From patchwork Fri Nov 17 17:36:47 2023 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Johan Hovold X-Patchwork-Id: 13459186 Received: from smtp.kernel.org (aws-us-west-2-korg-mail-1.web.codeaurora.org [10.30.226.201]) (using TLSv1.2 with cipher ECDHE-RSA-AES256-GCM-SHA384 (256/256 bits)) (No client certificate requested) by smtp.subspace.kernel.org (Postfix) with ESMTPS id C428F14F90; Fri, 17 Nov 2023 17:38:09 +0000 (UTC) Authentication-Results: smtp.subspace.kernel.org; dkim=pass (2048-bit key) header.d=kernel.org header.i=@kernel.org header.b="mtKlfPUJ" Received: by smtp.kernel.org (Postfix) with ESMTPSA id 66A95C433C9; Fri, 17 Nov 2023 17:38:09 +0000 (UTC) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/simple; d=kernel.org; s=k20201202; t=1700242689; bh=EUDBFroF5TjmYX0MrqbQ4lm7E/YuA+W3eE3VkPGKcm4=; h=From:To:Cc:Subject:Date:From; b=mtKlfPUJjJanONH237bSO3hOyU3SFX6xd57lxI10FihF5J/Mibv8D4PbuIiO4F5iy d4WA6/sHLhtXtn85tmoz8qRflR9TgpG14tbbU/u2a+SMRM04OTf2y5kJnuo0mfTcaE gQEg3YiAE39DARcXgaIYF5Ia1GBGkJ168le7YTOy0vg6tGGvcbwVyn7HDnnam8h3LV zJcX6KP7XzZSux28CArPbMBqEOCUU/OawwwhIYsz5NMxZWpfI21s3i3LoJkBgHAJ2H AYbrHhzqOdeRqKQjNWy+AcyBPetP5rOABkVxIGI+Tc5v3faQwuhgO9stvbnF/Q9zUT 9E3RhmkCzm4fA== Received: from johan by xi.lan with local (Exim 4.96.2) (envelope-from ) id 1r42nF-0005Vo-0K; Fri, 17 Nov 2023 18:38:13 +0100 From: Johan Hovold To: Greg Kroah-Hartman Cc: Andy Gross , Bjorn Andersson , Konrad Dybcio , Thinh Nguyen , Krishna Kurapati PSSNV , linux-arm-msm@vger.kernel.org, linux-usb@vger.kernel.org, linux-kernel@vger.kernel.org, Johan Hovold Subject: [PATCH 0/3] USB: dwc3: qcom: fix resource leaks on probe deferral Date: Fri, 17 Nov 2023 18:36:47 +0100 Message-ID: <20231117173650.21161-1-johan+linaro@kernel.org> X-Mailer: git-send-email 2.41.0 Precedence: bulk X-Mailing-List: linux-usb@vger.kernel.org List-Id: List-Subscribe: List-Unsubscribe: MIME-Version: 1.0 When reviewing the recently submitted series which reworks the dwc3 qcom glue implementation [1], I noticed that the driver's tear down handling is currently broken, something which can lead to memory leaks and potentially use-after-free issues on probe deferral and on driver unbind. Let's get this sorted before reworking driver. Note that the last patch has only been compile tested as I don't have access to a sdm845 device. Johan [1] https://lore.kernel.org/lkml/20231016-dwc3-refactor-v1-0-ab4a84165470@quicinc.com/ Johan Hovold (3): USB: dwc3: qcom: fix resource leaks on probe deferral USB: dwc3: qcom: fix software node leak on probe errors USB: dwc3: qcom: fix ACPI platform device leak drivers/usb/dwc3/dwc3-qcom.c | 57 +++++++++++++++++++++++++++--------- 1 file changed, 43 insertions(+), 14 deletions(-)