@@ -38,6 +38,7 @@
/* common data structures */
struct ti_thermal_data {
struct thermal_zone_device *ti_thermal;
+ struct thermal_zone_device *pcb_tz;
struct thermal_cooling_device *cool_dev;
struct ti_bandgap *bgp;
enum thermal_device_mode mode;
@@ -77,10 +78,12 @@ static inline int ti_thermal_hotspot_temperature(int t, int s, int c)
static inline int ti_thermal_get_temp(struct thermal_zone_device *thermal,
unsigned long *temp)
{
+ struct thermal_zone_device *pcb_tz = NULL;
struct ti_thermal_data *data = thermal->devdata;
struct ti_bandgap *bgp;
const struct ti_temp_sensor *s;
- int ret, tmp, pcb_temp, slope, constant;
+ int ret, tmp, slope, constant;
+ unsigned long pcb_temp;
if (!data)
return 0;
@@ -92,16 +95,22 @@ static inline int ti_thermal_get_temp(struct thermal_zone_device *thermal,
if (ret)
return ret;
- pcb_temp = 0;
- /* TODO: Introduce pcb temperature lookup */
+ /* Default constants */
+ slope = s->slope;
+ constant = s->constant;
+
+ pcb_tz = data->pcb_tz;
/* In case pcb zone is available, use the extrapolation rule with it */
- if (pcb_temp) {
- tmp -= pcb_temp;
- slope = s->slope_pcb;
- constant = s->constant_pcb;
- } else {
- slope = s->slope;
- constant = s->constant;
+ if (!IS_ERR_OR_NULL(pcb_tz)) {
+ ret = thermal_zone_get_temp(pcb_tz, &pcb_temp);
+ if (!ret) {
+ tmp -= pcb_temp; /* got a valid PCB temp */
+ slope = s->slope_pcb;
+ constant = s->constant_pcb;
+ } else {
+ dev_err(bgp->dev,
+ "Failed to read PCB state. Using defaults\n");
+ }
}
*temp = ti_thermal_hotspot_temperature(tmp, slope, constant);
@@ -273,6 +282,7 @@ static struct ti_thermal_data
data->sensor_id = id;
data->bgp = bgp;
data->mode = THERMAL_DEVICE_ENABLED;
+ data->pcb_tz = thermal_zone_get_zone_by_name("pcb");
INIT_WORK(&data->thermal_wq, ti_thermal_work);
return data;
For boards that provide a PCB sensor close to SoC junction temperature, it is possible to remove the cumulative heat reported by the SoC temperature sensor. This patch changes the extrapolation computation to consider an external sensor in the extrapolation equations. Cc: Zhang Rui <rui.zhang@intel.com> Cc: linux-pm@vger.kernel.org Cc: linux-kernel@vger.kernel.org Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com> --- drivers/thermal/ti-soc-thermal/ti-thermal-common.c | 30 ++++++++++++++-------- 1 file changed, 20 insertions(+), 10 deletions(-) --- This patch was added to the staging tree post 3.10-rc1 but is not included after the move from staging to thermal. This is because the thermal tree is based of 3.10-rc1 and not staging/next or linux-next/master. For your reference: https://git.kernel.org/cgit/linux/kernel/git/gregkh/staging.git/commit/drivers/staging/ti-soc-thermal?h=staging-next&id=a85fd2c8fdefa0d504882f0e110d68e564903fcb