@ -1,586 +0,0 @@ > -* Thermal Framework Device Tree descriptor > - > -This file describes a generic binding to provide a way of > -defining hardware thermal structure using device tree. > -A thermal structure includes thermal zones and their components, > -such as trip points, polling intervals, sensors and cooling devices > -binding descriptors. > - > -The target of device tree thermal descriptors is to describe only > -the hardware thermal aspects. The thermal device tree bindings are > -not about how the system must control or which algorithm or policy > -must be taken in place. > - > -There are five types of nodes involved to describe thermal bindings: > -- thermal sensors: devices which may be used to take temperature > - measurements. > -- cooling devices: devices which may be used to dissipate heat. > -- trip points: describe key temperatures at which cooling is recommended. The > - set of points should be chosen based on hardware limits. > -- cooling maps: used to describe links between trip points and cooling devices; > -- thermal zones: used to describe thermal data within the hardware; > - > -The following is a description of each of these node types. > - > -* Thermal sensor devices > - > -Thermal sensor devices are nodes providing temperature sensing capabilities on > -thermal zones. Typical devices are I2C ADC converters and bandgaps. These are > -nodes providing temperature data to thermal zones. Thermal sensor devices may > -control one or more internal sensors. > - > -Required property: > -- #thermal-sensor-cells: Used to provide sensor device specific information > - Type: unsigned while referring to it. Typically 0 on thermal sensor > - Size: one cell nodes with only one sensor, and at least 1 on nodes > - with several internal sensors, in order > - to identify uniquely the sensor instances within > - the IC. See thermal zone binding for more details > - on how consumers refer to sensor devices. > - > -* Cooling device nodes > - > -Cooling devices are nodes providing control on power dissipation. There > -are essentially two ways to provide control on power dissipation. First > -is by means of regulating device performance, which is known as passive > -cooling. A typical passive cooling is a CPU that has dynamic voltage and > -frequency scaling (DVFS), and uses lower frequencies as cooling states. > -Second is by means of activating devices in order to remove > -the dissipated heat, which is known as active cooling, e.g. regulating > -fan speeds. In both cases, cooling devices shall have a way to determine > -the state of cooling in which the device is. > - > -Any cooling device has a range of cooling states (i.e. different levels > -of heat dissipation). For example a fan's cooling states correspond to > -the different fan speeds possible. Cooling states are referred to by > -single unsigned integers, where larger numbers mean greater heat > -dissipation. The precise set of cooling states associated with a device > -should be defined in a particular device's binding. > -For more examples of cooling devices, refer to the example sections below. > - > -Required properties: > -- #cooling-cells: Used to provide cooling device specific information > - Type: unsigned while referring to it. Must be at least 2, in order > - Size: one cell to specify minimum and maximum cooling state used > - in the reference. The first cell is the minimum > - cooling state requested and the second cell is > - the maximum cooling state requested in the reference. > - See Cooling device maps section below for more details > - on how consumers refer to cooling devices. > - > -* Trip points > - > -The trip node is a node to describe a point in the temperature domain > -in which the system takes an action. This node describes just the point, > -not the action. > - > -Required properties: > -- temperature: An integer indicating the trip temperature level, > - Type: signed in millicelsius. > - Size: one cell > - > -- hysteresis: A low hysteresis value on temperature property (above). > - Type: unsigned This is a relative value, in millicelsius. > - Size: one cell > - > -- type: a string containing the trip type. Expected values are: > - "active": A trip point to enable active cooling > - "passive": A trip point to enable passive cooling > - "hot": A trip point to notify emergency > - "critical": Hardware not reliable. > - Type: string > - > -* Cooling device maps > - > -The cooling device maps node is a node to describe how cooling devices > -get assigned to trip points of the zone. The cooling devices are expected > -to be loaded in the target system. > - > -Required properties: > -- cooling-device: A list of phandles of cooling devices with their specifiers, > - Type: phandle + referring to which cooling devices are used in this > - cooling specifier binding. In the cooling specifier, the first cell > - is the minimum cooling state and the second cell > - is the maximum cooling state used in this map. > -- trip: A phandle of a trip point node within the same thermal > - Type: phandle of zone. > - trip point node > - > -Optional property: > -- contribution: The cooling contribution to the thermal zone of the > - Type: unsigned referred cooling device at the referred trip point. > - Size: one cell The contribution is a ratio of the sum > - of all cooling contributions within a thermal zone. > - > -Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle > -limit specifier means: > -(i) - minimum state allowed for minimum cooling state used in the reference. > -(ii) - maximum state allowed for maximum cooling state used in the reference. > -Refer to include/dt-bindings/thermal/thermal.h for definition of this constant. > - > -* Thermal zone nodes > - > -The thermal zone node is the node containing all the required info > -for describing a thermal zone, including its cooling device bindings. The > -thermal zone node must contain, apart from its own properties, one sub-node > -containing trip nodes and one sub-node containing all the zone cooling maps. > - > -Required properties: > -- polling-delay: The maximum number of milliseconds to wait between polls > - Type: unsigned when checking this thermal zone. > - Size: one cell > - > -- polling-delay-passive: The maximum number of milliseconds to wait > - Type: unsigned between polls when performing passive cooling. > - Size: one cell > - > -- thermal-sensors: A list of thermal sensor phandles and sensor specifier > - Type: list of used while monitoring the thermal zone. > - phandles + sensor > - specifier > - > -- trips: A sub-node which is a container of only trip point nodes > - Type: sub-node required to describe the thermal zone. > - > -Optional property: > -- cooling-maps: A sub-node which is a container of only cooling device > - Type: sub-node map nodes, used to describe the relation between trips > - and cooling devices. > - > -- coefficients: An array of integers (one signed cell) containing > - Type: array coefficients to compose a linear relation between > - Elem size: one cell the sensors listed in the thermal-sensors property. > - Elem type: signed Coefficients defaults to 1, in case this