| Message ID | 20191203093704.7037-4-daniel.lezcano@linaro.org (mailing list archive) |
|---|---|
| State | Superseded, archived |
| Headers | show |
| Series | [V3,1/4] thermal/drivers/Kconfig: Convert the CPU cooling device to a choice | expand |
On 03-12-19, 10:37, Daniel Lezcano wrote: > As we introduced the idle injection cooling device called > cpuidle_cooling, let's be consistent and rename the cpu_cooling to > cpufreq_cooling as this one mitigates with OPPs changes. > > Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> > --- > V3: > - Fix missing name conversion (Viresh Kumar) > --- > Documentation/driver-api/thermal/exynos_thermal.rst | 2 +- > MAINTAINERS | 2 +- > drivers/thermal/Makefile | 2 +- > drivers/thermal/clock_cooling.c | 2 +- > drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} | 6 +++--- > include/linux/clock_cooling.h | 2 +- > 6 files changed, 8 insertions(+), 8 deletions(-) > rename drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} (99%) Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
On Tue, Dec 3, 2019 at 3:07 PM Daniel Lezcano <daniel.lezcano@linaro.org> wrote: > > As we introduced the idle injection cooling device called > cpuidle_cooling, let's be consistent and rename the cpu_cooling to > cpufreq_cooling as this one mitigates with OPPs changes. > > Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> Reviewed-by: Amit Kucheria <amit.kucheria@linaro.org> > --- > V3: > - Fix missing name conversion (Viresh Kumar) > --- > Documentation/driver-api/thermal/exynos_thermal.rst | 2 +- > MAINTAINERS | 2 +- > drivers/thermal/Makefile | 2 +- > drivers/thermal/clock_cooling.c | 2 +- > drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} | 6 +++--- > include/linux/clock_cooling.h | 2 +- > 6 files changed, 8 insertions(+), 8 deletions(-) > rename drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} (99%) > > diff --git a/Documentation/driver-api/thermal/exynos_thermal.rst b/Documentation/driver-api/thermal/exynos_thermal.rst > index 5bd556566c70..d4e4a5b75805 100644 > --- a/Documentation/driver-api/thermal/exynos_thermal.rst > +++ b/Documentation/driver-api/thermal/exynos_thermal.rst > @@ -67,7 +67,7 @@ TMU driver description: > The exynos thermal driver is structured as:: > > Kernel Core thermal framework > - (thermal_core.c, step_wise.c, cpu_cooling.c) > + (thermal_core.c, step_wise.c, cpufreq_cooling.c) > ^ > | > | > diff --git a/MAINTAINERS b/MAINTAINERS > index d2e92a0360f2..26e4be914765 100644 > --- a/MAINTAINERS > +++ b/MAINTAINERS > @@ -16194,7 +16194,7 @@ L: linux-pm@vger.kernel.org > S: Supported > F: Documentation/driver-api/thermal/cpu-cooling-api.rst > F: Documentation/driver-api/thermal/cpu-idle-cooling.rst > -F: drivers/thermal/cpu_cooling.c > +F: drivers/thermal/cpufreq_cooling.c > F: drivers/thermal/cpuidle_cooling.c > F: include/linux/cpu_cooling.h > > diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile > index 9c8aa2d4bd28..5c98472ffd8b 100644 > --- a/drivers/thermal/Makefile > +++ b/drivers/thermal/Makefile > @@ -19,7 +19,7 @@ thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o > thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR) += power_allocator.o > > # cpufreq cooling > -thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpu_cooling.o > +thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpufreq_cooling.o > thermal_sys-$(CONFIG_CPU_IDLE_THERMAL) += cpuidle_cooling.o > > # clock cooling > diff --git a/drivers/thermal/clock_cooling.c b/drivers/thermal/clock_cooling.c > index 3ad3256c48fd..7cb3ae4b44ee 100644 > --- a/drivers/thermal/clock_cooling.c > +++ b/drivers/thermal/clock_cooling.c > @@ -7,7 +7,7 @@ > * Copyright (C) 2013 Texas Instruments Inc. > * Contact: Eduardo Valentin <eduardo.valentin@ti.com> > * > - * Highly based on cpu_cooling.c. > + * Highly based on cpufreq_cooling.c. > * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) > * Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org> > */ > diff --git a/drivers/thermal/cpu_cooling.c b/drivers/thermal/cpufreq_cooling.c > similarity index 99% > rename from drivers/thermal/cpu_cooling.c > rename to drivers/thermal/cpufreq_cooling.c > index 6b9865c786ba..3a3f9cf94b6d 100644 > --- a/drivers/thermal/cpu_cooling.c > +++ b/drivers/thermal/cpufreq_cooling.c > @@ -1,6 +1,6 @@ > // SPDX-License-Identifier: GPL-2.0 > /* > - * linux/drivers/thermal/cpu_cooling.c > + * linux/drivers/thermal/cpufreq_cooling.c > * > * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) > * > @@ -694,7 +694,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy) > u32 capacitance = 0; > > if (!np) { > - pr_err("cpu_cooling: OF node not available for cpu%d\n", > + pr_err("cpufreq_cooling: OF node not available for cpu%d\n", > policy->cpu); > return NULL; > } > @@ -705,7 +705,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy) > > cdev = __cpufreq_cooling_register(np, policy, capacitance); > if (IS_ERR(cdev)) { > - pr_err("cpu_cooling: cpu%d failed to register as cooling device: %ld\n", > + pr_err("cpufreq_cooling: cpu%d failed to register as cooling device: %ld\n", > policy->cpu, PTR_ERR(cdev)); > cdev = NULL; > } > diff --git a/include/linux/clock_cooling.h b/include/linux/clock_cooling.h > index b5cebf766e02..4b0a69863656 100644 > --- a/include/linux/clock_cooling.h > +++ b/include/linux/clock_cooling.h > @@ -7,7 +7,7 @@ > * Copyright (C) 2013 Texas Instruments Inc. > * Contact: Eduardo Valentin <eduardo.valentin@ti.com> > * > - * Highly based on cpu_cooling.c. > + * Highly based on cpufreq_cooling.c. > * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) > * Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org> > */ > -- > 2.17.1 >
