diff mbox

[v2,7/9] arm64: dts: Add the thermal data found on RK3368

Message ID 1446700685-18017-8-git-send-email-wxt@rock-chips.com
State New
Headers show

Commit Message

Caesar Wang Nov. 5, 2015, 5:18 a.m. UTC
This patchset add the thermal for RK3368 dts,
Since the two CPU clusters, with four CPU core for each cluster,
One cluster is optimized for high-performance(big cluster) and the othe
is optimized for low power(little cluster).

This patch adds the second order for thermal throttle, and the critical
temperature for thermal over-tempeature protection on Software.

Signed-off-by: Caesar Wang <wxt@rock-chips.com>
---

Changes in v2: None
Changes in v1: None

 arch/arm64/boot/dts/rockchip/rk3368-thermal.dtsi | 112 +++++++++++++++++++++++
 1 file changed, 112 insertions(+)
 create mode 100644 arch/arm64/boot/dts/rockchip/rk3368-thermal.dtsi

Comments

Eduardo Valentin Nov. 6, 2015, 7:14 p.m. UTC | #1
On Thu, Nov 05, 2015 at 01:18:03PM +0800, Caesar Wang wrote:
> This patchset add the thermal for RK3368 dts,
> Since the two CPU clusters, with four CPU core for each cluster,
> One cluster is optimized for high-performance(big cluster) and the othe
> is optimized for low power(little cluster).
> 
> This patch adds the second order for thermal throttle, and the critical
> temperature for thermal over-tempeature protection on Software.
> 
> Signed-off-by: Caesar Wang <wxt@rock-chips.com>

Acked-by: Eduardo Valentin <edubezval@gmail.com>

> ---
> 
> Changes in v2: None
> Changes in v1: None
> 
>  arch/arm64/boot/dts/rockchip/rk3368-thermal.dtsi | 112 +++++++++++++++++++++++
>  1 file changed, 112 insertions(+)
>  create mode 100644 arch/arm64/boot/dts/rockchip/rk3368-thermal.dtsi
> 
> diff --git a/arch/arm64/boot/dts/rockchip/rk3368-thermal.dtsi b/arch/arm64/boot/dts/rockchip/rk3368-thermal.dtsi
> new file mode 100644
> index 0000000..a10010f
> --- /dev/null
> +++ b/arch/arm64/boot/dts/rockchip/rk3368-thermal.dtsi
> @@ -0,0 +1,112 @@
> +/*
> + * Device Tree Source for RK3368 SoC thermal
> + *
> + * Copyright (c) 2015, Fuzhou Rockchip Electronics Co., Ltd
> + * Caesar Wang <wxt@rock-chips.com>
> + *
> + * This file is dual-licensed: you can use it either under the terms
> + * of the GPL or the X11 license, at your option. Note that this dual
> + * licensing only applies to this file, and not this project as a
> + * whole.
> + *
> + *  a) This file is free software; you can redistribute it and/or
> + *     modify it under the terms of the GNU General Public License as
> + *     published by the Free Software Foundation; either version 2 of the
> + *     License, or (at your option) any later version.
> + *
> + *     This file is distributed in the hope that it will be useful,
> + *     but WITHOUT ANY WARRANTY; without even the implied warranty of
> + *     MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
> + *     GNU General Public License for more details.
> + *
> + * Or, alternatively,
> + *
> + *  b) Permission is hereby granted, free of charge, to any person
> + *     obtaining a copy of this software and associated documentation
> + *     files (the "Software"), to deal in the Software without
> + *     restriction, including without limitation the rights to use,
> + *     copy, modify, merge, publish, distribute, sublicense, and/or
> + *     sell copies of the Software, and to permit persons to whom the
> + *     Software is furnished to do so, subject to the following
> + *     conditions:
> + *
> + *     The above copyright notice and this permission notice shall be
> + *     included in all copies or substantial portions of the Software.
> + *
> + *     THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND,
> + *     EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES
> + *     OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND
> + *     NONINFRINGEMENT. IN NO EVENT SHALL THE AUTHORS OR COPYRIGHT
> + *     HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER LIABILITY,
> + *     WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING
> + *     FROM, OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR
> + *     OTHER DEALINGS IN THE SOFTWARE.
> + */
> +
> +#include <dt-bindings/thermal/thermal.h>
> +
> +cpu_thermal: cpu_thermal {
> +	polling-delay-passive = <100>; /* milliseconds */
> +	polling-delay = <5000>; /* milliseconds */
> +
> +	thermal-sensors = <&tsadc 0>;
> +
> +	trips {
> +		cpu_alert0: cpu_alert0 {
> +			temperature = <75000>; /* millicelsius */
> +			hysteresis = <2000>; /* millicelsius */
> +			type = "passive";
> +		};
> +		cpu_alert1: cpu_alert1 {
> +			temperature = <80000>; /* millicelsius */
> +			hysteresis = <2000>; /* millicelsius */
> +			type = "passive";
> +		};
> +		cpu_crit: cpu_crit {
> +			temperature = <95000>; /* millicelsius */
> +			hysteresis = <2000>; /* millicelsius */
> +			type = "critical";
> +		};
> +	};
> +
> +	cooling-maps {
> +		map0 {
> +			trip = <&cpu_alert0>;
> +			cooling-device =
> +				<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> +		};
> +		map1 {
> +			trip = <&cpu_alert1>;
> +			cooling-device =
> +				<&cpu_l0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> +		};
> +	};
> +};
> +
> +gpu_thermal: gpu_thermal {
> +	polling-delay-passive = <100>; /* milliseconds */
> +	polling-delay = <5000>; /* milliseconds */
> +
> +	thermal-sensors = <&tsadc 1>;
> +
> +	trips {
> +		gpu_alert0: gpu_alert0 {
> +			temperature = <80000>; /* millicelsius */
> +			hysteresis = <2000>; /* millicelsius */
> +			type = "passive";
> +		};
> +		gpu_crit: gpu_crit {
> +			temperature = <1150000>; /* millicelsius */
> +			hysteresis = <2000>; /* millicelsius */
> +			type = "critical";
> +		};
> +	};
> +
> +	cooling-maps {
> +		map0 {
> +			trip = <&gpu_alert0>;
> +			cooling-device =
> +				<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> +		};
> +	};
> +};
> -- 
> 1.9.1
>
diff mbox