property > - is not specified. A simple linear polynomial is used: > - Z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn. > - > - The coefficients are ordered and they match with sensors > - by means of sensor ID. Additional coefficients are > - interpreted as constant offset. > - > -- sustainable-power: An estimate of the sustainable power (in mW) that the > - Type: unsigned thermal zone can dissipate at the desired > - Size: one cell control temperature. For reference, the > - sustainable power of a 4'' phone is typically > - 2000mW, while on a 10'' tablet is around > - 4500mW. > - > -Note: The delay properties are bound to the maximum dT/dt (temperature > -derivative over time) in two situations for a thermal zone: > -(i) - when passive cooling is activated (polling-delay-passive); and > -(ii) - when the zone just needs to be monitored (polling-delay) or > -when active cooling is activated. > - > -The maximum dT/dt is highly bound to hardware power consumption and dissipation > -capability. The delays should be chosen to account for said max dT/dt, > -such that a device does not cross several trip boundaries unexpectedly > -between polls. Choosing the right polling delays shall avoid having the > -device in temperature ranges that may damage the silicon structures and > -reduce silicon lifetime. > - > -* The thermal-zones node > - > -The "thermal-zones" node is a container for all thermal zone nodes. It shall > -contain only sub-nodes describing thermal zones as in the section > -"Thermal zone nodes". The "thermal-zones" node appears under "/". > - > -* Examples > - > -Below are several examples on how to use thermal data descriptors > -using device tree bindings: > - > -(a) - CPU thermal zone > - > -The CPU thermal zone example below describes how to setup one thermal zone > -using one single sensor as temperature source and many cooling devices and > -power dissipation control sources. > - > -#include <dt-bindings/thermal/thermal.h> > - > -cpus { > - /* > - * Here is an example of describing a cooling device for a DVFS > - * capable CPU. The CPU node describes its four OPPs. > - * The cooling states possible are 0..3, and they are > - * used as OPP indexes. The minimum cooling state is 0, which means > - * all four OPPs can be available to the system. The maximum > - * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V) > - * can be available in the system. > - */ > - cpu0: cpu@0 { > - ... > - operating-points = < > - /* kHz uV */ > - 970000 1200000 > - 792000 1100000 > - 396000 950000 > - 198000 850000 > - >; > - #cooling-cells = <2>; /* min followed by max */ > - }; > - ... > -}; > - > -&i2c1 { > - ... > - /* > - * A simple fan controller which supports 10 speeds of operation > - * (represented as 0-9). > - */ > - fan0: fan@48 { > - ... > - #cooling-cells = <2>; /* min followed by max */ > - }; > -}; > - > -ocp { > - ... > - /* > - * A simple IC with a single bandgap temperature sensor. > - */ > - bandgap0: bandgap@0000ed00 { > - ... > - #thermal-sensor-cells = <0>; > - }; > -}; > - > -thermal-zones { > - cpu_thermal: cpu-thermal { > - polling-delay-passive = <250>; /* milliseconds */ > - polling-delay = <1000>; /* milliseconds */ > - > - thermal-sensors = <&bandgap0>; > - > - trips { > - cpu_alert0: cpu-alert0 { > - temperature = <90000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "active"; > - }; > - cpu_alert1: cpu-alert1 { > - temperature = <100000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "passive"; > - }; > - cpu_crit: cpu-crit { > - temperature = <125000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "critical"; > - }; > - }; > - > - cooling-maps { > - map0 { > - trip = <&cpu_alert0>; > - cooling-device = <&fan0 THERMAL_NO_LIMIT 4>; > - }; > - map1 { > - trip = <&cpu_alert1>; > - cooling-device = <&fan0 5 THERMAL_NO_LIMIT>, <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; > - }; > - }; > - }; > -}; > - > -In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is > -used to monitor the zone 'cpu-thermal' using its sole sensor. A fan > -device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten > -different cooling states 0-9. It is used to remove the heat out of > -the thermal zone 'cpu-thermal' using its cooling states > -from its minimum to 4, when it reaches trip point 'cpu_alert0' > -at 90C, as an example of active cooling. The same cooling device is used at > -'cpu_alert1', but from 5 to its maximum state. The cpu@0 device is also > -linked to the same thermal zone, 'cpu-thermal', as a passive cooling device, > -using all its cooling states at trip point 'cpu_alert1', > -which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the > -temperature of 125C, represented by the trip point 'cpu_crit', the silicon > -is not reliable anymore. > - > -(b) - IC with several internal sensors > - > -The example below describes how to deploy several thermal zones based off a > -single sensor IC, assuming it has several internal sensors. This is a common > -case on SoC designs with several internal IPs that may need different thermal > -requirements, and thus may have their own sensor to monitor or detect internal > -hotspots in their silicon. > - > -#include <dt-bindings/thermal/thermal.h> > - > -ocp { > - ... > - /* > - * A simple IC with several bandgap temperature sensors. > - */ > - bandgap0: bandgap@0000ed00 { > - ... > - #thermal-sensor-cells = <1>; > - }; > -}; > - > -thermal-zones { > - cpu_thermal: cpu-thermal { > - polling-delay-passive = <250>; /* milliseconds */ > - polling-delay = <1000>; /* milliseconds */ > - > - /* sensor ID */ > - thermal-sensors = <&bandgap0 0>; > - > - trips { > - /* each zone within the SoC may have its own trips */ > - cpu_alert: cpu-alert { > - temperature = <100000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "passive"; > - }; > - cpu_crit: cpu-crit { > - temperature = <125000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "critical"; > - }; > - }; > - > - cooling-maps { > - /* each zone within the SoC may have its own cooling */ > - ... > - }; > - }; > - > - gpu_thermal: gpu-thermal { > - polling-delay-passive = <120>; /* milliseconds */ > - polling-delay = <1000>; /* milliseconds */ > - > - /* sensor ID */ > - thermal-sensors = <&bandgap0 1>; > - > - trips { > - /* each zone within the SoC may have its own trips */ > - gpu_alert: gpu-alert { > - temperature = <90000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "passive"; > - }; > - gpu_crit: gpu-crit { > - temperature = <105000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "critical"; > - }; > - }; > - > - cooling-maps { > - /* each zone within the SoC may have its own cooling */ > - ... > - }; > - }; > - > - dsp_thermal: dsp-thermal { > - polling-delay-passive = <50>; /* milliseconds */ > - polling-delay = <1000>; /* milliseconds */ > - > - /* sensor ID */ > - thermal-sensors = <&bandgap0 2>; > - > - trips { > - /* each zone within the SoC may have its own trips */ > - dsp_alert: dsp-alert { > - temperature = <90000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "passive"; > - }; > - dsp_crit: gpu-crit { > - temperature = <135000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "critical"; > - }; > - }; > - > - cooling-maps { > - /* each zone within the SoC may have its own cooling */ > - ... > - }; > - }; > -}; > - > -In the example above, there is one bandgap IC which has the capability to > -monitor three sensors. The hardware has been designed so that sensors are > -placed on different places in the DIE to monitor different temperature > -hotspots: one for CPU thermal zone, one for GPU thermal zone and the > -other to monitor a DSP thermal zone. > - > -Thus, there is a need to assign each sensor provided by the bandgap IC > -to different thermal zones. This is achieved by means of using the > -#thermal-sensor-cells property and using the first cell of the sensor > -specifier as sensor ID. In the example, then, <bandgap 0> is used to > -monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal > -zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone > -may be uncorrelated, having its own dT/dt requirements, trips > -and cooling maps. > - > - > -(c) - Several sensors within one single thermal zone > - > -The example below illustrates how to use more than one sensor within > -one thermal zone. > - > -#include <dt-bindings/thermal/thermal.h> > - > -&i2c1 { > - ... > - /* > - * A simple IC with a single temperature sensor. > - */ > - adc: sensor@49 { > - ... > - #thermal-sensor-cells = <0>; > - }; > -}; > - > -ocp { > - ... > - /* > - * A simple IC with a single bandgap temperature sensor. > - */ > - bandgap0: bandgap@0000ed00 { > - ... > - #thermal-sensor-cells = <0>; > - }; > -}; > - > -thermal-zones { > - cpu_thermal: cpu-thermal { > - polling-delay-passive = <250>; /* milliseconds */ > - polling-delay = <1000>; /* milliseconds */ > - > - thermal-sensors = <&bandgap0>, /* cpu */ > - <&adc>; /* pcb north */ > - > - /* hotspot = 100 * bandgap - 120 * adc + 484 */ > - coefficients = <100 -120 484>; > - > - trips { > - ... > - }; > - > - cooling-maps { > - ... > - }; > - }; > -}; > - > -In some cases, there is a need to use more than one sensor to extrapolate > -a thermal hotspot in the silicon. The above example illustrates this situation. > -For instance, it may be the case that a sensor external to CPU IP may be placed > -close to CPU hotspot and together with internal CPU sensor, it is used > -to determine the hotspot. Assuming this is the case for the above example, > -the hypothetical extrapolation rule would be: > - hotspot = 100 * bandgap - 120 * adc + 484 > - > -In other context, the same idea can be used to add fixed offset. For instance, > -consider the hotspot extrapolation rule below: > - hotspot = 1 * adc + 6000 > - > -In the above equation, the hotspot is always 6C higher than what is read > -from the ADC sensor. The binding would be then: > - thermal-sensors = <&adc>; > - > - /* hotspot = 1 * adc + 6000 */ > - coefficients = <1 6000>; > - > -(d) - Board thermal > - > -The board thermal example below illustrates how to setup one thermal zone > -with many sensors and many cooling devices. > - > -#include <dt-bindings/thermal/thermal.h> > - > -&i2c1 { > - ... > - /* > - * An IC with several temperature sensor. > - */ > - adc_dummy: sensor@50 { > - ... > - #thermal-sensor-cells = <1>; /* sensor internal ID */ > - }; > -}; > - > -thermal-zones { > - batt-thermal { > - polling-delay-passive = <500>; /* milliseconds */ > - polling-delay = <2500>; /* milliseconds */ > - > - /* sensor ID */ > - thermal-sensors = <&adc_dummy 4>; > - > - trips { > - ... > - }; > - > - cooling-maps { > - ... > - }; > - }; > - > - board_thermal: board-thermal { > - polling-delay-passive = <1000>; /* milliseconds */ > - polling-delay = <2500>; /* milliseconds */ > - > - /* sensor ID */ > - thermal-sensors = <&adc_dummy 0>, /* pcb top edge */ > - <&adc_dummy 1>, /* lcd */ > - <&adc_dummy 2>; /* back cover */ > - /* > - * An array of coefficients describing the sensor > - * linear relation. E.g.: > - * z = c1*x1 + c2*x2 + c3*x3 > - */ > - coefficients = <1200 -345 890>; > - > - sustainable-power = <2500>; > - > - trips { > - /* Trips are based on resulting linear equation */ > - cpu_trip: cpu-trip { > - temperature = <60000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "passive"; > - }; > - gpu_trip: gpu-trip { > - temperature = <55000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "passive"; > - } > - lcd_trip: lcp-trip { > - temperature = <53000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "passive"; > - }; > - crit_trip: crit-trip { > - temperature = <68000>; /* millicelsius */ > - hysteresis = <2000>; /* millicelsius */ > - type = "critical"; > - }; > - }; > - > - cooling-maps { > - map0 { > - trip = <&cpu_trip>; > - cooling-device = <&cpu0 0 2>; > - contribution = <55>; > - }; > - map1 { > - trip = <&gpu_trip>; > - cooling-device = <&gpu0 0 2>; > - contribution = <20>; > - }; > - map2 { > - trip = <&lcd_trip>; > - cooling-device = <&lcd0 5 10>; > - contribution = <15>; > - }; > - }; > - }; > -}; > - > -The above example is a mix of previous examples, a sensor IP with several internal > -sensors used to monitor different zones, one of them is composed by several sensors and > -with different cooling devices. > -- > 2.25.1 >
On 20-07-20, 17:23, Amit Kucheria wrote: > Now that we have yaml bindings for the thermal subsystem, get rid of the > old bindings (thermal.txt). > > Replace all references to thermal.txt in the Documentation with a link > to the appropriate YAML bindings using the following search and replace > pattern: > - If the reference is specific to the thermal-sensor-cells property, > replace with a pointer to thermal-sensor.yaml > - If the reference is to the cooling-cells property, replace with a > pointer to thermal-cooling-devices.yaml > - If the reference is generic thermal bindings, replace with a > reference to thermal*.yaml. > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > Reviewed-by: Rob Herring <robh@kernel.org> > > --- > Changes since v1: > - Rebase onto v.5.8-rc6 to make it apply again > - Fix cpufreq/nvidia,tegra20-cpufreq.txt > - Fix bindings/arm/freescale/fsl,scu.txt > > > .../bindings/cpufreq/cpufreq-dt.txt | 3 +- > .../bindings/cpufreq/cpufreq-mediatek.txt | 4 +- > .../cpufreq/nvidia,tegra20-cpufreq.txt | 2 +- Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
On 20/07/2020 13:53, Amit Kucheria wrote: > Now that we have yaml bindings for the thermal subsystem, get rid of the > old bindings (thermal.txt). > > Replace all references to thermal.txt in the Documentation with a link > to the appropriate YAML bindings using the following search and replace > pattern: > - If the reference is specific to the thermal-sensor-cells property, > replace with a pointer to thermal-sensor.yaml > - If the reference is to the cooling-cells property, replace with a > pointer to thermal-cooling-devices.yaml > - If the reference is generic thermal bindings, replace with a > reference to thermal*.yaml. > > Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> > Reviewed-by: Rob Herring <robh@kernel.org> Applied, thanks
