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[0/3] Thermal extensions for flexibility in cooling device bindings

Message ID 20191216140622.25467-1-lukasz.luba@arm.com
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Series Thermal extensions for flexibility in cooling device bindings | expand

Message

Lukasz Luba Dec. 16, 2019, 2:06 p.m. UTC
From: Lukasz Luba <lukasz.luba@arm.com>

Hi all,

This patch set adds extensions to existing thermal zones and cooling devices
binding. Currently they are pinned using static definitions e.g. DT cooling
maps. These changes enable userspace like trusted middleware to change the
layout of cooling maps unbinding and binding the cooling devices.
It might be helpful for drivers loaded as a modules. They can be added to
existing thermal zones to take part of the power split.
It is based on the current work in thermal branch thermal/linux-next
https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next

Regards,
Lukasz Luba

Lukasz Luba (3):
  docs: thermal: Add bind, unbind information together with trip point
  thermal: Make cooling device trip point writable from sysfs
  thermal: Add sysfs binding for cooling device and thermal zone

 .../driver-api/thermal/sysfs-api.rst          | 30 +++++++-
 drivers/thermal/thermal_core.c                |  3 +-
 drivers/thermal/thermal_core.h                |  2 +
 drivers/thermal/thermal_sysfs.c               | 77 +++++++++++++++++++
 4 files changed, 109 insertions(+), 3 deletions(-)

Comments

Daniel Lezcano March 13, 2020, 1:33 p.m. UTC | #1
Hi Lukasz,

On 16/12/2019 15:06, lukasz.luba@arm.com wrote:
> From: Lukasz Luba <lukasz.luba@arm.com>
> 
> Hi all,
> 
> This patch set adds extensions to existing thermal zones and cooling devices
> binding. Currently they are pinned using static definitions e.g. DT cooling
> maps. These changes enable userspace like trusted middleware to change the
> layout of cooling maps unbinding and binding the cooling devices.
> It might be helpful for drivers loaded as a modules. They can be added to
> existing thermal zones to take part of the power split.
> It is based on the current work in thermal branch thermal/linux-next
> https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next

I've been keeping this series out of the previous merge because it did
not raise any comments and we are touching the sysfs.

For this release, I still don't know what to do with it.

Anyone a comment on this series? Rui ?

> Lukasz Luba (3):
>   docs: thermal: Add bind, unbind information together with trip point
>   thermal: Make cooling device trip point writable from sysfs
>   thermal: Add sysfs binding for cooling device and thermal zone
> 
>  .../driver-api/thermal/sysfs-api.rst          | 30 +++++++-
>  drivers/thermal/thermal_core.c                |  3 +-
>  drivers/thermal/thermal_core.h                |  2 +
>  drivers/thermal/thermal_sysfs.c               | 77 +++++++++++++++++++
>  4 files changed, 109 insertions(+), 3 deletions(-)
>
Lukasz Luba March 13, 2020, 3:28 p.m. UTC | #2
Hi Daniel,

On 3/13/20 1:33 PM, Daniel Lezcano wrote:
> 
> Hi Lukasz,
> 
> On 16/12/2019 15:06, lukasz.luba@arm.com wrote:
>> From: Lukasz Luba <lukasz.luba@arm.com>
>>
>> Hi all,
>>
>> This patch set adds extensions to existing thermal zones and cooling devices
>> binding. Currently they are pinned using static definitions e.g. DT cooling
>> maps. These changes enable userspace like trusted middleware to change the
>> layout of cooling maps unbinding and binding the cooling devices.
>> It might be helpful for drivers loaded as a modules. They can be added to
>> existing thermal zones to take part of the power split.
>> It is based on the current work in thermal branch thermal/linux-next
>> https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next
> 
> I've been keeping this series out of the previous merge because it did
> not raise any comments and we are touching the sysfs.
> 
> For this release, I still don't know what to do with it.

Thank you for bringing this back.

> 
> Anyone a comment on this series? Rui ?
> 

Regards,
Lukasz