Message ID | 1584363301-15858-1-git-send-email-shenyang39@huawei.com (mailing list archive) |
---|---|
Headers | show |
Series | thermal: Add HiSilicon Kunpeng thermal driver and Maintainers | expand |
On 2020/3/16 20:54, Yang Shen wrote: > Add HiSilicon Kunpeng thermal driver and Maintainers. > > Changelog: > v2: > * fix sizeof(* tdev) and sizeof(* tdev->tsensor) > > Yang Shen (2): > thermal: Add HiSilicon Kunpeng thermal driver > MAINTAINERS: Add maintainers for kunpeng thermal > > MAINTAINERS | 7 ++ > drivers/thermal/Kconfig | 8 ++ > drivers/thermal/Makefile | 1 + > drivers/thermal/kunpeng_thermal.c | 219 ++++++++++++++++++++++++++++++++++++++ > 4 files changed, 235 insertions(+) > create mode 100644 drivers/thermal/kunpeng_thermal.c > > -- > 2.7.4 > > > . > Any comments?
On 20/03/2020 10:34, Yang Shen wrote: > > > On 2020/3/16 20:54, Yang Shen wrote: >> Add HiSilicon Kunpeng thermal driver and Maintainers. >> >> Changelog: >> v2: >> * fix sizeof(* tdev) and sizeof(* tdev->tsensor) >> >> Yang Shen (2): >> thermal: Add HiSilicon Kunpeng thermal driver >> MAINTAINERS: Add maintainers for kunpeng thermal >> >> MAINTAINERS | 7 ++ >> drivers/thermal/Kconfig | 8 ++ >> drivers/thermal/Makefile | 1 + >> drivers/thermal/kunpeng_thermal.c | 219 ++++++++++++++++++++++++++++++++++++++ >> 4 files changed, 235 insertions(+) >> create mode 100644 drivers/thermal/kunpeng_thermal.c >> >> -- >> 2.7.4 >> >> >> . >> > > Any comments? Yes. But for the moment, we are busy preparing the merge window.