diff --git a/Documentation/devicetree/bindings/arm/arm,scmi.txt b/Documentation/devicetree/bindings/arm/arm,scmi.txt index 1f293ea24cd85..55deb68230ebb 100644 --- a/Documentation/devicetree/bindings/arm/arm,scmi.txt +++ b/Documentation/devicetree/bindings/arm/arm,scmi.txt @@ -102,7 +102,7 @@ Required sub-node properties: [0] http://infocenter.arm.com/help/topic/com.arm.doc.den0056a/index.html [1] Documentation/devicetree/bindings/clock/clock-bindings.txt [2] Documentation/devicetree/bindings/power/power-domain.yaml -[3] Documentation/devicetree/bindings/thermal/thermal.txt +[3] Documentation/devicetree/bindings/thermal/thermal*.yaml [4] Documentation/devicetree/bindings/sram/sram.yaml [5] Documentation/devicetree/bindings/reset/reset.txt diff --git a/Documentation/devicetree/bindings/arm/arm,scpi.txt b/Documentation/devicetree/bindings/arm/arm,scpi.txt index dd04d9d9a1b8e..bcd6c3ec471e6 100644 --- a/Documentation/devicetree/bindings/arm/arm,scpi.txt +++ b/Documentation/devicetree/bindings/arm/arm,scpi.txt @@ -108,7 +108,7 @@ Required properties: [0] http://infocenter.arm.com/help/topic/com.arm.doc.dui0922b/index.html [1] Documentation/devicetree/bindings/clock/clock-bindings.txt -[2] Documentation/devicetree/bindings/thermal/thermal.txt +[2] Documentation/devicetree/bindings/thermal/thermal*.yaml [3] Documentation/devicetree/bindings/sram/sram.yaml [4] Documentation/devicetree/bindings/power/power-domain.yaml diff --git a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt index 10b8459e49f8c..6064d98b10314 100644 --- a/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt +++ b/Documentation/devicetree/bindings/arm/freescale/fsl,scu.txt @@ -176,7 +176,7 @@ Required properties: "fsl,imx8qxp-sc-thermal" followed by "fsl,imx-sc-thermal"; -- #thermal-sensor-cells: See Documentation/devicetree/bindings/thermal/thermal.txt +- #thermal-sensor-cells: See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. Example (imx8qxp): diff --git a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt index 098d932fc9630..e31511255d8e3 100644 --- a/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt +++ b/Documentation/devicetree/bindings/arm/marvell/ap80x-system-controller.txt @@ -111,7 +111,7 @@ Thermal: -------- For common binding part and usage, refer to -Documentation/devicetree/bindings/thermal/thermal.txt +Documentation/devicetree/bindings/thermal/thermal*.yaml The thermal IP can probe the temperature all around the processor. It may feature several channels, each of them wired to one sensor. diff --git a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt index f982a8ed93968..a21f7709596c0 100644 --- a/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt +++ b/Documentation/devicetree/bindings/arm/marvell/cp110-system-controller.txt @@ -203,7 +203,7 @@ It is possible to setup an overheat interrupt by giving at least one critical point to any subnode of the thermal-zone node. For common binding part and usage, refer to -Documentation/devicetree/bindings/thermal/thermal.txt +Documentation/devicetree/bindings/thermal/thermal*.yaml Required properties: - compatible: must be one of: diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt index 332aed8f4597a..56f4423743838 100644 --- a/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt +++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-dt.txt @@ -18,7 +18,8 @@ Optional properties: in unit of nanoseconds. - voltage-tolerance: Specify the CPU voltage tolerance in percentage. - #cooling-cells: - Please refer to Documentation/devicetree/bindings/thermal/thermal.txt. + Please refer to + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml. Examples: diff --git a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt index 0551c78619de8..ea4994b35207d 100644 --- a/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt +++ b/Documentation/devicetree/bindings/cpufreq/cpufreq-mediatek.txt @@ -21,8 +21,8 @@ Optional properties: flow is handled by hardware, hence no software "voltage tracking" is needed. - #cooling-cells: - Please refer to Documentation/devicetree/bindings/thermal/thermal.txt - for detail. + For details, please refer to + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml Example 1 (MT7623 SoC): diff --git a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt index daeca6ae6b769..52a24b82fd864 100644 --- a/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt +++ b/Documentation/devicetree/bindings/cpufreq/nvidia,tegra20-cpufreq.txt @@ -5,7 +5,7 @@ Required properties: - clocks: Must contain an entry for the CPU clock. See ../clocks/clock-bindings.txt for details. - operating-points-v2: See ../bindings/opp/opp.txt for details. -- #cooling-cells: Should be 2. See ../thermal/thermal.txt for details. +- #cooling-cells: Should be 2. See ../thermal/thermal-cooling-devices.yaml for details. For each opp entry in 'operating-points-v2' table: - opp-supported-hw: Two bitfields indicating: diff --git a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt index 2becdcfdc840c..f4cfa350f6a14 100644 --- a/Documentation/devicetree/bindings/hwmon/gpio-fan.txt +++ b/Documentation/devicetree/bindings/hwmon/gpio-fan.txt @@ -12,7 +12,8 @@ Optional properties: - alarm-gpios: This pin going active indicates something is wrong with the fan, and a udev event will be fired. - #cooling-cells: If used as a cooling device, must be <2> - Also see: Documentation/devicetree/bindings/thermal/thermal.txt + Also see: + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml min and max states are derived from the speed-map of the fan. Note: At least one the "gpios" or "alarm-gpios" properties must be set. diff --git a/Documentation/devicetree/bindings/hwmon/lm90.txt b/Documentation/devicetree/bindings/hwmon/lm90.txt index c76a7ac47c342..398dcb9657514 100644 --- a/Documentation/devicetree/bindings/hwmon/lm90.txt +++ b/Documentation/devicetree/bindings/hwmon/lm90.txt @@ -34,8 +34,8 @@ Optional properties: LM90 "-ALERT" pin output. See interrupt-controller/interrupts.txt for the format. -- #thermal-sensor-cells: should be set to 1. See thermal/thermal.txt for - details. See <include/dt-bindings/thermal/lm90.h> for the +- #thermal-sensor-cells: should be set to 1. See thermal/thermal-sensor.yaml + for details. See <include/dt-bindings/thermal/lm90.h> for the definition of the local, remote and 2nd remote sensor index constants. diff --git a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml index 87369264feb96..44ba6765697d8 100644 --- a/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml +++ b/Documentation/devicetree/bindings/thermal/allwinner,sun8i-a83t-ths.yaml @@ -50,7 +50,7 @@ properties: nvmem-cell-names: const: calibration - # See ./thermal.txt for details + # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details "#thermal-sensor-cells": enum: - 0 diff --git a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt index 703979dbd577d..12fc4ef04837f 100644 --- a/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt +++ b/Documentation/devicetree/bindings/thermal/amazon,al-thermal.txt @@ -6,7 +6,7 @@ transaction. Required properties: - compatible: "amazon,al-thermal". - reg: The physical base address and length of the sensor's registers. -- #thermal-sensor-cells: Must be 1. See ./thermal.txt for a description. +- #thermal-sensor-cells: Must