From patchwork Mon Feb 24 07:25:35 2020 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Amit Kucheria X-Patchwork-Id: 11399469 Return-Path: Received: from mail.kernel.org (pdx-korg-mail-1.web.codeaurora.org [172.30.200.123]) by pdx-korg-patchwork-2.web.codeaurora.org (Postfix) with ESMTP id 6DF9314E3 for ; Mon, 24 Feb 2020 07:25:48 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id 4D6162080D for ; Mon, 24 Feb 2020 07:25:48 +0000 (UTC) Authentication-Results: mail.kernel.org; dkim=pass (2048-bit key) header.d=linaro.org header.i=@linaro.org header.b="bUS+25+8" Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1727256AbgBXHZr (ORCPT ); Mon, 24 Feb 2020 02:25:47 -0500 Received: from mail-pj1-f65.google.com ([209.85.216.65]:37668 "EHLO mail-pj1-f65.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1726778AbgBXHZr (ORCPT ); Mon, 24 Feb 2020 02:25:47 -0500 Received: by mail-pj1-f65.google.com with SMTP id m13so3772860pjb.2 for ; Sun, 23 Feb 2020 23:25:46 -0800 (PST) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:in-reply-to:references :mime-version:content-transfer-encoding; bh=hYyHTVUj+djldG9B+Pq0Lr60baNa5Q3EKWfIUDYwvYI=; b=bUS+25+867b++YN2nd8IBK/JhTNAEBklHGTNWPbyVyvNJQFtDBeBl9SuLqlQRBUqtZ KO4AgOX2vqG1ZV6GxAhNvLgCu/yGMeqlKGIGT/Ityt7Gp1IBonk5HgK73dU3vhZFtg+V s9qhgJSIOqVxd9J4M2TFCpQ1mMtZcOKLmh99rI8GwezuH93CfAcKNTuqgDfeRMdfRkbo 0ZHj9lhAmuDJ9wxclGgcVg/QLC/K2ZLeeqr1RVItZX1hI9Oo6yWY1mj8qjCvW5Fp5fSE YYkRLwBbjLGUcw22BNASU3qR3rsNC91Sodgo7rsXS7pROp4MDqRuI2JcneHqGa9EO2cs ++kg== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:in-reply-to :references:mime-version:content-transfer-encoding; bh=hYyHTVUj+djldG9B+Pq0Lr60baNa5Q3EKWfIUDYwvYI=; b=W29Y3pJxg6msv6vsti/eCSWx7xaXYN2Es1PSicWF60mVwdq32OdYCWXELbNB+oZYnC VhhPaI+Ft6L2THBJH7iZqo5JIxNfqg2q26+xL6vCPEE21JPFpRaRmjezw9huv1L42ayV KAOK4azi/QiRZWECzWYddMEIZgj6DnviBbm3mJubEdxxoE95htdVlE6HT726yurGtQEr 665cFaWiIYzcOvBypMQYYfsYPbJbQAZ6gvsaa9B0QwozRlgK43IeBVhRLi6IcaYcqMbW /uYptkAAY2EWgLGHoY8ldcRs5cOK8ZMSPOa/F0rWTfK5BqxULN5h9sOlekYk801MskVT Qxaw== X-Gm-Message-State: APjAAAXNKyUwBE41Lz/rrgD6ps8q75Wy6kh6mu9ncnvRWULy3eQG0dYM dP1B0OEgSVgz3eUocE7G3H3SEw== X-Google-Smtp-Source: APXvYqzg0kKF8BTBovQmtFgqeEY99Z43OtEGVmVRlMjzR8mFQBD7xUq/zK7JydZGK348jpC4EQTGpw== X-Received: by 2002:a17:90a:cc16:: with SMTP id b22mr18402691pju.65.1582529146395; Sun, 23 Feb 2020 23:25:46 -0800 (PST) Received: from localhost ([45.127.44.57]) by smtp.gmail.com with ESMTPSA id e6sm11360524pfh.32.2020.02.23.23.25.45 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Sun, 23 Feb 2020 23:25:45 -0800 (PST) From: Amit Kucheria To: linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org, swboyd@chromium.org, mka@chromium.org, daniel.lezcano@linaro.org, Amit Kucheria , Zhang Rui Cc: linux-pm@vger.kernel.org, devicetree@vger.kernel.org Subject: [RFC PATCH v1 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors Date: Mon, 24 Feb 2020 12:55:35 +0530 Message-Id: <11f9128efef92b427d93a563d5b53b62c4c01888.1582528977.git.amit.kucheria@linaro.org> X-Mailer: git-send-email 2.20.1 In-Reply-To: References: MIME-Version: 1.0 Sender: linux-pm-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #thermal-sensor-cells is required in each device that acts as a thermal sensor. It is used to uniquely identify the instance of the thermal sensor inside the system. Signed-off-by: Amit Kucheria --- .../bindings/thermal/thermal-sensor.yaml | 70 +++++++++++++++++++ 1 file changed, 70 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml new file mode 100644 index 000000000000..ac32f54f2f98 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml @@ -0,0 +1,70 @@ +# SPDX-License-Identifier: (GPL-2.0 OR MIT) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal sensor binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of thermal zones required to take appropriate + action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or artively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-sensor. + + Thermal sensor devices provide temperature sensing capabilities on thermal + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor + devices may control one or more internal sensors. + +properties: + "#thermal-sensor-cells": + description: + Used to uniquely identify a thermal sensor instance within an IC. Will be + 0 on sensor nodes with only a single sensor and at least 