From patchwork Mon Dec 16 14:06:19 2019 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Lukasz Luba X-Patchwork-Id: 11294289 Return-Path: Received: from mail.kernel.org (pdx-korg-mail-1.web.codeaurora.org [172.30.200.123]) by pdx-korg-patchwork-2.web.codeaurora.org (Postfix) with ESMTP id AE44F930 for ; Mon, 16 Dec 2019 14:06:45 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id 8B768206EC for ; Mon, 16 Dec 2019 14:06:45 +0000 (UTC) Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1727981AbfLPOGp (ORCPT ); Mon, 16 Dec 2019 09:06:45 -0500 Received: from foss.arm.com ([217.140.110.172]:56554 "EHLO foss.arm.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1727952AbfLPOGo (ORCPT ); Mon, 16 Dec 2019 09:06:44 -0500 Received: from usa-sjc-imap-foss1.foss.arm.com (unknown [10.121.207.14]) by usa-sjc-mx-foss1.foss.arm.com (Postfix) with ESMTP id 294CD1FB; Mon, 16 Dec 2019 06:06:44 -0800 (PST) Received: from e123648.arm.com (unknown [10.37.12.145]) by usa-sjc-imap-foss1.foss.arm.com (Postfix) with ESMTPA id C27733F718; Mon, 16 Dec 2019 06:06:41 -0800 (PST) From: lukasz.luba@arm.com To: linux-kernel@vger.kernel.org, rui.zhang@intel.com, daniel.lezcano@linaro.org, linux-pm@vger.kernel.org, linux-doc@vger.kernel.org Cc: amit.kucheria@verdurent.com, corbet@lwn.net, lukasz.luba@arm.com, dietmar.eggemann@arm.com Subject: [PATCH 0/3] Thermal extensions for flexibility in cooling device bindings Date: Mon, 16 Dec 2019 14:06:19 +0000 Message-Id: <20191216140622.25467-1-lukasz.luba@arm.com> X-Mailer: git-send-email 2.17.1 Sender: linux-pm-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org From: Lukasz Luba Hi all, This patch set adds extensions to existing thermal zones and cooling devices binding. Currently they are pinned using static definitions e.g. DT cooling maps. These changes enable userspace like trusted middleware to change the layout of cooling maps unbinding and binding the cooling devices. It might be helpful for drivers loaded as a modules. They can be added to existing thermal zones to take part of the power split. It is based on the current work in thermal branch thermal/linux-next https://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git/log/?h=thermal/linux-next Regards, Lukasz Luba Lukasz Luba (3): docs: thermal: Add bind, unbind information together with trip point thermal: Make cooling device trip point writable from sysfs thermal: Add sysfs binding for cooling device and thermal zone .../driver-api/thermal/sysfs-api.rst | 30 +++++++- drivers/thermal/thermal_core.c | 3 +- drivers/thermal/thermal_core.h | 2 + drivers/thermal/thermal_sysfs.c | 77 +++++++++++++++++++ 4 files changed, 109 insertions(+), 3 deletions(-)