| Message ID | e6e56cd513625c76435f444f13c640f9556fb2bc.1684089997.git.anupnewsmail@gmail.com (mailing list archive) |
|---|---|
| State | Superseded |
| Headers | show |
| Series | Add dt-binding support for ti tmp006 | expand |
On 14/05/2023 21:01, Anup Sharma wrote: > Add devicetree binding document for TMP006, IR thermopile sensor. > > Signed-off-by: Anup Sharma <anupnewsmail@gmail.com> > Missing --- > Changes: > V1 -> V2: Removed redundant dt-binding from subject. > Added supply information. > Adhere to the generic node name. > --- Best regards, Krzysztof
On Mon, 15 May 2023 00:31:59 +0530, Anup Sharma wrote: > Add devicetree binding document for TMP006, IR thermopile sensor. > > Signed-off-by: Anup Sharma <anupnewsmail@gmail.com> > > Changes: > V1 -> V2: Removed redundant dt-binding from subject. > Added supply information. > Adhere to the generic node name. > --- > .../bindings/iio/temperature/ti,tmp006.yaml | 42 +++++++++++++++++++ > 1 file changed, 42 insertions(+) > create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml > My bot found errors running 'make DT_CHECKER_FLAGS=-m dt_binding_check' on your patch (DT_CHECKER_FLAGS is new in v5.13): yamllint warnings/errors: dtschema/dtc warnings/errors: Error: Documentation/devicetree/bindings/iio/temperature/ti,tmp006.example.dts:25.13-14 syntax error FATAL ERROR: Unable to parse input tree make[1]: *** [scripts/Makefile.lib:419: Documentation/devicetree/bindings/iio/temperature/ti,tmp006.example.dtb] Error 1 make[1]: *** Waiting for unfinished jobs.... make: *** [Makefile:1512: dt_binding_check] Error 2 See https://patchwork.ozlabs.org/patch/1781058 This check can fail if there are any dependencies. The base for a patch series is generally the most recent rc1. If you already ran 'make dt_binding_check' and didn't see the above error(s), then make sure 'yamllint' is installed and dt-schema is up to date: pip3 install dtschema --upgrade Please check and re-submit.
diff --git a/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml new file mode 100644 index 000000000000..4915c3e2d721 --- /dev/null +++ b/Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml @@ -0,0 +1,42 @@ +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/iio/temperature/ti,tmp006.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: TI TMP006 IR thermopile sensor + +maintainers: + - Peter Meerwald <pmeerw@pmeerw.net> + +description: | + TI TMP006 - Infrared Thermopile Sensor in Chip-Scale Package. + https://cdn.sparkfun.com/datasheets/Sensors/Temp/tmp006.pdf + +properties: + compatible: + const: ti,tmp006 + + reg: + maxItems: 1 + + vdd-supply: + description: provide VDD power to the sensor. + +required: + - compatible + - reg + +additionalProperties: false + +examples: + - | + i2c { + #address-cells = <1>; + #size-cells = <0>; + temperature-sensor@40 { + compatible = "ti,tmp006"; + reg = <0x40>; + vdd-supply = <&ldo4_reg> + }; + };
Add devicetree binding document for TMP006, IR thermopile sensor. Signed-off-by: Anup Sharma <anupnewsmail@gmail.com> Changes: V1 -> V2: Removed redundant dt-binding from subject. Added supply information. Adhere to the generic node name. --- .../bindings/iio/temperature/ti,tmp006.yaml | 42 +++++++++++++++++++ 1 file changed, 42 insertions(+) create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml