From patchwork Mon Feb 9 21:34:02 2015 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Eduardo Valentin X-Patchwork-Id: 5804381 Return-Path: X-Original-To: patchwork-linux-pm@patchwork.kernel.org Delivered-To: patchwork-parsemail@patchwork2.web.kernel.org Received: from mail.kernel.org (mail.kernel.org [198.145.29.136]) by patchwork2.web.kernel.org (Postfix) with ESMTP id 7BD7ABF440 for ; Tue, 10 Feb 2015 00:41:05 +0000 (UTC) Received: from mail.kernel.org (localhost [127.0.0.1]) by mail.kernel.org (Postfix) with ESMTP id 7B37A20125 for ; Tue, 10 Feb 2015 00:41:04 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id 7C5142011D for ; Tue, 10 Feb 2015 00:41:03 +0000 (UTC) Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S933722AbbBJAht (ORCPT ); Mon, 9 Feb 2015 19:37:49 -0500 Received: from mail-pd0-f172.google.com ([209.85.192.172]:38234 "EHLO mail-pd0-f172.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S932686AbbBJAhr (ORCPT ); Mon, 9 Feb 2015 19:37:47 -0500 Received: by pdbft15 with SMTP id ft15so34962444pdb.5; Mon, 09 Feb 2015 16:37:46 -0800 (PST) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=from:to:cc:subject:date:message-id:in-reply-to:references; bh=1uXsyhrFtvlT1F6BV36O8n2vb6rdxJrABxjN9bl2lOU=; b=z1e2o09awUum6PVl6/b64Ocax08fylyIGJWJgKAK6nLKQ0p9hpvGkgGrokPmKPCLLQ ho+Ii3Khm8QOL5acUQUXV9Mpq7arw3UuSke8Tx70qGvtryQSjVBLsbosB+nzeP660KtH zCyiAg45pTvBrY9rBs2EpOUaS/spxWnizYjtDoSBYSOLriOhBnEXBcPS5vQb8ESUQaMO bKxSBl0Tr9ufL7UprKJEjbScqwfHvVpg7FNUi5F48qDtJG1s0yXu4ALUJ4X+A9AZk55f d3Hp8CMFTQyaSOhqVif5feSpRIgfQU8buxDYHf84cA0oUcJ0pFUYc71XHor/lO4E5my/ U2oQ== X-Received: by 10.70.49.99 with SMTP id t3mr33381127pdn.105.1423528666585; Mon, 09 Feb 2015 16:37:46 -0800 (PST) Received: from localhost (amazon.gigabitethernet4-0-6.asr1.snv2.gblx.net. [64.211.110.86]) by mx.google.com with ESMTPSA id yo10sm17618756pab.35.2015.02.09.16.37.41 (version=TLSv1.2 cipher=AES128-GCM-SHA256 bits=128/128); Mon, 09 Feb 2015 16:37:45 -0800 (PST) From: Eduardo Valentin To: Rui Zhang , ezequiel.garcia@free-electrons.com, amit.kachhap@linaro.org, viresh.kumar@linaro.org, amit.daniel@samsung.com, hongbo.zhang@linaro.com, andrew@lunn.ch, durgadoss.r@intel.com, peter@piie.net, shawn.guo@linaro.org, aaron.lu@intel.com, caesar.wang@rock-chips.com, b.zolnierkie@samsung.com, l.majewski@samsung.com, vincenzo.frascino@st.com, mperttunen@nvidia.com, mikko.perttunen@kapsi.fi, srinivas.pandruvada@linux.intel.com, jacob.jun.pan@linux.intel.com, bcousson@baylibre.com Cc: LKML , Linux PM , Eduardo Valentin Subject: [PATCH RFC 01/12] Documentation: Introduce Linux Kernel Thermal Framework DocBook Date: Mon, 9 Feb 2015 17:34:02 -0400 Message-Id: <1423517653-11359-2-git-send-email-edubezval@gmail.com> X-Mailer: git-send-email 2.1.3 In-Reply-To: <1423517653-11359-1-git-send-email-edubezval@gmail.com> References: <1423517653-11359-1-git-send-email-edubezval@gmail.com> Sender: linux-pm-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org X-Spam-Status: No, score=-5.2 required=5.0 tests=BAYES_00, DATE_IN_PAST_03_06, DKIM_ADSP_CUSTOM_MED,DKIM_SIGNED,FREEMAIL_FROM,RCVD_IN_DNSWL_HI, T_DKIM_INVALID, T_RP_MATCHES_RCVD, UNPARSEABLE_RELAY autolearn=unavailable version=3.3.1 X-Spam-Checker-Version: SpamAssassin 3.3.1 (2010-03-16) on mail.kernel.org X-Virus-Scanned: ClamAV using ClamSMTP This patch adds a book about the Linux Kernel Thermal Framework. In this change, only a brief introduction is added together with Makefile changes. Signed-off-by: Eduardo Valentin --- Documentation/DocBook/Makefile | 3 +- Documentation/DocBook/thermal.tmpl | 88 ++++++++++++++++++++++++++++++++++++++ 2 files changed, 90 insertions(+), 1 deletion(-) create mode 100644 Documentation/DocBook/thermal.tmpl diff --git a/Documentation/DocBook/Makefile b/Documentation/DocBook/Makefile index 9c7d92d..8163508 100644 --- a/Documentation/DocBook/Makefile +++ b/Documentation/DocBook/Makefile @@ -15,7 +15,8 @@ DOCBOOKS := z8530book.xml device-drivers.xml \ 80211.xml debugobjects.xml sh.xml regulator.xml \ alsa-driver-api.xml writing-an-alsa-driver.xml \ tracepoint.xml drm.xml media_api.xml w1.xml \ - writing_musb_glue_layer.xml crypto-API.xml + writing_musb_glue_layer.xml crypto-API.xml thermal.xml + writing_musb_glue_layer.xml include Documentation/DocBook/media/Makefile diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl new file mode 100644 index 0000000..f8fb8a2 --- /dev/null +++ b/Documentation/DocBook/thermal.tmpl @@ -0,0 +1,88 @@ + + + + + + Linux Kernel Thermal Framework API + + + + Eduardo + Valentin + +
+ evalenti@kernel.org +
+ + + + + + 2008-2014 + Eduardo Valentin + Sujith Thomas + Zhang Rui + + + + This documentation is free software; you can redistribute + it and/or modify it under the terms of the GNU General Public + License version 2 as published by the Free Software Foundation. + + + + This program is distributed in the hope that it will be + useful, but WITHOUT ANY WARRANTY; without even the implied + warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. + See the GNU General Public License for more details. + + + + For more details see the file COPYING in the source + distribution of Linux. + + + + + + + + Introduction + Thermal management is any method or technique implied to + mitigate emergencies caused by operating devices within + unsupported temperatures. The challenge consists of designing a + product keeping the junction temperature of the IC components. + The operating temperature of IC components used on products must + operate within their design limits. Besides, temperature towards + device enclosure must be in a comfort level for the user. + Therefore, thermal management, by the time of this writing, + starts in very early device design phase. Managing thermal may + involve different disciplines, at different stages, such as + temperature monitoring, floorplanning, microarchitectural + techniques, compiler techniques, OS techniques, liquid cooling, + and thermal reliability or security. This document covers what + the Linux Kernel Thermal Framework provides as abstraction to + users with respect to thermal management. + + One of the first proposals to provide a solution to cover + the thermal problem appears in the Advanced Configuration and + Power Interface (ACPI) specification. ACPI provides an open + standard for device configuration and power management by the + operating system. However, several computing devices which may + have thermal issues in the market disregard the ACPI standard. + Therefore, the Linux Kernel Thermal Framework has been designed + to serve as abstraction for ACPI and non-ACPI systems. The core + concepts applies in both types of systems. + + The Linux Kernel Thermal Framework has a design which + represents the different thermal constraints found in an + end-products. The thermal constraints exist to serve different + purposes. There two major types of thermal constraints. The + first is related to components junction temperature. The second + is related to the level of comfort while end users are handling + devices. + + + +