| Message ID | 20220821160032.2206349-1-jic23@kernel.org (mailing list archive) |
|---|---|
| State | New, archived |
| Delegated to: | Daniel Lezcano |
| Headers | show |
| Series | thermal/drivers/qcom: Drop false build dependency of all QCOM drivers on QCOM_TSENS | expand |
Hi, On 8/21/22 9:30 PM, Jonathan Cameron wrote: > From: Jonathan Cameron <Jonathan.Cameron@huawei.com> > > The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile > will not be included without QCOM_TSENS. This unnecessarily reduces > build coverage. > > Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> > Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> > Cc: Bhupesh Sharma <bhupesh.sharma@linaro.org> > --- > > Run into whilst trying to build test a namespace move for the IIO > interfaces used in these drivers. Good catch. Actually, I am working on a detailed cleanup of the Makefile, Kconfig and Maintainers entries for qcom thermal driver entries as in the present form having all entries inside qcom/ directory dependent on CONFIG_QCOM_TSENS doesn't seem optimal (especially with new driver files being added). > Maintainers entry for TSENS should probably also be made more > specific. > --- > drivers/thermal/Makefile | 2 +- > 1 file changed, 1 insertion(+), 1 deletion(-) > > diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile > index def8e1a0399c..2506c6c8ca83 100644 > --- a/drivers/thermal/Makefile > +++ b/drivers/thermal/Makefile > @@ -52,7 +52,7 @@ obj-$(CONFIG_DA9062_THERMAL) += da9062-thermal.o > obj-y += intel/ > obj-$(CONFIG_TI_SOC_THERMAL) += ti-soc-thermal/ > obj-y += st/ > -obj-$(CONFIG_QCOM_TSENS) += qcom/ > +obj-y += qcom/ > obj-y += tegra/ > obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o > obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o For now, this looks good to me, so: Reviewed-by: Bhupesh Sharma <bhupesh.sharma@linaro.org> Thanks.
On Sun, Aug 21, 2022 at 10:05 PM Jonathan Cameron <jic23@kernel.org> wrote: > > From: Jonathan Cameron <Jonathan.Cameron@huawei.com> > > The SPMI QCOM drivers have no dependency in Kconfig, but the Makefile > will not be included without QCOM_TSENS. This unnecessarily reduces > build coverage. > > Signed-off-by: Jonathan Cameron <Jonathan.Cameron@huawei.com> > Cc: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> > Cc: Bhupesh Sharma <bhupesh.sharma@linaro.org> Acked-by: Amit Kucheria <amitk@kernel.org> > --- > > Run into whilst trying to build test a namespace move for the IIO > interfaces used in these drivers. > > Maintainers entry for TSENS should probably also be made more > specific. > --- > drivers/thermal/Makefile | 2 +- > 1 file changed, 1 insertion(+), 1 deletion(-) > > diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile > index def8e1a0399c..2506c6c8ca83 100644 > --- a/drivers/thermal/Makefile > +++ b/drivers/thermal/Makefile > @@ -52,7 +52,7 @@ obj-$(CONFIG_DA9062_THERMAL) += da9062-thermal.o > obj-y += intel/ > obj-$(CONFIG_TI_SOC_THERMAL) += ti-soc-thermal/ > obj-y += st/ > -obj-$(CONFIG_QCOM_TSENS) += qcom/ > +obj-y += qcom/ > obj-y += tegra/ > obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o > obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o > -- > 2.37.2 >
diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile index def8e1a0399c..2506c6c8ca83 100644 --- a/drivers/thermal/Makefile +++ b/drivers/thermal/Makefile @@ -52,7 +52,7 @@ obj-$(CONFIG_DA9062_THERMAL) += da9062-thermal.o obj-y += intel/ obj-$(CONFIG_TI_SOC_THERMAL) += ti-soc-thermal/ obj-y += st/ -obj-$(CONFIG_QCOM_TSENS) += qcom/ +obj-y += qcom/ obj-y += tegra/ obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o