Patch

diff --git a/arch/arm64/boot/dts/rockchip/rk3368-thermal.dtsi b/arch/arm64/boot/dts/rockchip/rk3368-thermal.dtsi
new file mode 100644
index 0000000..a10010f
--- /dev/null
+++ b/arch/arm64/boot/dts/rockchip/rk3368-thermal.dtsi
@@ -0,0 +1,112 @@ 
+/*
+ * Device Tree Source for RK3368 SoC thermal
+ *
+ * Copyright (c) 2015, Fuzhou Rockchip Electronics Co., Ltd
+ * Caesar Wang <wxt@rock-chips.com>
+ *
+ * This file is dual-licensed: you can use it either under the terms
+ * of the GPL or the X11 license, at your option. Note that this dual
+ * licensing only applies to this file, and not this project as a
+ * whole.
+ *
+ *  a) This file is free software; you can redistribute it and/or
+ *     modify it under the terms of the GNU General Public License as
+ *     published by the Free Software Foundation; either version 2 of the
+ *     License, or (at your option) any later version.
+ *
+ *     This file is distributed in the hope that it will be useful,
+ *     but WITHOUT ANY WARRANTY; without even the implied warranty of
+ *     MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
+ *     GNU General Public License for more details.
+ *
+ * Or, alternatively,
+ *
+ *  b) Permission is hereby granted, free of charge, to any person
+ *     obtaining a copy of this software and associated documentation
+ *     files (the "Software"), to deal in the Software without
+ *     restriction, including without limitation the rights to use,
+ *     copy, modify, merge, publish, distribute, sublicense, and/or
+ *     sell copies of the Software, and to permit persons to whom the
+ *     Software is furnished to do so, subject to the following
+ *     conditions:
+ *
+ *     The above copyright notice and this permission notice shall be
+ *     included in all copies or substantial portions of the Software.
+ *
+ *     THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND,
+ *     EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE WARRANTIES
+ *     OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND
+ *     NONINFRINGEMENT. IN NO EVENT SHALL THE AUTHORS OR COPYRIGHT
+ *     HOLDERS BE LIABLE FOR ANY CLAIM, DAMAGES OR OTHER LIABILITY,
+ *     WHETHER IN AN ACTION OF CONTRACT, TORT OR OTHERWISE, ARISING
+ *     FROM, OUT OF OR IN CONNECTION WITH THE SOFTWARE OR THE USE OR
+ *     OTHER DEALINGS IN THE SOFTWARE.
+ */
+
+#include <dt-bindings/thermal/thermal.h>
+
+cpu_thermal: cpu_thermal {
+	polling-delay-passive = <100>; /* milliseconds */
+	polling-delay = <5000>; /* milliseconds */
+
+	thermal-sensors = <&tsadc 0>;
+
+	trips {
+		cpu_alert0: cpu_alert0 {
+			temperature = <75000>; /* millicelsius */
+			hysteresis = <2000>; /* millicelsius */
+			type = "passive";
+		};
+		cpu_alert1: cpu_alert1 {
+			temperature = <80000>; /* millicelsius */
+			hysteresis = <2000>; /* millicelsius */
+			type = "passive";
+		};
+		cpu_crit: cpu_crit {
+			temperature = <95000>; /* millicelsius */
+			hysteresis = <2000>; /* millicelsius */
+			type = "critical";
+		};
+	};
+
+	cooling-maps {
+		map0 {
+			trip = <&cpu_alert0>;
+			cooling-device =
+				<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+		};
+		map1 {
+			trip = <&cpu_alert1>;
+			cooling-device =
+				<&cpu_l0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+		};
+	};
+};
+
+gpu_thermal: gpu_thermal {
+	polling-delay-passive = <100>; /* milliseconds */
+	polling-delay = <5000>; /* milliseconds */
+
+	thermal-sensors = <&tsadc 1>;
+
+	trips {
+		gpu_alert0: gpu_alert0 {
+			temperature = <80000>; /* millicelsius */
+			hysteresis = <2000>; /* millicelsius */
+			type = "passive";
+		};
+		gpu_crit: gpu_crit {
+			temperature = <1150000>; /* millicelsius */
+			hysteresis = <2000>; /* millicelsius */
+			type = "critical";
+		};
+	};
+
+	cooling-maps {
+		map0 {
+			trip = <&gpu_alert0>;
+			cooling-device =
+				<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
+		};
+	};
+};