be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. Example: thermal: thermal { diff --git a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml index f3e68ed03abf8..1ab5070c751d5 100644 --- a/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml +++ b/Documentation/devicetree/bindings/thermal/brcm,avs-ro-thermal.yaml @@ -23,7 +23,7 @@ properties: compatible: const: brcm,bcm2711-thermal - # See ./thermal.txt for details + # See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details "#thermal-sensor-cells": const: 0 diff --git a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt index da8c5b73ad105..a3e9ec5dc7ac4 100644 --- a/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt +++ b/Documentation/devicetree/bindings/thermal/brcm,bcm2835-thermal.txt @@ -7,7 +7,7 @@ compatible: should be one of: "brcm,bcm2835-thermal", "brcm,bcm2836-thermal" or "brcm,bcm2837-thermal" reg: Address range of the thermal registers. clocks: Phandle of the clock used by the thermal sensor. -#thermal-sensor-cells: should be 0 (see thermal.txt) +#thermal-sensor-cells: should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml) Example: diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt index cef716a236f1a..4b19d80e6558b 100644 --- a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt +++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt @@ -9,7 +9,7 @@ by /SOCTHERM/tsensor. - clock-names: Input clock name, should be 'thermal_clk'. - clocks: phandles for clock specified in "clock-names" property. -- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. +- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. Example : diff --git a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt index 323a3b3822aac..82ed5d4879666 100644 --- a/Documentation/devicetree/bindings/thermal/max77620_thermal.txt +++ b/Documentation/devicetree/bindings/thermal/max77620_thermal.txt @@ -8,12 +8,12 @@ below threshold level. Required properties: ------------------- -#thermal-sensor-cells: Please refer <devicetree/bindings/thermal/thermal.txt> - for more details. +#thermal-sensor-cells: For more details, please refer to + <devicetree/bindings/thermal/thermal-sensor.yaml> The value must be 0. For more details, please refer generic thermal DT binding document -<devicetree/bindings/thermal/thermal.txt>. +<devicetree/bindings/thermal/thermal*.yaml>. Please refer <devicetree/bindings/mfd/max77620.txt> for mfd DT binding document for the MAX77620. diff --git a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt index f8d7831f39740..1e249c42fae04 100644 --- a/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt +++ b/Documentation/devicetree/bindings/thermal/mediatek-thermal.txt @@ -23,7 +23,7 @@ Required properties: - resets: Reference to the reset controller controlling the thermal controller. - mediatek,auxadc: A phandle to the AUXADC which the thermal controller uses - mediatek,apmixedsys: A phandle to the APMIXEDSYS controller. -- #thermal-sensor-cells : Should be 0. See ./thermal.txt for a description. +- #thermal-sensor-cells : Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. Optional properties: - nvmem-cells: A phandle to the calibration data provided by a nvmem device. If diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt index f02f38527a6b6..db880e7ed713e 100644 --- a/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra124-soctherm.txt @@ -28,9 +28,10 @@ Required properties : See ../reset/reset.txt for details. - reset-names : Must include the following entries: - soctherm -- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description - of this property. See <dt-bindings/thermal/tegra124-soctherm.h> for a - list of valid values when referring to thermal sensors. +- #thermal-sensor-cells : Should be 1. For a description of this property, see + Documentation/devicetree/bindings/thermal/thermal-sensor.yaml. + See <dt-bindings/thermal/tegra124-soctherm.h> for a list of valid values + when referring to thermal sensors. - throttle-cfgs: A sub-node which is a container of configuration for each hardware throttle events. These events can be set as cooling devices. * throttle events: Sub-nodes must be named as "light" or "heavy". @@ -62,7 +63,8 @@ Required properties : TEGRA_SOCTHERM_THROT_LEVEL_MED (75%), TEGRA_SOCTHERM_THROT_LEVEL_HIGH (85%). - #cooling-cells: Should be 1. This cooling device only support on/off state. - See ./thermal.txt for a description of this property. + For a description of this property see: + Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml Optional properties: The following properties are T210 specific and valid only for OCx throttle events. diff --git a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt index e17c07be270b7..fc87f6aa1b8f5 100644 --- a/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt +++ b/Documentation/devicetree/bindings/thermal/nvidia,tegra186-bpmp-thermal.txt @@ -8,7 +8,7 @@ exposed by BPMP. The BPMP thermal node must be located directly inside the main BPMP node. See ../firmware/nvidia,tegra186-bpmp.txt for details of the BPMP binding. -This node represents a thermal sensor. See thermal.txt for details of the +This node represents a thermal sensor. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for details of the core thermal binding. Required properties: diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt index 0273a92a2a849..2d5b2ad03314b 100644 --- a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt @@ -8,7 +8,7 @@ Required properties: - compatible: Should contain "qcom,spmi-temp-alarm". - reg: Specifies the SPMI address. - interrupts: PMIC temperature alarm interrupt. -- #thermal-sensor-cells: Should be 0. See thermal.txt for a description. +- #thermal-sensor-cells: Should be 0. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. Optional properties: - io-channels: Should contain IIO channel specifier for the ADC channel, diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt index c6aac9bcacf1c..7f94669e9ebef 100644 --- a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt +++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt @@ -24,7 +24,7 @@ Required properties: - pinctrl-1 : The "default" pinctrl state, it will be set after reset the TSADC controller. - pinctrl-2 : The "sleep" pinctrl state, it will be in for suspend. -- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description. +- #thermal-sensor-cells : Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description. Optional properties: - rockchip,hw-tshut-temp : The hardware-controlled shutdown temperature value. diff --git a/Documentation/devicetree/bindings/thermal/tango-thermal.txt b/Documentation/devicetree/bindings/thermal/tango-thermal.txt index 212198d4b9379..2c918d742867a 100644 --- a/Documentation/devicetree/bindings/thermal/tango-thermal.txt +++ b/Documentation/devicetree/bindings/thermal/tango-thermal.txt @@ -4,7 +4,7 @@ The SMP8758 SoC includes 3 instances of this temperature sensor (in the CPU, video decoder, and PCIe controller). Required properties: -- #thermal-sensor-cells: Should be 0 (see thermal.txt) +- #thermal-sensor-cells: Should be 0 (see Documentation/devicetree/bindings/thermal/thermal-sensor.yaml) - compatible: "sigma,smp8758-thermal" - reg: Address range of the thermal registers diff --git a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt index 691a09db2fefc..e136946a2f4fd 100644 --- a/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt +++ b/Documentation/devicetree/bindings/thermal/thermal-generic-adc.txt @@ -8,7 +8,7 @@ temperature using voltage-temperature lookup table. Required properties: =================== - compatible: Must be "generic-adc-thermal". -- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description +- #thermal-sensor-cells: Should be 1. See Documentation/devicetree/bindings/thermal/thermal-sensor.yaml for a description of this property. Optional properties: =================== diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt deleted file mode 100644 index f78bec19ca358..0000000000000 --- a/Documentation/devicetree/bindings/thermal/thermal.txt +++ /dev/null @@ -1,586 +0,0 @@ -* Thermal Framework Device Tree descriptor - -This file describes a generic binding to provide a way of -defining hardware thermal structure using device tree. -A thermal structure includes thermal zones and their components, -such as trip points, polling intervals, sensors and cooling devices -binding descriptors. - -The target of device tree thermal descriptors is to describe only -the hardware thermal aspects. The thermal device tree bindings are -not about how the system must control or which algorithm or policy -must be taken in place. - -There are five types of nodes involved to describe thermal bindings: -- thermal sensors: devices which may be used to take temperature - measurements. -- cooling devices: devices which may be used to dissipate heat. -- trip points: describe key temperatures at which cooling is recommended. The - set of points should be chosen based on hardware limits. -- cooling maps: used to describe links between trip points and cooling devices; -- thermal zones: used to describe thermal data within the hardware; - -The following is a description of each of these node types. - -* Thermal sensor devices - -Thermal sensor devices are nodes providing temperature sensing capabilities on -thermal zones. Typical devices are I2C ADC converters and bandgaps. These are -nodes providing temperature data to thermal zones. Thermal sensor devices may -control one or more internal sensors. - -Required property: -- #thermal-sensor-cells: Used to provide sensor device specific information - Type: unsigned while referring to it. Typically 0 on thermal sensor - Size: one cell nodes with only one sensor, and at least 1 on nodes - with several internal sensors, in order - to identify uniquely the sensor instances within - the IC. See thermal zone binding for more details - on how consumers refer to sensor devices. - -* Cooling device nodes - -Cooling devices are nodes providing control on power dissipation. There -are essentially two ways to provide control on power dissipation. First -is by means of regulating device performance, which is known as passive -cooling. A typical passive cooling is a CPU that has dynamic voltage and -frequency scaling (DVFS), and uses lower frequencies as cooling states. -Second is by means of activating devices in order to remove -the dissipated heat, which is known as active cooling, e.g. regulating -fan speeds. In both cases, cooling devices shall have a way to determine -the state of cooling in which the device is. - -Any cooling device has a range of cooling states (i.e. different levels -of heat dissipation). For example a fan's cooling states correspond to -the different fan speeds possible. Cooling states are referred to by -single unsigned integers, where larger numbers mean greater heat -dissipation. The precise set of cooling states associated with a device -should be defined in a particular device's binding. -For more examples of cooling devices, refer to the example sections below. - -Required properties: -- #cooling-cells: Used to provide cooling device specific information - Type: unsigned while referring to it. Must be at least 2, in order - Size: one cell to specify minimum and maximum cooling state used - in the reference. The first cell is the minimum - cooling state requested and the second cell is - the maximum cooling state requested in the reference. - See Cooling device maps section below for more details - on how consumers refer to cooling devices. - -* Trip points - -The trip node is a node to describe a point in the temperature domain -in which the system takes an action. This node describes just the point, -not the action. - -Required properties: -- temperature: An integer indicating the trip temperature level, - Type: signed in millicelsius. - Size: one cell - -- hysteresis: A low hysteresis value on temperature property (above). - Type: unsigned This is a relative value, in millicelsius. - Size: one cell - -- type: a string containing the trip type. Expected values are: - "active": A trip point to enable active cooling - "passive": A trip point to enable passive cooling - "hot": A trip point to notify emergency - "critical": Hardware not reliable. - Type: string - -* Cooling device maps - -The cooling device maps node is a node to describe how cooling devices -get assigned to trip points of the zone. The cooling devices are expected -to be loaded in the target system. - -Required properties: -- cooling-device: A list of phandles of cooling devices with their specifiers, - Type: phandle + referring to which cooling devices are used in this - cooling specifier binding. In the cooling specifier, the first cell - is the minimum cooling state and the second cell - is the maximum cooling state used in this map. -- trip: A phandle of a trip point node within the same thermal - Type: phandle of zone. - trip point node - -Optional property: -- contribution: The cooling contribution to the thermal zone of the - Type: unsigned referred cooling device at the referred trip point. - Size: one cell The contribution is a ratio of the sum - of all cooling contributions within a thermal zone. - -Note: Using the THERMAL_NO_LIMIT (-1UL) constant in the cooling-device phandle -limit specifier means: -(i) - minimum state allowed for minimum cooling state used in the reference. -(ii) - maximum state allowed for maximum cooling state used in the reference. -Refer to include/dt-bindings/thermal/thermal.h for definition of this constant. - -* Thermal zone nodes - -The thermal zone node is the node containing all the required info -for describing a thermal zone, including its cooling device bindings. The -thermal zone node must contain, apart from its own properties, one sub-node -containing trip nodes and one sub-node containing all the zone cooling maps. - -Required properties: -- polling-delay: The maximum number of milliseconds to wait between polls - Type: unsigned when checking this thermal zone. - Size: one cell - -- polling-delay-passive: The maximum number of milliseconds to wait - Type: unsigned between polls when performing passive cooling. - Size: one cell - -- thermal-sensors: A list of thermal sensor phandles and sensor specifier - Type: list of used while monitoring the thermal zone. - phandles + sensor - specifier - -- trips: A sub-node which is a container of only trip point nodes - Type: sub-node required to describe the thermal zone. - -Optional property: -- cooling-maps: A sub-node which is a container of only cooling device - Type: sub-node map nodes, used to describe the relation between trips - and cooling devices. - -- coefficients: An array of integers (one signed cell) containing - Type: array coefficients to compose a linear relation between - Elem size: one cell the sensors listed in the thermal-sensors property. - Elem type: signed Coefficients defaults to 1, in case this property - is not specified. A simple linear polynomial is used: - Z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn. - - The coefficients are ordered and they match with sensors - by means of sensor ID. Additional coefficients are - interpreted as constant offset. - -- sustainable-power: An estimate of the sustainable power (in mW) that the - Type: unsigned thermal zone can dissipate at the desired - Size: one cell control temperature. For reference, the - sustainable power of a 4'' phone is typically - 2000mW, while on a 10'' tablet is around - 4500mW. - -Note: The delay properties are bound to the maximum dT/dt (temperature -derivative over time) in two situations for a thermal zone: -(i) - when passive cooling is activated (polling-delay-passive); and -(ii) - when the zone just needs to be monitored (polling-delay) or -when active cooling is activated. - -The maximum dT/dt is highly bound to hardware power consumption and dissipation -capability. The delays should be chosen to account for said max dT/dt, -such that a device does not cross several trip boundaries unexpectedly -between polls. Choosing the right polling delays shall avoid having the -device in temperature ranges that may damage the silicon structures and -reduce silicon lifetime. - -* The thermal-zones node - -The "thermal-zones" node is a container for all thermal zone nodes. It shall -contain only sub-nodes describing thermal zones as in the section -"Thermal zone nodes". The "thermal-zones" node appears under "/". - -* Examples - -Below are several examples on how to use thermal data descriptors -using device tree bindings: - -(a) - CPU thermal zone - -The CPU thermal zone example below describes how to setup one thermal zone -using one single sensor as temperature source and many cooling devices and -power dissipation control sources. - -#include <dt-bindings/thermal/thermal.h> - -cpus { - /* - * Here is an example of describing a cooling device for a DVFS - * capable CPU. The CPU node describes its four OPPs. - * The cooling states possible are 0..3, and they are - * used as OPP indexes. The minimum cooling state is 0, which means - * all four OPPs can be available to the system. The maximum - * cooling state is 3, which means only the lowest OPPs (198MHz@0.85V) - * can be available in the system. - */ - cpu0: cpu@0 { - ... - operating-points = < - /* kHz uV */ - 970000 1200000 - 792000 1100000 - 396000 950000 - 198000 850000 - >; - #cooling-cells = <2>; /* min followed by max */ - }; - ... -}; - -&i2c1 { - ... - /* - * A simple fan controller which supports 10 speeds of operation - * (represented as 0-9). - */ - fan0: fan@48 { - ... - #cooling-cells = <2>; /* min followed by max */ - }; -}; - -ocp { - ... - /* - * A simple IC with a single bandgap temperature sensor. - */ - bandgap0: bandgap@0000ed00 { - ... - #thermal-sensor-cells = <0>; - }; -}; - -thermal-zones { - cpu_thermal: cpu-thermal { - polling-delay-passive = <250>; /* milliseconds */ - polling-delay = <1000>; /* milliseconds */ - - thermal-sensors = <&bandgap0>; - - trips { - cpu_alert0: cpu-alert0 { - temperature = <90000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "active"; - }; - cpu_alert1: cpu-alert1 { - temperature = <100000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "passive"; - }; - cpu_crit: cpu-crit { - temperature = <125000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "critical"; - }; - }; - - cooling-maps { - map0 { - trip = <&cpu_alert0>; - cooling-device = <&fan0 THERMAL_NO_LIMIT 4>; - }; - map1 { - trip = <&cpu_alert1>; - cooling-device = <&fan0 5 THERMAL_NO_LIMIT>, <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; - }; - }; - }; -}; - -In the example above, the ADC sensor (bandgap0) at address 0x0000ED00 is -used to monitor the zone 'cpu-thermal' using its sole sensor. A fan -device (fan0) is controlled via I2C bus 1, at address 0x48, and has ten -different cooling states 0-9. It is used to remove the heat out of -the thermal zone 'cpu-thermal' using its cooling states -from its minimum to 4, when it reaches trip point 'cpu_alert0' -at 90C, as an example of active cooling. The same cooling device is used at -'cpu_alert1', but from 5 to its maximum state. The cpu@0 device is also -linked to the same thermal zone, 'cpu-thermal', as a passive cooling device, -using all its cooling states at trip point 'cpu_alert1', -which is a trip point at 100C. On the thermal zone 'cpu-thermal', at the -temperature of 125C, represented by the trip point 'cpu_crit', the silicon -is not reliable anymore. - -(b) - IC with several internal sensors - -The example below describes how to deploy several thermal zones based off a -single sensor IC, assuming it has several internal sensors. This is a common -case on SoC designs with several internal IPs that may need different thermal -requirements, and thus may have their own sensor to monitor or detect internal -hotspots in their silicon. - -#include <dt-bindings/thermal/thermal.h> - -ocp { - ... - /* - * A simple IC with several bandgap temperature sensors. - */ - bandgap0: bandgap@0000ed00 { - ... - #thermal-sensor-cells = <1>; - }; -}; - -thermal-zones { - cpu_thermal: cpu-thermal { - polling-delay-passive = <250>; /* milliseconds */ - polling-delay = <1000>; /* milliseconds */ - - /* sensor ID */ - thermal-sensors = <&bandgap0 0>; - - trips { - /* each zone within the SoC may have its own trips */ - cpu_alert: cpu-alert { - temperature = <100000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "passive"; - }; - cpu_crit: cpu-crit { - temperature = <125000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "critical"; - }; - }; - - cooling-maps { - /* each zone within the SoC may have its own cooling */ - ... - }; - }; - - gpu_thermal: gpu-thermal { - polling-delay-passive = <120>; /* milliseconds */ - polling-delay = <1000>; /* milliseconds */ - - /* sensor ID */ - thermal-sensors = <&bandgap0 1>; - - trips { - /* each zone within the SoC may have its own trips */ - gpu_alert: gpu-alert { - temperature = <90000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "passive"; - }; - gpu_crit: gpu-crit { - temperature = <105000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "critical"; - }; - }; - - cooling-maps { - /* each zone within the SoC may have its own cooling */ - ... - }; - }; - - dsp_thermal: dsp-thermal { - polling-delay-passive = <50>; /* milliseconds */ - polling-delay = <1000>; /* milliseconds */ - - /* sensor ID */ - thermal-sensors = <&bandgap0 