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[00/29] dt-bindings:iio: Another set of yaml conversions.

Message ID 20201011170749.243680-1-jic23@kernel.org (mailing list archive)
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Series dt-bindings:iio: Another set of yaml conversions. | expand

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Jonathan Cameron Oct. 11, 2020, 5:07 p.m. UTC 
From: Jonathan Cameron <Jonathan.Cameron@huawei.com>

This set mostly consists of low hanging fruit along the way to converting
all the existing IIO bindings.

A few questions scattered throughout though.  Whilst my skills in these
are hopefully improving it seems there are still plenty more corner
cases that I'm not sure how to handle!  I'm sure I'll have forgotten
something that I should already know as well.

I'm expecting some of these to bounce due to changes of addresses etc.
If I can't track down up to date emails, I'll switch them maintainer
to myself on the basis I'll be reviewing any incoming changes for these
anyway.

Thanks,

Jonathan

Jonathan Cameron (29):
  dt-bindings:iio:humidity:hdc100x Drop separate doc + add to
    trivial-devices
  dt-bindings:iio:humidity:htu21 Drop separate doc + add to
    trivial-devices
  dt-bindings:iio:humidity:st,hts221 yaml conversion.
  dt-bindings:iio:humidity:dht11 yaml conversion
  dt-bindings:iio:pressure:ms5637 Drop separate doc + add to
    trivial-devices
  dt-bindings:iio:pressure:murata,zpa2326 yaml conversion
  dt-bindings:iio:pressure:meas,ms5611 yaml conversion.
  dt-bindings:iio:pressure:hoperf,hp03 yaml conversion
  dt-bindings:iio:proximity:semtech,sx9500 yaml conversion.
  dt-bindings:iio:proximity:st,vl53l0x yaml conversion
  dt-bindings:iio:proximity:ams,as3935 yaml conversion
  dt-bindings:iio:dac:ti,dac5571 yaml conversion.
  dt-bindings:iio:dac:ti,dac7311 yaml conversion
  dt-bindings:iio:dac:ti,dac7512 yaml conversion
  dt-bindings:iio:dac:ti,dac7612 yaml conversion
  dt-bindings:iio:dac:ti,dac082s085 yaml conversion
  dt-bindings:iio:dac:adi,ad7303 yaml conversion
  dt-bindings:iio:dac:maxim,ds4424 yaml conversion
  dt-bindings:iio:dac:fsl,vf610-dac yaml conversion
  dt-bindings:iio:dac:microchip,mcp4725 yaml conversion
  dt-bindings:iio:dac:maxim,max5821 yaml conversion
  dt-bindings:iio:dac:nxp,lpc1850-dac yaml conversion.
  dt-bindings:iio:dac:adi,ad5758 yaml conversion
  dt-bindings:iio:temperature:melexis,mlx90614 yaml conversion
  dt-bindings:iio:temperature:melexis,mlx90632 conversion to yaml
  dt-bindings:iio:temperature:meas,tsys01 move to trivial-devices.yaml
  dt-bindings:iio:temperature:maxim,max31856 yaml conversion.
  dt-bindings:iio:temperature:maxim_thermocouple.txt to
    maxim,max31855k.yaml
  dt-bindings:iio:temperature:ti,tmp07 yaml conversion

 .../devicetree/bindings/iio/dac/ad5758.txt    |  83 -----------
 .../devicetree/bindings/iio/dac/ad7303.txt    |  23 ----
 .../bindings/iio/dac/adi,ad5758.yaml          | 129 ++++++++++++++++++
 .../bindings/iio/dac/adi,ad7303.yaml          |  51 +++++++
 .../devicetree/bindings/iio/dac/ds4424.txt    |  20 ---
 .../bindings/iio/dac/fsl,vf610-dac.yaml       |  55 ++++++++
 .../bindings/iio/dac/lpc1850-dac.txt          |  19 ---
 .../devicetree/bindings/iio/dac/max5821.txt   |  14 --
 .../bindings/iio/dac/maxim,ds4424.yaml        |  45 ++++++
 .../bindings/iio/dac/maxim,max5821.yaml       |  44 ++++++
 .../devicetree/bindings/iio/dac/mcp4725.txt   |  35 -----
 .../bindings/iio/dac/microchip,mcp4725.yaml   |  71 ++++++++++
 .../bindings/iio/dac/nxp,lpc1850-dac.yaml     |  58 ++++++++
 .../bindings/iio/dac/ti,dac082s085.yaml       |  58 ++++++++
 .../bindings/iio/dac/ti,dac5571.txt           |  24 ----
 .../bindings/iio/dac/ti,dac5571.yaml          |  52 +++++++
 .../bindings/iio/dac/ti,dac7311.txt           |  23 ----
 .../bindings/iio/dac/ti,dac7311.yaml          |  49 +++++++
 .../bindings/iio/dac/ti,dac7512.txt           |  20 ---
 .../bindings/iio/dac/ti,dac7512.yaml          |  42 ++++++
 .../bindings/iio/dac/ti,dac7612.txt           |  28 ----
 .../bindings/iio/dac/ti,dac7612.yaml          |  53 +++++++
 .../bindings/iio/dac/ti-dac082s085.txt        |  34 -----
 .../devicetree/bindings/iio/dac/vf610-dac.txt |  20 ---
 .../bindings/iio/humidity/dht11.txt           |  14 --
 .../bindings/iio/humidity/dht11.yaml          |  41 ++++++
 .../bindings/iio/humidity/hdc100x.txt         |  17 ---
 .../bindings/iio/humidity/hts221.txt          |  30 ----
 .../bindings/iio/humidity/htu21.txt           |  13 --
 .../bindings/iio/humidity/st,hts221.yaml      |  52 +++++++
 .../bindings/iio/pressure/hoperf,hp03.yaml    |  47 +++++++
 .../devicetree/bindings/iio/pressure/hp03.txt |  17 ---
 .../bindings/iio/pressure/meas,ms5611.yaml    |  57 ++++++++
 .../bindings/iio/pressure/ms5611.txt          |  19 ---
 .../bindings/iio/pressure/ms5637.txt          |  17 ---
 .../bindings/iio/pressure/murata,zpa2326.yaml |  62 +++++++++
 .../bindings/iio/pressure/zpa2326.txt         |  29 ----
 .../bindings/iio/proximity/ams,as3935.yaml    |  71 ++++++++++
 .../bindings/iio/proximity/as3935.txt         |  34 -----
 .../iio/proximity/semtech,sx9500.yaml         |  50 +++++++
 .../bindings/iio/proximity/st,vl53l0x.yaml    |  42 ++++++
 .../bindings/iio/proximity/sx9500.txt         |  23 ----
 .../bindings/iio/proximity/vl53l0x.txt        |  18 ---
 .../bindings/iio/temperature/max31856.txt     |  24 ----
 .../iio/temperature/maxim,max31855k.yaml      |  76 +++++++++++
 .../iio/temperature/maxim,max31856.yaml       |  54 ++++++++
 .../iio/temperature/maxim_thermocouple.txt    |  24 ----
 .../iio/temperature/melexis,mlx90614.yaml     |  51 +++++++
 .../iio/temperature/melexis,mlx90632.yaml     |  55 ++++++++
 .../bindings/iio/temperature/mlx90614.txt     |  24 ----
 .../bindings/iio/temperature/mlx90632.txt     |  28 ----
 .../bindings/iio/temperature/ti,tmp007.yaml   |  57 ++++++++
 .../bindings/iio/temperature/tmp007.txt       |  33 -----
 .../bindings/iio/temperature/tsys01.txt       |  19 ---
 .../devicetree/bindings/trivial-devices.yaml  |  24 ++++
 55 files changed, 1446 insertions(+), 726 deletions(-)
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/ad5758.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/ad7303.txt
 create mode 100644 Documentation/devicetree/bindings/iio/dac/adi,ad5758.yaml
 create mode 100644 Documentation/devicetree/bindings/iio/dac/adi,ad7303.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/ds4424.txt
 create mode 100644 Documentation/devicetree/bindings/iio/dac/fsl,vf610-dac.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/lpc1850-dac.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/max5821.txt
 create mode 100644 Documentation/devicetree/bindings/iio/dac/maxim,ds4424.yaml
 create mode 100644 Documentation/devicetree/bindings/iio/dac/maxim,max5821.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/mcp4725.txt
 create mode 100644 Documentation/devicetree/bindings/iio/dac/microchip,mcp4725.yaml
 create mode 100644 Documentation/devicetree/bindings/iio/dac/nxp,lpc1850-dac.yaml
 create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac082s085.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac5571.txt
 create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac5571.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7311.txt
 create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7311.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7512.txt
 create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7512.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7612.txt
 create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7612.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti-dac082s085.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/dac/vf610-dac.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/humidity/dht11.txt
 create mode 100644 Documentation/devicetree/bindings/iio/humidity/dht11.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/humidity/hdc100x.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/humidity/hts221.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/humidity/htu21.txt
 create mode 100644 Documentation/devicetree/bindings/iio/humidity/st,hts221.yaml
 create mode 100644 Documentation/devicetree/bindings/iio/pressure/hoperf,hp03.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/pressure/hp03.txt
 create mode 100644 Documentation/devicetree/bindings/iio/pressure/meas,ms5611.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/pressure/ms5611.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/pressure/ms5637.txt
 create mode 100644 Documentation/devicetree/bindings/iio/pressure/murata,zpa2326.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/pressure/zpa2326.txt
 create mode 100644 Documentation/devicetree/bindings/iio/proximity/ams,as3935.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/proximity/as3935.txt
 create mode 100644 Documentation/devicetree/bindings/iio/proximity/semtech,sx9500.yaml
 create mode 100644 Documentation/devicetree/bindings/iio/proximity/st,vl53l0x.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/proximity/sx9500.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/proximity/vl53l0x.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/temperature/max31856.txt
 create mode 100644 Documentation/devicetree/bindings/iio/temperature/maxim,max31855k.yaml
 create mode 100644 Documentation/devicetree/bindings/iio/temperature/maxim,max31856.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/temperature/maxim_thermocouple.txt
 create mode 100644 Documentation/devicetree/bindings/iio/temperature/melexis,mlx90614.yaml
 create mode 100644 Documentation/devicetree/bindings/iio/temperature/melexis,mlx90632.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/temperature/mlx90614.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/temperature/mlx90632.txt
 create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp007.yaml
 delete mode 100644 Documentation/devicetree/bindings/iio/temperature/tmp007.txt
 delete mode 100644 Documentation/devicetree/bindings/iio/temperature/tsys01.txt