1 on nodes + containing several internal sensors. + enum: [0, 1] + +examples: + - | + #include + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = ; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = ; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + }; +... From patchwork Mon Feb 24 07:25:36 2020 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Amit Kucheria X-Patchwork-Id: 11399473 Return-Path: Received: from mail.kernel.org (pdx-korg-mail-1.web.codeaurora.org [172.30.200.123]) by pdx-korg-patchwork-2.web.codeaurora.org (Postfix) with ESMTP id C17EE14D5 for ; Mon, 24 Feb 2020 07:25:55 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id 973662082E for ; Mon, 24 Feb 2020 07:25:55 +0000 (UTC) Authentication-Results: mail.kernel.org; dkim=pass (2048-bit key) header.d=linaro.org header.i=@linaro.org header.b="tjniMdRQ" Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1727299AbgBXHZy (ORCPT ); Mon, 24 Feb 2020 02:25:54 -0500 Received: from mail-pl1-f195.google.com ([209.85.214.195]:35898 "EHLO mail-pl1-f195.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1727314AbgBXHZw (ORCPT ); Mon, 24 Feb 2020 02:25:52 -0500 Received: by mail-pl1-f195.google.com with SMTP id a6so3689070plm.3 for ; Sun, 23 Feb 2020 23:25:51 -0800 (PST) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:in-reply-to:references :mime-version:content-transfer-encoding; bh=d17BUbT9BeIhozRgLya99QrlVVsu5JDoV05HFzpYDyI=; b=tjniMdRQcswz61KyutEoTh6PTFVjC1qxxE8fl7j0YkHZ+Hx+tuPlXr/PwYw5oFsB7N g45d0Xqy3xjQdUKxgoTBYHCzA52ywyhVkMae3eEqCypYoYbyE3pgECywvbOl9B1jimB+ JFq/9qyI+7Af6dHHhU5DkGGcaec2O89jGT1gDtIOLL/WXrKbu9EQScDIBpMWl94WIrCK ao8ggp/NWmmcKB7CyZvD/gXmk1P0HzSwloeyX1qYDfBqzlVwSUqdm+IY4pzjuXuqPej8 ILb6Ui+EOX7VgkxCkYqgSl3sRsfDiFEtHgUMy+ILcxAn2b3MiL20ev7QL2f0ZdK75cUi re+Q== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:in-reply-to :references:mime-version:content-transfer-encoding; bh=d17BUbT9BeIhozRgLya99QrlVVsu5JDoV05HFzpYDyI=; b=LykMQCfmcMYedy7mGoD4DeoBEj8PbLS7EvBi5mj0wZqu3c/wQZZZ0agYLiz55W2x+1 wzOCSNXgmV97q5CEYlkI1bi42c6jgLqyvXOwjakH3tgici6PKdDiiyXQXFwe+9yyGauz vhgD6MynBhmQ9UuQB8Deis5oPphT5dKrtS9HJIKoAh6USGpl8qpeEXyLEIMg0JmG5I8s wGwO5FEXDzeCuUBROEl3SIuEqY7o1Dh27XGt/CDR+zKHY47vgFcp0hN5Z8fWZJfjopQ2 HiUfWnUYIwQyegZDHN9g0DrMfe56+OIGw6lBQHhzT+fJVSdtkzixPFw6tbnPt6mXLs6s xPtg== X-Gm-Message-State: APjAAAVF5JlV/Vum4isBzN3jBu3GyPjDTKXtPCt0Xrrg0KYwVaz8z8/Y rlNeceItMTtSSPs221S1uNLlWA== X-Google-Smtp-Source: APXvYqzc/UxqWrw78Wyigaf18Y92PdErXwfLqoPnL2avooGuba1Fui3e6A0h0YKrb6IJKRUFAJUP9Q== X-Received: by 2002:a17:90a:8547:: with SMTP id a7mr19686083pjw.0.1582529150479; Sun, 23 Feb 2020 23:25:50 -0800 (PST) Received: from localhost ([45.127.44.57]) by smtp.gmail.com with ESMTPSA id 199sm11508299pfu.71.2020.02.23.23.25.49 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Sun, 23 Feb 2020 23:25:49 -0800 (PST) From: Amit Kucheria To: linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org, swboyd@chromium.org, mka@chromium.org, daniel.lezcano@linaro.org, Amit Kucheria , Zhang Rui Cc: linux-pm@vger.kernel.org, devicetree@vger.kernel.org Subject: [RFC PATCH v1 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices Date: Mon, 24 Feb 2020 12:55:36 +0530 Message-Id: X-Mailer: git-send-email 2.20.1 In-Reply-To: References: MIME-Version: 1.0 Sender: linux-pm-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #cooling-cells is required in each device that acts as a cooling device - whether active or passive. So any device that can throttle its performance to passively reduce heat dissipation (e.g. cpus, gpus) and any device that can actively dissipate heat at different levels (e.g. fans) will contain this property. Signed-off-by: Amit Kucheria --- .../thermal/thermal-cooling-devices.yaml | 114 ++++++++++++++++++ 1 file changed, 114 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml new file mode 100644 index 000000000000..6aafca25af9b --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml @@ -0,0 +1,114 @@ +# SPDX-License-Identifier: (GPL-2.0 OR MIT) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal cooling device binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overload. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or artively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the cooling devices. + + There are essentially two ways to provide control on power dissipation: + - Passive cooling: by means of regulating device performance. A typical + passive cooling mechanism is a CPU that has dynamic voltage and frequency + scaling (DVFS), and uses lower frequencies as cooling states. + - Active cooling: by means of activating devices in order to remove the + dissipated heat, e.g. regulating fan speeds. + + Any cooling device has a range of cooling states (i.e. different levels of + heat dissipation). They also have a way to determine the state of cooling in + which the device is. For example, a fan's cooling states correspond to the + different fan speeds possible. Cooling states are referred to by single + unsigned integers, where larger numbers mean greater heat dissipation. The + precise set of cooling states associated with a device should be defined in + a particular device's binding. + +properties: + "#cooling-cells": + description: + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + const: 2 + +examples: + - | + #include + #include + + // Example 1: Cpufreq cooling device on CPU0 + cpus { + #address-cells = <2>; + #size-cells = <0>; + + CPU0: cpu@0 { + device_type = "cpu"; + compatible = "qcom,kryo385"; + reg = <0x0 0x0>; + enable-method = "psci"; + cpu-idle-states = <&LITTLE_CPU_SLEEP_0 + &LITTLE_CPU_SLEEP_1 + &CLUSTER_SLEEP_0>; + capacity-dmips-mhz = <607>; + dynamic-power-coefficient = <100>; + qcom,freq-domain = <&cpufreq_hw 0>; + #cooling-cells = <2>; + next-level-cache = <&L2_0>; + L2_0: l2-cache { + compatible = "cache"; + next-level-cache = <&L3_0>; + L3_0: l3-cache { + compatible = "cache"; + }; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + cooling-device = <&CPU0 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + }; + }; + }; + + /* ... */ + }; +... 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The thermal-zone binding is a software abstraction to capture the properties of each zone - how often they should be checked, the temperature thresholds (trips) at which mitigation actions need to be taken and the level of mitigation needed at those thresholds. Signed-off-by: Amit Kucheria --- .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ 1 file changed, 302 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml new file mode 100644 index 000000000000..bc1ce8e41324 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml @@ -0,0 +1,302 @@ +# SPDX-License-Identifier: (GPL-2.0 OR MIT) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml# +$schema: http://devicetree.org/meta-schemas/base.yaml# + +title: Thermal zone binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or artively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-zones. + + The polling-delay properties of a thermal-zone are bound to the maximum dT/dt + (temperature derivative over time) in two situations for a thermal zone: + 1. when passive cooling is activated (polling-delay-passive) + 2. when the zone just needs to be monitored (polling-delay) or when + active cooling is activated. + + The maximum dT/dt is highly bound to hardware power consumption and + dissipation capability. The delays should be chosen to account for said + max dT/dt, such that a device does not cross several trip boundaries + unexpectedly between polls. Choosing the right polling delays shall avoid + having the device in temperature ranges that may damage the silicon structures + and reduce silicon lifetime. + +properties: + thermal-zones: + type: object + description: + A /thermal-zones node is required in order to use the thermal framework to + manage input from the various thermal zones in the system in order to + mitigate thermal overload conditions. It does not represent a real device + in the system, but acts as a container to link thermal sensor devices, + platform-data regarding temperature thresholds and the mitigation actions + to take when the temperature crosses those thresholds. + + properties: + $nodename: + pattern: "^[a-zA-Z][a-zA-Z0-9,\\-]{1,12}-thermal$" + type: object + description: + Each thermal zone node contains information about how frequently it + must be checked, the sensor responsible for reporting temperature for + this zone, one sub-node containing the various trip points for this + zone and one sub-node containing all the zone cooling-maps. + + properties: + polling-delay: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone. Setting