2>; - - trips { - /* each zone within the SoC may have its own trips */ - dsp_alert: dsp-alert { - temperature = <90000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "passive"; - }; - dsp_crit: gpu-crit { - temperature = <135000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "critical"; - }; - }; - - cooling-maps { - /* each zone within the SoC may have its own cooling */ - ... - }; - }; -}; - -In the example above, there is one bandgap IC which has the capability to -monitor three sensors. The hardware has been designed so that sensors are -placed on different places in the DIE to monitor different temperature -hotspots: one for CPU thermal zone, one for GPU thermal zone and the -other to monitor a DSP thermal zone. - -Thus, there is a need to assign each sensor provided by the bandgap IC -to different thermal zones. This is achieved by means of using the -#thermal-sensor-cells property and using the first cell of the sensor -specifier as sensor ID. In the example, then, <bandgap 0> is used to -monitor CPU thermal zone, <bandgap 1> is used to monitor GPU thermal -zone and <bandgap 2> is used to monitor DSP thermal zone. Each zone -may be uncorrelated, having its own dT/dt requirements, trips -and cooling maps. - - -(c) - Several sensors within one single thermal zone - -The example below illustrates how to use more than one sensor within -one thermal zone. - -#include <dt-bindings/thermal/thermal.h> - -&i2c1 { - ... - /* - * A simple IC with a single temperature sensor. - */ - adc: sensor@49 { - ... - #thermal-sensor-cells = <0>; - }; -}; - -ocp { - ... - /* - * A simple IC with a single bandgap temperature sensor. - */ - bandgap0: bandgap@0000ed00 { - ... - #thermal-sensor-cells = <0>; - }; -}; - -thermal-zones { - cpu_thermal: cpu-thermal { - polling-delay-passive = <250>; /* milliseconds */ - polling-delay = <1000>; /* milliseconds */ - - thermal-sensors = <&bandgap0>, /* cpu */ - <&adc>; /* pcb north */ - - /* hotspot = 100 * bandgap - 120 * adc + 484 */ - coefficients = <100 -120 484>; - - trips { - ... - }; - - cooling-maps { - ... - }; - }; -}; - -In some cases, there is a need to use more than one sensor to extrapolate -a thermal hotspot in the silicon. The above example illustrates this situation. -For instance, it may be the case that a sensor external to CPU IP may be placed -close to CPU hotspot and together with internal CPU sensor, it is used -to determine the hotspot. Assuming this is the case for the above example, -the hypothetical extrapolation rule would be: - hotspot = 100 * bandgap - 120 * adc + 484 - -In other context, the same idea can be used to add fixed offset. For instance, -consider the hotspot extrapolation rule below: - hotspot = 1 * adc + 6000 - -In the above equation, the hotspot is always 6C higher than what is read -from the ADC sensor. The binding would be then: - thermal-sensors = <&adc>; - - /* hotspot = 1 * adc + 6000 */ - coefficients = <1 6000>; - -(d) - Board thermal - -The board thermal example below illustrates how to setup one thermal zone -with many sensors and many cooling devices. - -#include <dt-bindings/thermal/thermal.h> - -&i2c1 { - ... - /* - * An IC with several temperature sensor. - */ - adc_dummy: sensor@50 { - ... - #thermal-sensor-cells = <1>; /* sensor internal ID */ - }; -}; - -thermal-zones { - batt-thermal { - polling-delay-passive = <500>; /* milliseconds */ - polling-delay = <2500>; /* milliseconds */ - - /* sensor ID */ - thermal-sensors = <&adc_dummy 4>; - - trips { - ... - }; - - cooling-maps { - ... - }; - }; - - board_thermal: board-thermal { - polling-delay-passive = <1000>; /* milliseconds */ - polling-delay = <2500>; /* milliseconds */ - - /* sensor ID */ - thermal-sensors = <&adc_dummy 0>, /* pcb top edge */ - <&adc_dummy 1>, /* lcd */ - <&adc_dummy 2>; /* back cover */ - /* - * An array of coefficients describing the sensor - * linear relation. E.g.: - * z = c1*x1 + c2*x2 + c3*x3 - */ - coefficients = <1200 -345 890>; - - sustainable-power = <2500>; - - trips { - /* Trips are based on resulting linear equation */ - cpu_trip: cpu-trip { - temperature = <60000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "passive"; - }; - gpu_trip: gpu-trip { - temperature = <55000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "passive"; - } - lcd_trip: lcp-trip { - temperature = <53000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "passive"; - }; - crit_trip: crit-trip { - temperature = <68000>; /* millicelsius */ - hysteresis = <2000>; /* millicelsius */ - type = "critical"; - }; - }; - - cooling-maps { - map0 { - trip = <&cpu_trip>; - cooling-device = <&cpu0 0 2>; - contribution = <55>; - }; - map1 { - trip = <&gpu_trip>; - cooling-device = <&gpu0 0 2>; - contribution = <20>; - }; - map2 { - trip = <&lcd_trip>; - cooling-device = <&lcd0 5 10>; - contribution = <15>; - }; - }; - }; -}; - -The above example is a mix of previous examples, a sensor IP with several internal -sensors used to monitor different zones, one of them is composed by several sensors and -with different cooling devices.
Now that we have yaml bindings for the thermal subsystem, get rid of the old bindings (thermal.txt). Replace all references to thermal.txt in the Documentation with a link to the appropriate YAML bindings using the following search and replace pattern: - If the reference is specific to the thermal-sensor-cells property, replace with a pointer to thermal-sensor.yaml - If the reference is to the cooling-cells property, replace with a pointer to thermal-cooling-devices.yaml - If the reference is generic thermal bindings, replace with a reference to thermal*.yaml. Signed-off-by: Amit Kucheria <amit.kucheria@linaro.org> --- Changes since v1: - Rebase onto v.5.8-rc6 to make it apply again - Fix cpufreq/nvidia,tegra20-cpufreq.txt - Fix bindings/arm/freescale/fsl,scu.txt .../devicetree/bindings/arm/arm,scmi.txt | 2 +- .../devicetree/bindings/arm/arm,scpi.txt | 2 +- .../bindings/arm/freescale/fsl,scu.txt | 2 +- .../arm/marvell/ap80x-system-controller.txt | 2 +- .../arm/marvell/cp110-system-controller.txt | 2 +- .../bindings/cpufreq/cpufreq-dt.txt | 3 +- .../bindings/cpufreq/cpufreq-mediatek.txt | 4 +- .../cpufreq/nvidia,tegra20-cpufreq.txt | 2 +- .../devicetree/bindings/hwmon/gpio-fan.txt | 3 +- .../devicetree/bindings/hwmon/lm90.txt | 4 +- .../thermal/allwinner,sun8i-a83t-ths.yaml | 2 +- .../bindings/thermal/amazon,al-thermal.txt | 2 +- .../bindings/thermal/brcm,avs-ro-thermal.yaml | 2 +- .../bindings/thermal/brcm,bcm2835-thermal.txt | 2 +- .../bindings/thermal/hisilicon-thermal.txt | 2 +- .../bindings/thermal/max77620_thermal.txt | 6 +- .../bindings/thermal/mediatek-thermal.txt | 2 +- .../thermal/nvidia,tegra124-soctherm.txt | 10 +- .../thermal/nvidia,tegra186-bpmp-thermal.txt | 2 +- .../bindings/thermal/qcom-spmi-temp-alarm.txt | 2 +- .../bindings/thermal/rockchip-thermal.txt | 2 +- .../bindings/thermal/tango-thermal.txt | 2 +- .../bindings/thermal/thermal-generic-adc.txt | 2 +- .../devicetree/bindings/thermal/thermal.txt | 586 ------------------ 24 files changed, 34 insertions(+), 616 deletions(-) delete mode 100644 Documentation/devicetree/bindings/thermal/thermal.txt