diff --git a/Documentation/driver-api/thermal/exynos_thermal.rst b/Documentation/driver-api/thermal/exynos_thermal.rst index 5bd556566c70..d4e4a5b75805 100644 --- a/Documentation/driver-api/thermal/exynos_thermal.rst +++ b/Documentation/driver-api/thermal/exynos_thermal.rst @@ -67,7 +67,7 @@ TMU driver description: The exynos thermal driver is structured as:: Kernel Core thermal framework - (thermal_core.c, step_wise.c, cpu_cooling.c) + (thermal_core.c, step_wise.c, cpufreq_cooling.c) ^ | | diff --git a/MAINTAINERS b/MAINTAINERS index d2e92a0360f2..26e4be914765 100644 --- a/MAINTAINERS +++ b/MAINTAINERS @@ -16194,7 +16194,7 @@ L: linux-pm@vger.kernel.org S: Supported F: Documentation/driver-api/thermal/cpu-cooling-api.rst F: Documentation/driver-api/thermal/cpu-idle-cooling.rst -F: drivers/thermal/cpu_cooling.c +F: drivers/thermal/cpufreq_cooling.c F: drivers/thermal/cpuidle_cooling.c F: include/linux/cpu_cooling.h diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile index 9c8aa2d4bd28..5c98472ffd8b 100644 --- a/drivers/thermal/Makefile +++ b/drivers/thermal/Makefile @@ -19,7 +19,7 @@ thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o thermal_sys-$(CONFIG_THERMAL_GOV_POWER_ALLOCATOR) += power_allocator.o # cpufreq cooling -thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpu_cooling.o +thermal_sys-$(CONFIG_CPU_FREQ_THERMAL) += cpufreq_cooling.o thermal_sys-$(CONFIG_CPU_IDLE_THERMAL) += cpuidle_cooling.o # clock cooling diff --git a/drivers/thermal/clock_cooling.c b/drivers/thermal/clock_cooling.c index 3ad3256c48fd..7cb3ae4b44ee 100644 --- a/drivers/thermal/clock_cooling.c +++ b/drivers/thermal/clock_cooling.c @@ -7,7 +7,7 @@ * Copyright (C) 2013 Texas Instruments Inc. * Contact: Eduardo Valentin <eduardo.valentin@ti.com> * - * Highly based on cpu_cooling.c. + * Highly based on cpufreq_cooling.c. * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) * Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org> */ diff --git a/drivers/thermal/cpu_cooling.c b/drivers/thermal/cpufreq_cooling.c similarity index 99% rename from drivers/thermal/cpu_cooling.c rename to drivers/thermal/cpufreq_cooling.c index 6b9865c786ba..3a3f9cf94b6d 100644 --- a/drivers/thermal/cpu_cooling.c +++ b/drivers/thermal/cpufreq_cooling.c @@ -1,6 +1,6 @@ // SPDX-License-Identifier: GPL-2.0 /* - * linux/drivers/thermal/cpu_cooling.c + * linux/drivers/thermal/cpufreq_cooling.c * * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) * @@ -694,7 +694,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy) u32 capacitance = 0; if (!np) { - pr_err("cpu_cooling: OF node not available for cpu%d\n", + pr_err("cpufreq_cooling: OF node not available for cpu%d\n", policy->cpu); return NULL; } @@ -705,7 +705,7 @@ of_cpufreq_cooling_register(struct cpufreq_policy *policy) cdev = __cpufreq_cooling_register(np, policy, capacitance); if (IS_ERR(cdev)) { - pr_err("cpu_cooling: cpu%d failed to register as cooling device: %ld\n", + pr_err("cpufreq_cooling: cpu%d failed to register as cooling device: %ld\n", policy->cpu, PTR_ERR(cdev)); cdev = NULL; } diff --git a/include/linux/clock_cooling.h b/include/linux/clock_cooling.h index b5cebf766e02..4b0a69863656 100644 --- a/include/linux/clock_cooling.h +++ b/include/linux/clock_cooling.h @@ -7,7 +7,7 @@ * Copyright (C) 2013 Texas Instruments Inc. * Contact: Eduardo Valentin <eduardo.valentin@ti.com> * - * Highly based on cpu_cooling.c. + * Highly based on cpufreq_cooling.c. * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com) * Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org> */
As we introduced the idle injection cooling device called cpuidle_cooling, let's be consistent and rename the cpu_cooling to cpufreq_cooling as this one mitigates with OPPs changes. Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org> --- V3: - Fix missing name conversion (Viresh Kumar) --- Documentation/driver-api/thermal/exynos_thermal.rst | 2 +- MAINTAINERS | 2 +- drivers/thermal/Makefile | 2 +- drivers/thermal/clock_cooling.c | 2 +- drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} | 6 +++--- include/linux/clock_cooling.h | 2 +- 6 files changed, 8 insertions(+), 8 deletions(-) rename drivers/thermal/{cpu_cooling.c => cpufreq_cooling.c} (99%)