| Message ID | 20180128232919.12639-12-embed3d@gmail.com (mailing list archive) |
|---|---|
| State | New, archived |
| Headers | show |
Hi, On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote: > As we have gained the support for the thermal sensor in H3 and H5, > we can now add its device nodes to the device tree. The H3 and H5 share > most of its compatible. The compatible and the thermal sensor cells > will be added in an additional patch per device. > > Signed-off-by: Philipp Rossak <embed3d@gmail.com> > --- > arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++ > 1 file changed, 9 insertions(+) > > diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi-h3-h5.dtsi > index 7a83b15225c7..413c789b588d 100644 > --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi > +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi > @@ -426,6 +426,15 @@ > }; > }; > > + ths: thermal-sensor@1c25000 { > + reg = <0x01c25000 0x100>; The size is 0x400 Maxime
On 29.01.2018 10:49, Maxime Ripard wrote: > Hi, > > On Mon, Jan 29, 2018 at 12:29:14AM +0100, Philipp Rossak wrote: >> As we have gained the support for the thermal sensor in H3 and H5, >> we can now add its device nodes to the device tree. The H3 and H5 share >> most of its compatible. The compatible and the thermal sensor cells >> will be added in an additional patch per device. >> >> Signed-off-by: Philipp Rossak <embed3d@gmail.com> >> --- >> arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++ >> 1 file changed, 9 insertions(+) >> >> diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> index 7a83b15225c7..413c789b588d 100644 >> --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi >> @@ -426,6 +426,15 @@ >> }; >> }; >> >> + ths: thermal-sensor@1c25000 { >> + reg = <0x01c25000 0x100>; > > The size is 0x400 > > Maxime > Ok, I will fix this. Philipp -- To unsubscribe from this list: send the line "unsubscribe linux-iio" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
diff --git a/arch/arm/boot/dts/sunxi-h3-h5.dtsi b/arch/arm/boot/dts/sunxi-h3-h5.dtsi index 7a83b15225c7..413c789b588d 100644 --- a/arch/arm/boot/dts/sunxi-h3-h5.dtsi +++ b/arch/arm/boot/dts/sunxi-h3-h5.dtsi @@ -426,6 +426,15 @@ }; }; + ths: thermal-sensor@1c25000 { + reg = <0x01c25000 0x100>; + interrupts = <GIC_SPI 31 IRQ_TYPE_LEVEL_HIGH>; + clocks = <&ccu CLK_BUS_THS>, <&ccu CLK_THS>; + clock-names = "bus", "mod"; + resets = <&ccu RST_BUS_THS>; + #io-channel-cells = <0>; + }; + timer@1c20c00 { compatible = "allwinner,sun4i-a10-timer"; reg = <0x01c20c00 0xa0>;
As we have gained the support for the thermal sensor in H3 and H5, we can now add its device nodes to the device tree. The H3 and H5 share most of its compatible. The compatible and the thermal sensor cells will be added in an additional patch per device. Signed-off-by: Philipp Rossak <embed3d@gmail.com> --- arch/arm/boot/dts/sunxi-h3-h5.dtsi | 9 +++++++++ 1 file changed, 9 insertions(+)