Comments

Rob Herring Oct. 12, 2020, 1:20 p.m. UTC | #1 
On Sun, Oct 11, 2020 at 12:09 PM Jonathan Cameron <jic23@kernel.org> wrote:
>
> From: Jonathan Cameron <Jonathan.Cameron@huawei.com>
>
> This set mostly consists of low hanging fruit along the way to converting
> all the existing IIO bindings.
>
> A few questions scattered throughout though.  Whilst my skills in these
> are hopefully improving it seems there are still plenty more corner
> cases that I'm not sure how to handle!  I'm sure I'll have forgotten
> something that I should already know as well.
>
> I'm expecting some of these to bounce due to changes of addresses etc.
> If I can't track down up to date emails, I'll switch them maintainer
> to myself on the basis I'll be reviewing any incoming changes for these
> anyway.
>
> Thanks,
>
> Jonathan
>
> Jonathan Cameron (29):
>   dt-bindings:iio:humidity:hdc100x Drop separate doc + add to
>     trivial-devices
>   dt-bindings:iio:humidity:htu21 Drop separate doc + add to
>     trivial-devices
>   dt-bindings:iio:humidity:st,hts221 yaml conversion.
>   dt-bindings:iio:humidity:dht11 yaml conversion
>   dt-bindings:iio:pressure:ms5637 Drop separate doc + add to
>     trivial-devices
>   dt-bindings:iio:pressure:murata,zpa2326 yaml conversion
>   dt-bindings:iio:pressure:meas,ms5611 yaml conversion.
>   dt-bindings:iio:pressure:hoperf,hp03 yaml conversion
>   dt-bindings:iio:proximity:semtech,sx9500 yaml conversion.
>   dt-bindings:iio:proximity:st,vl53l0x yaml conversion
>   dt-bindings:iio:proximity:ams,as3935 yaml conversion
>   dt-bindings:iio:dac:ti,dac5571 yaml conversion.
>   dt-bindings:iio:dac:ti,dac7311 yaml conversion
>   dt-bindings:iio:dac:ti,dac7512 yaml conversion
>   dt-bindings:iio:dac:ti,dac7612 yaml conversion
>   dt-bindings:iio:dac:ti,dac082s085 yaml conversion
>   dt-bindings:iio:dac:adi,ad7303 yaml conversion
>   dt-bindings:iio:dac:maxim,ds4424 yaml conversion
>   dt-bindings:iio:dac:fsl,vf610-dac yaml conversion
>   dt-bindings:iio:dac:microchip,mcp4725 yaml conversion
>   dt-bindings:iio:dac:maxim,max5821 yaml conversion
>   dt-bindings:iio:dac:nxp,lpc1850-dac yaml conversion.
>   dt-bindings:iio:dac:adi,ad5758 yaml conversion
>   dt-bindings:iio:temperature:melexis,mlx90614 yaml conversion
>   dt-bindings:iio:temperature:melexis,mlx90632 conversion to yaml
>   dt-bindings:iio:temperature:meas,tsys01 move to trivial-devices.yaml
>   dt-bindings:iio:temperature:maxim,max31856 yaml conversion.
>   dt-bindings:iio:temperature:maxim_thermocouple.txt to
>     maxim,max31855k.yaml
>   dt-bindings:iio:temperature:ti,tmp07 yaml conversion

For the series,

Reviewed-by: Rob Herring <robh@kernel.org>

Though, you didn't Cc the DT list so no semi-automated checks will run
which would have pointed out the problem Lars-Peter did.

