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[v4,0/4] i.MX8MP: more USB3 glue layer feature support

Message ID 20220126141340.234125-1-alexander.stein@ew.tq-group.com (mailing list archive)
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Series i.MX8MP: more USB3 glue layer feature support | expand

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Alexander Stein Jan. 26, 2022, 2:13 p.m. UTC 
Hi all,

Thanks for the feedback on v3 [1].

This patchset aims to support flags for e.g. over-current active low or port
permanantly attached which are provided in the USB3 glue layer.

In v4 the patchset depends on Lucas' i.MX8MP power-domains patchset [2].
Because of that the 'phy' clock usage can be dropped, as now power domains
take care of the clocks. Due to powering up/down the glue layer settings
will have to be reapplied during resume.

Changes in v4:
* Depends on Lucas' i.MX8MP power-domains patchset
* removed 'phy' clock usage from dwc3-imx8mp.c
* Reapply glue layer settings upon resume

Changes in v3:
* Rename existing member for clarity
* Moved feature implementation from phy-fsl-imx8mq-usb.c to dwc3-imx8mp.c

[1] https://patchwork.kernel.org/project/linux-arm-kernel/cover/20220118131626.926394-1-alexander.stein@ew.tq-group.com/
[2] https://patchwork.kernel.org/project/linux-arm-kernel/cover/20220119134027.2931945-1-l.stach@pengutronix.de/

Alexander Stein (4):
  usb: dwc3: imx8mp: rename iomem base pointer
  dt-bindings: usb: dwc3-imx8mp: Add imx8mp specific flags
  usb: dwc3: imx8mp: Add support for setting SOC specific flags
  arm64: dts: imx8mp: Add memory for USB3 glue layer to usb3 nodes

 .../bindings/usb/fsl,imx8mp-dwc3.yaml         | 31 +++++++-
 arch/arm64/boot/dts/freescale/imx8mp.dtsi     |  6 +-
 drivers/usb/dwc3/dwc3-imx8mp.c                | 76 +++++++++++++++++--
 3 files changed, 100 insertions(+), 13 deletions(-)