this to 0 disables the polling + timers setup by the thermal framework and assumes that the thermal + sensors in this zone support interrupts. + + polling-delay-passive: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone while doing passive cooling. Setting + this to 0 disables the polling timers setup by the thermal + framework and assumes that the thermal sensors in this zone + support interrupts. + + thermal-sensors: + $ref: /schemas/types.yaml#/definitions/phandle-array + description: + A list of thermal sensor phandles and sensor specifiers used to + monitor this thermal zone. + + trips: + type: object + description: + This node describes a set of points in the temperature domain at + which the thermal framework needs to takes action. The actions to + be taken are defined in another node called cooling-maps. + + patternProperties: + "^[a-zA-Z][a-zA-Z0-9,+\\._]{0,63}$": + type: object + + properties: + temperature: + $ref: /schemas/types.yaml#/definitions/int32 + description: + An integer expressing the trip temperature in millicelsius. + + hysteresis: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An unsigned integer expressing the hysteresis delta with + respect to the trip temperature property above, also in + millicelsius. + + type: + oneOf: + - items: + - enum: + - active + - passive + - hot + - critical + description: | + There are four valid trip types, + - active - enable active cooling e.g. fans + - passive - enable passive cooling e.g. throttling cpu + - hot - send notification to driver if .notify + callback registered + - critical - send notification to driver if .notify + callback registered and trigger a shutdown + + required: + - temperature + - hysteresis + - type + + cooling-maps: + type: object + description: + This node describes the action to be taken when a thermal zone + crosses one of the temperature thresholds described in the trips + node. The action takes the form of a mapping relation between a + trip and the target cooling device state. + + patternProperties: + "^map[0-9][-a-zA-Z0-9]*$": + type: object + + properties: + trip: + $ref: /schemas/types.yaml#/definitions/phandle + description: + A phandle of a trip point node within this thermal zone. + + cooling-device: + $ref: /schemas/types.yaml#/definitions/phandle-array + description: + A list of cooling device phandles along with the minimum + and maximum cooling state specifiers for each cooling + device. Using the THERMAL_NO_LIMIT (-1UL) constant in the + cooling-device phandle limit specifier lets the framework + use the minimum and maximum cooling state for that cooling + device automatically. + + contribution: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + maximum: 100 + description: + The contribution of the cooling devices at the trip + temperature, both referenced in this map, to this thermal + zone as a percentage. + + required: + - trip + - cooling-device + +examples: + - | + #include + #include + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = ; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = ; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_alert1: trip-point1 { + temperature = <95000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_crit: cpu_crit { + temperature = <110000>; + hysteresis = <1000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + cooling-device = <&CPU0 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU1 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU2 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU3 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + }; + + map1 { + trip = <&cpu0_alert1>; + cooling-device = <&CPU0 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU1 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU2 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU3 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + }; + }; + }; + + /* ... */ + + cluster0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 5>; + + trips { + cluster0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + cluster0_crit: cluster0_crit { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + /* ... */ + + gpu-thermal-top { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 11>; + + trips { + gpu1_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + }; + }; + }; +...