Rob
Jonathan Cameron Oct. 12, 2020, 2:33 p.m. UTC | #2 
On Mon, 12 Oct 2020 08:20:12 -0500
Rob Herring <robh+dt@kernel.org> wrote:

> On Sun, Oct 11, 2020 at 12:09 PM Jonathan Cameron <jic23@kernel.org> wrote:
> >
> > From: Jonathan Cameron <Jonathan.Cameron@huawei.com>
> >
> > This set mostly consists of low hanging fruit along the way to converting
> > all the existing IIO bindings.
> >
> > A few questions scattered throughout though.  Whilst my skills in these
> > are hopefully improving it seems there are still plenty more corner
> > cases that I'm not sure how to handle!  I'm sure I'll have forgotten
> > something that I should already know as well.
> >
> > I'm expecting some of these to bounce due to changes of addresses etc.
> > If I can't track down up to date emails, I'll switch them maintainer
> > to myself on the basis I'll be reviewing any incoming changes for these
> > anyway.
> >
> > Thanks,
> >
> > Jonathan
> >
> > Jonathan Cameron (29):
> >   dt-bindings:iio:humidity:hdc100x Drop separate doc + add to
> >     trivial-devices
> >   dt-bindings:iio:humidity:htu21 Drop separate doc + add to
> >     trivial-devices
> >   dt-bindings:iio:humidity:st,hts221 yaml conversion.
> >   dt-bindings:iio:humidity:dht11 yaml conversion
> >   dt-bindings:iio:pressure:ms5637 Drop separate doc + add to
> >     trivial-devices
> >   dt-bindings:iio:pressure:murata,zpa2326 yaml conversion
> >   dt-bindings:iio:pressure:meas,ms5611 yaml conversion.
> >   dt-bindings:iio:pressure:hoperf,hp03 yaml conversion
> >   dt-bindings:iio:proximity:semtech,sx9500 yaml conversion.
> >   dt-bindings:iio:proximity:st,vl53l0x yaml conversion
> >   dt-bindings:iio:proximity:ams,as3935 yaml conversion
> >   dt-bindings:iio:dac:ti,dac5571 yaml conversion.
> >   dt-bindings:iio:dac:ti,dac7311 yaml conversion
> >   dt-bindings:iio:dac:ti,dac7512 yaml conversion
> >   dt-bindings:iio:dac:ti,dac7612 yaml conversion
> >   dt-bindings:iio:dac:ti,dac082s085 yaml conversion
> >   dt-bindings:iio:dac:adi,ad7303 yaml conversion
> >   dt-bindings:iio:dac:maxim,ds4424 yaml conversion
> >   dt-bindings:iio:dac:fsl,vf610-dac yaml conversion
> >   dt-bindings:iio:dac:microchip,mcp4725 yaml conversion
> >   dt-bindings:iio:dac:maxim,max5821 yaml conversion
> >   dt-bindings:iio:dac:nxp,lpc1850-dac yaml conversion.
> >   dt-bindings:iio:dac:adi,ad5758 yaml conversion
> >   dt-bindings:iio:temperature:melexis,mlx90614 yaml conversion
> >   dt-bindings:iio:temperature:melexis,mlx90632 conversion to yaml
> >   dt-bindings:iio:temperature:meas,tsys01 move to trivial-devices.yaml
> >   dt-bindings:iio:temperature:maxim,max31856 yaml conversion.
> >   dt-bindings:iio:temperature:maxim_thermocouple.txt to
> >     maxim,max31855k.yaml
> >   dt-bindings:iio:temperature:ti,tmp07 yaml conversion  
> 
> For the series,
> 
> Reviewed-by: Rob Herring <robh@kernel.org>
> 
> Though, you didn't Cc the DT list so no semi-automated checks will run
> which would have pointed out the problem Lars-Peter did.

Gah. Sorry about that.  I'll pick up acks and do a v2 which I'll
make sure goes to the list, as we aren't in a particular rush for these.

Thanks,

Jonathan

> 
> Rob