From patchwork Mon Jun 17 06:46:36 2013 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Amit Kachhap X-Patchwork-Id: 2731071 Return-Path: X-Original-To: patchwork-linux-samsung-soc@patchwork.kernel.org Delivered-To: patchwork-parsemail@patchwork1.web.kernel.org Received: from mail.kernel.org (mail.kernel.org [198.145.19.201]) by patchwork1.web.kernel.org (Postfix) with ESMTP id A83379F472 for ; Mon, 17 Jun 2013 06:50:25 +0000 (UTC) Received: from mail.kernel.org (localhost [127.0.0.1]) by mail.kernel.org (Postfix) with ESMTP id BE5E0201E3 for ; Mon, 17 Jun 2013 06:50:24 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id C1B74201DE for ; Mon, 17 Jun 2013 06:50:23 +0000 (UTC) Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S932616Ab3FQGtL (ORCPT ); Mon, 17 Jun 2013 02:49:11 -0400 Received: from mail-pd0-f170.google.com ([209.85.192.170]:62935 "EHLO mail-pd0-f170.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S932637Ab3FQGtI (ORCPT ); Mon, 17 Jun 2013 02:49:08 -0400 Received: by mail-pd0-f170.google.com with SMTP id x11so2461132pdj.1 for ; Sun, 16 Jun 2013 23:49:07 -0700 (PDT) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=sender:from:to:cc:subject:date:message-id:x-mailer:in-reply-to :references; bh=ohDkK1ZJ4RpjPN7HG7eobmBD5rKLdIJp0GSmRewAFDc=; b=TZlPdzXun9sJocxcSJuh8MQ0gpT6xLo9IxP0PtnwP1jKetMhCTfZe1B4B7P1CbReNa dp+jDeGdszurt2JvX2xWHViSWq3i6kQzPcsxky/rz5ZUb9F1nh/aGpk/Bnm8ZUJm8rJC Ak131fm8/D46Wg+buqChNOxTJLcJOqbHw8Acq1n+OkBOdil0knsAxYzloqv1LDKW8urY dzEVZoaax0490KgmxjPHGQXSK6a83x0r8rreztwB5luBGrn/QGKrKdAtTkN4M1tcgx6I j1jEJHfmKhf96mvtElyBsAD7ReZtHS5Xvb3Cl7t6VfXvTa1p2fuJyf4QEtNZHPIPcQZp q/fw== X-Received: by 10.66.145.34 with SMTP id sr2mr11524941pab.94.1371451747739; Sun, 16 Jun 2013 23:49:07 -0700 (PDT) Received: from localhost.localdomain ([115.113.119.130]) by mx.google.com with ESMTPSA id xl3sm11639859pbb.17.2013.06.16.23.49.03 for (version=TLSv1 cipher=RC4-SHA bits=128/128); Sun, 16 Jun 2013 23:49:06 -0700 (PDT) From: Amit Daniel Kachhap To: linux-pm@vger.kernel.org, Zhang Rui , Eduardo Valentin Cc: linux-samsung-soc@vger.kernel.org, linux-kernel@vger.kernel.org, amit.kachhap@gmail.com, Kukjin Kim , jonghwa3.lee@samsung.com Subject: [PATCH V6 27/30] Documentation: thermal: Explain the exynos thermal driver model Date: Mon, 17 Jun 2013 12:16:36 +0530 Message-Id: <1371451599-31035-28-git-send-email-amit.daniel@samsung.com> X-Mailer: git-send-email 1.7.1 In-Reply-To: <1371451599-31035-1-git-send-email-amit.daniel@samsung.com> References: <1371451599-31035-1-git-send-email-amit.daniel@samsung.com> Sender: linux-samsung-soc-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-samsung-soc@vger.kernel.org X-Spam-Status: No, score=-7.9 required=5.0 tests=BAYES_00,DKIM_SIGNED, RCVD_IN_DNSWL_HI,RP_MATCHES_RCVD,T_DKIM_INVALID,UNPARSEABLE_RELAY autolearn=unavailable version=3.3.1 X-Spam-Checker-Version: SpamAssassin 3.3.1 (2010-03-16) on mail.kernel.org X-Virus-Scanned: ClamAV using ClamSMTP This patch updates the documentation to explain the driver model and file layout. Acked-by: Jonghwa Lee Acked-by: Kukjin Kim Signed-off-by: Amit Daniel Kachhap Acked-by: Eduardo Valentin --- Documentation/thermal/exynos_thermal | 43 ++++++++++++++++++++++++++------- 1 files changed, 34 insertions(+), 9 deletions(-) diff --git a/Documentation/thermal/exynos_thermal b/Documentation/thermal/exynos_thermal index 2b46f67..9010c44 100644 --- a/Documentation/thermal/exynos_thermal +++ b/Documentation/thermal/exynos_thermal @@ -1,17 +1,17 @@ -Kernel driver exynos4_tmu +Kernel driver exynos_tmu ================= Supported chips: -* ARM SAMSUNG EXYNOS4 series of SoC - Prefix: 'exynos4-tmu' +* ARM SAMSUNG EXYNOS4, EXYNOS5 series of SoC Datasheet: Not publicly available Authors: Donggeun Kim +Authors: Amit Daniel -Description ------------ +TMU controller Description: +--------------------------- -This driver allows to read temperature inside SAMSUNG EXYNOS4 series of SoC. +This driver allows to read temperature inside SAMSUNG EXYNOS4/5 series of SoC. The chip only exposes the measured 8-bit temperature code value through a register. @@ -34,9 +34,9 @@ The three equations are: TI2: Trimming info for 85 degree Celsius (stored at TRIMINFO register) Temperature code measured at 85 degree Celsius which is unchanged -TMU(Thermal Management Unit) in EXYNOS4 generates interrupt +TMU(Thermal Management Unit) in EXYNOS4/5 generates interrupt when temperature exceeds pre-defined levels. -The maximum number of configurable threshold is four. +The maximum number of configurable threshold is five. The threshold levels are defined as follows: Level_0: current temperature > trigger_level_0 + threshold Level_1: current temperature > trigger_level_1 + threshold @@ -47,6 +47,31 @@ The threshold levels are defined as follows: through the corresponding registers. When an interrupt occurs, this driver notify kernel thermal framework -with the function exynos4_report_trigger. +with the function exynos_report_trigger. Although an interrupt condition for level_0 can be set, it can be used to synchronize the cooling action. + +TMU driver description: +----------------------- + +The exynos thermal driver is structured as, + + Kernel Core thermal framework + (thermal_core.c, step_wise.c, cpu_cooling.c) + ^ + | + | +TMU configuration data -------> TMU Driver <------> Exynos Core thermal wrapper +(exynos_tmu_data.c) (exynos_tmu.c) (exynos_thermal_common.c) +(exynos_tmu_data.h) (exynos_tmu.h) (exynos_thermal_common.h) + +a) TMU configuration data: This consist of TMU register offsets/bitfields + described through structure exynos_tmu_registers. Also several + other platform data (struct exynos_tmu_platform_data) members + are used to configure the TMU. +b) TMU driver: This component initialises the TMU controller and sets different + thresholds. It invokes core thermal implementation with the call + exynos_report_trigger. +c) Exynos Core thermal wrapper: This provides 3 wrapper function to use the + Kernel core thermal framework. They are exynos_unregister_thermal, + exynos_register_thermal and exynos_report_trigger.