From patchwork Mon Feb 24 07:20:24 2020 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Amit Kucheria X-Patchwork-Id: 11399451 Return-Path: Received: from mail.kernel.org (pdx-korg-mail-1.web.codeaurora.org [172.30.200.123]) by pdx-korg-patchwork-2.web.codeaurora.org (Postfix) with ESMTP id B5391924 for ; Mon, 24 Feb 2020 07:20:33 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id 8C57820714 for ; Mon, 24 Feb 2020 07:20:33 +0000 (UTC) Authentication-Results: mail.kernel.org; dkim=pass (2048-bit key) header.d=linaro.org header.i=@linaro.org header.b="IZOmGdk3" Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1725792AbgBXHUc (ORCPT ); Mon, 24 Feb 2020 02:20:32 -0500 Received: from mail-pj1-f66.google.com ([209.85.216.66]:39018 "EHLO mail-pj1-f66.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1726452AbgBXHUc (ORCPT ); Mon, 24 Feb 2020 02:20:32 -0500 Received: by mail-pj1-f66.google.com with SMTP id e9so3765456pjr.4 for ; Sun, 23 Feb 2020 23:20:32 -0800 (PST) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:mime-version :content-transfer-encoding; bh=Pp4OJKlkTUP/JKWBsfGX5IGPygvYeWUCLyYPIlFud78=; b=IZOmGdk3jvbALg78q+Ogcc/os8rR7kNvGziTpMuqqxVshDSb7T0/n5kLOgxiYvrD6L FsaIT/opnfyAbJqctDkl/nSg+/poz+r/XpgrWrCj0upAr29DF+L7hRl6W4XhxLudNiZy mQLaah2Y3ds1XjtYfOSm9hQLGA8Fp+1cwAg+ZoVnIAJkSf+i0RN6yxwnEfj9WAoj1QP9 3cCkaSDjwRYAy9gTaNUU81Rp+oHJn4ppYGFivh0T0knTRTQnKpNsuGoto8fVCwI2NNKS N78wCh30Yi+vNrdi6ujUkU1bDTZ7+FjVlQRwtYpE3nNUngzpsG5Jp9vpFUfwl1Z8H12w 8FnQ== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:mime-version :content-transfer-encoding; bh=Pp4OJKlkTUP/JKWBsfGX5IGPygvYeWUCLyYPIlFud78=; b=F4ezeEJFhzh+7H4pCxnK+jh9Zki0uS96WIW2haY1dDfMGgsHg1nNpg+Ni42jKymDJ/ /zsVcZJwMzVNFhEEy6vBI5ynr+KVrUeIS2AWLl1/mppo1lJAlNMzsw7zva432NoaUPdS Z3StJQsvDoyO/Buj3Of5W2v1UKxBgVTJd+Nlp7bO4DlAubyarW6r4N4xPWAdjaARD9UR yc53PQ1PPUp66ceJf1mQY1s67s1J/+uRm59ahW5nQzC7czUSDz3YAzwiFkpgVXJHWHfs 6zAzCR+im189TSgMT1cwH01oCEfKBbDqa/s2wulunDK2RXyyFvc2WuY2C7EOy99NdwQr V9eg== X-Gm-Message-State: APjAAAX1aEguY9QxWoKL9WXWX9fDbf2Tp5KCTLL3qj+XYip5+oJ5S9o5 KQQp8JNPu3DWQhDmcVezOSFLmQ== X-Google-Smtp-Source: APXvYqy3jXvJE7VyZtpKH6rIFhGNbXxpgKh1xaZZt9uPKJ3Z6xLRb6oa+wLz4XgROfrFkfGKGYes3Q== X-Received: by 2002:a17:90b:4396:: with SMTP id in22mr18082228pjb.83.1582528831644; Sun, 23 Feb 2020 23:20:31 -0800 (PST) Received: from localhost ([45.127.44.57]) by smtp.gmail.com with ESMTPSA id p23sm11452767pgn.92.2020.02.23.23.20.30 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Sun, 23 Feb 2020 23:20:30 -0800 (PST) From: Amit Kucheria To: linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org, swboyd@chromium.org, mka@chromium.org, daniel.lezcano@linaro.org, Amit Kucheria , Zhang Rui Cc: devicetree@vger.kernel.org, linux-pm@vger.kernel.org Subject: [RFC PATCH v5 0/3] Convert thermal bindings to yaml Date: Mon, 24 Feb 2020 12:50:24 +0530 Message-Id: X-Mailer: git-send-email 2.20.1 MIME-Version: 1.0 Sender: linux-pm-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org Hi all, Here is a series splitting up the thermal bindings into 3 separate bindings in YAML, one each of the sensor, cooling-device and the thermal zones. Since I was learning about YAML parsers while creating these bindings, there are bound to be some issues. I have to add that the bindings as they exist today, don't really follow the "describe the hardware" model of devicetree. e.g. the entire thermal-zone binding is a software abstraction to tie arbitrary, board-specific trip points to cooling strategies. This doesn't fit well into the model where the same SoC in two different form-factor devices e.g. mobile and laptop, will have fairly different thermal profiles and might benefit from different trip points and mitigation heuristics. I've started some experiments with moving the thermal zone data to a board-specific platform data that is used to initialise a "thermal zone driver". In any case, if we ever move down that path, it'll probably end up being v2 of the binding, so this series is still relevant. Please help review. Regards, Amit Amit Kucheria (3): dt-bindings: thermal: Add yaml bindings for thermal sensors dt-bindings: thermal: Add yaml bindings for thermal cooling-devices dt-bindings: thermal: Add yaml bindings for thermal zones .../thermal/thermal-cooling-devices.yaml | 114 +++++++ .../bindings/thermal/thermal-sensor.yaml | 70 ++++ .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ 3 files changed, 486 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml