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([2a01:e34:ed2f:f020:55a2:904c:d91e:5ce4]) by smtp.googlemail.com with ESMTPSA id b6sm4642618wmj.2.2021.05.05.01.44.26 (version=TLS1_3 cipher=TLS_AES_128_GCM_SHA256 bits=128/128); Wed, 05 May 2021 01:44:27 -0700 (PDT) To: Linus Torvalds Cc: Zhang Rui , Linux Kernel Mailing List , Linux PM mailing list , unixbhaskar@gmail.com, =?utf-8?q?Niklas_S=C3=B6derlund?= , zhang.yunkai@zte.com.cn, Jia-Ju Bai , Colin King , =?utf-8?b?6auY5LqR6ZyEIChKZXNvbiBH?= =?utf-8?b?YW8p?= , Konrad Dybcio , Thara Gopinath , Hao Fang , brian-sy yang , David Collins , Lukasz Luba , zhuguangqing83 , Robert Foss , gongruiqi1@huawei.com, yebin10@huawei.com, dingsenjie@yulong.com, "Leizhen (ThunderTown)" , rafal@milecki.pl, Lin Ruizhe , Ansuel Smith From: Daniel Lezcano Subject: [git pull] Thermal material for v5.13-rc Message-ID: Date: Wed, 5 May 2021 10:44:25 +0200 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:68.0) Gecko/20100101 Thunderbird/68.10.0 MIME-Version: 1.0 Content-Language: en-US Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org Hi Linus, please consider these thermal changes for v5.13-rc1 Thanks -- Daniel The following changes since commit a38fd8748464831584a19438cbb3082b5a2dab15: Linux 5.12-rc2 (2021-03-05 17:33:41 -0800) are available in the Git repository at: ssh://git@gitolite.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git tags/thermal-v5.13-rc1 for you to fetch changes up to c310e546164d5cca4c12faf9582b75989b030b68: thermal/drivers/mtk_thermal: Remove redundant initializations of several variables (2021-04-22 23:51:32 +0200) ---------------------------------------------------------------- - Remove duplicate error message for the amlogic driver (Tang Bin) - Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury) - Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund) - Remove duplicate include in ti-bandgap (Zhang Yunkai) - Assign error code in the error path in the function thermal_of_populate_bind_params() (Jia-Ju Bai) - Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian King) - Use the device name instead of auto-numbering for a better identification of the cooling device (Daniel Lezcano) - Improve a bit the division accuracy in the power allocator governor (Jeson Gao) - Enable the missing third sensor on msm8976 (Konrad Dybcio) - Add QCom tsens driver co-maintainer (Thara Gopinath) - Fix memory leak and use after free errors in the core code (Daniel Lezcano) - Add the MDM9607 compatible bindings (Konrad Dybcio) - Fix trivial spello in the copyright name for Hisilicon (Hao Fang) - Fix negative index array access when converting the frequency to power in the energy model (Brian-sy Yang) - Add support for Gen2 new PMIC support for Qcom SPMI (David Collins) - Update maintainer file for CPU cooling device section (Lukasz Luba) - Fix missing put_device on error in the Qcom tsens driver (Guangqing Zhu) - Add compatible DT binding for sm8350 (Robert Foss) - Add support for the MDM9607's tsens driver (Konrad Dybcio) - Remove duplicate error messages in thermal_mmio and the bcm2835 driver (Ruiqi Gong) - Add the Thermal Temperature Cooling driver (Zhang Rui) - Remove duplicate error messages in the Hisilicon sensor driver (Ye Bin) - Use the devm_platform_ioremap_resource_byname() function instead of a couple of corresponding calls (dingsenjie) - Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei) - Add missing property in the DT thermal sensor binding (Rafał Miłecki) - Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe) - Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki) - Replace the thermal_notify_framework() call by a call to the thermal_zone_device_update() function. Remove the function as well as the corresponding documentation (Thara Gopinath) - Add support for the ipq8064-tsens sensor along with a set of cleanups and code preparation (Ansuel Smith) - Add a lockless __thermal_cdev_update() function to improve the locking scheme in the core code and governors (Lukasz Luba) - Fix multiple cooling device notification changes (Lukasz Luba) - Remove unneeded variable initialization (Colin Ian King) ---------------------------------------------------------------- Ansuel Smith (9): thermal/drivers/tsens: Don't hardcode sensor slope thermal/drivers/tsens: Convert msm8960 to reg_field thermal/drivers/tsens: Add VER_0 tsens version thermal/drivers/tsens: Use init_common for msm8960 thermal/drivers/tsens: Fix bug in sensor enable for msm8960 thermal/drivers/tsens: Replace custom 8960 apis with generic apis thermal/drivers/tsens: Drop unused define for msm8960 thermal/drivers/tsens: Add support for ipq8064-tsens dt-bindings: thermal: tsens: Document ipq8064 bindings Bhaskar Chowdhury (2): thermal: Fix a typo in the file soctherm.c thermal: Fix couple of spellos in the file sun8i_thermal.c Colin Ian King (2): thermal: Fix spelling mistake "disabed" -> "disabled" thermal/drivers/mtk_thermal: Remove redundant initializations of several variables Daniel Lezcano (8): thermal/drivers/core: Use a char pointer for the cooling device name thermal/drivers/cpufreq_cooling: Use device name instead of auto-numbering thermal/drivers/devfreq_cooling: Use device name instead of auto-numbering thermal/drivers/cpuidle_cooling: Use device name instead of auto-numbering thermal/drivers/cpufreq_cooling: Remove unused list thermal/core: Fix memory leak in the error path thermal/drivers/devfreq_cooling: Fix wrong return on error path thermal/drivers/cpuidle_cooling: Fix use after error David Collins (1): thermal/drivers/qcom-spmi-temp-alarm: Add support for GEN2 rev 1 PMIC peripherals Guangqing Zhu (1): thermal/drivers/tsens: Fix missing put_device error Hao Fang (1): thermal/drivers/hisi: Use the correct HiSilicon copyright Jia-Ju Bai (1): thermal: thermal_of: Fix error return code of thermal_of_populate_bind_params() Konrad Dybcio (3): thermal/drivers/qcom/tsens_v1: Enable sensor 3 on MSM8976 dt-bindings: tsens: qcom: Document MDM9607 compatible thermal/drivers/qcom/tsens-v0_1: Add support for MDM9607 Lin Ruizhe (1): thermal/drivers/ti-soc-thermal/bandgap Remove unused variable 'val' Lukasz Luba (7): MAINTAINERS: update thermal CPU cooling section thermal/core: Create a helper __thermal_cdev_update() without a lock thermal/core/power_allocator: Maintain the device statistics from going stale thermal/core/power_allocator: Update once cooling devices when temp is low thermal/core/fair share: Lock the thermal zone while looping over instances thermal/core/fair share: Use the lockless __thermal_cdev_update() function thermal/core/power allocator: Use the lockless __thermal_cdev_update() function Niklas Söderlund (2): thermal: rcar_gen3_thermal: Add support for up to five TSC nodes dt-bindings: thermal: rcar-gen3-thermal: Support five TSC nodes on r8a779a0 Rafał Miłecki (2): dt-bindings: thermal: thermal-sensor: require "#thermal-sensor-cells" dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema Robert Foss (1): dt-bindings: thermal: qcom-tsens: Add compatible for sm8350 Ruiqi Gong (2): thermal/drivers/thermal_mmio: Remove redundant dev_err call in thermal_mmio_probe() thermal/drivers/bcm2835: Remove redundant dev_err call in bcm2835_thermal_probe() Tang Bin (1): thermal: amlogic: Omit superfluous error message in amlogic_thermal_probe() Thara Gopinath (4): MAINTAINERS: Add co-maintainer for Qualcomm tsens thermal drivers iwlwifi: mvm: tt: Replace thermal_notify_framework thermal/core: Remove thermal_notify_framework Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation Ye Bin (1): thermal/drivers/hisi: Remove redundant dev_err call in hisi_thermal_probe() Zhang Rui (1): thermal/drivers/intel: Introduce tcc cooling driver Zhang Yunkai (1): thermal:ti-soc-thermal: Remove duplicate include in ti-bandgap Zhen Lei (1): thermal/drivers/ti-soc-thermal/ti-bandgap: Rearrange all the included header files alphabetically brian-sy yang (1): thermal/drivers/cpufreq_cooling: Fix slab OOB issue dingsenjie (1): thermal/drivers/tegra: Use devm_platform_ioremap_resource_byname jeson.gao (1): thermal/core/power_allocator: Using round the division when re-divvying up power .../bindings/thermal/brcm,ns-thermal.txt | 37 ---- .../bindings/thermal/brcm,ns-thermal.yaml | 60 ++++++ .../devicetree/bindings/thermal/qcom-tsens.yaml | 59 +++++- .../bindings/thermal/rcar-gen3-thermal.yaml | 43 +++- .../bindings/thermal/thermal-sensor.yaml | 3 + Documentation/driver-api/thermal/sysfs-api.rst | 12 +- MAINTAINERS | 3 +- drivers/net/ethernet/mellanox/mlxsw/core_thermal.c | 2 +- drivers/net/wireless/intel/iwlwifi/mvm/tt.c | 4 +- drivers/thermal/amlogic_thermal.c | 4 +- drivers/thermal/broadcom/bcm2835_thermal.c | 1 - drivers/thermal/cpufreq_cooling.c | 49 ++--- drivers/thermal/cpuidle_cooling.c | 37 ++-- drivers/thermal/devfreq_cooling.c | 25 +-- drivers/thermal/gov_fair_share.c | 11 +- drivers/thermal/gov_power_allocator.c | 32 ++- drivers/thermal/hisi_thermal.c | 10 +- drivers/thermal/intel/Kconfig | 11 + drivers/thermal/intel/Makefile | 1 + drivers/thermal/intel/intel_tcc_cooling.c | 129 +++++++++++ drivers/thermal/mtk_thermal.c | 12 +- drivers/thermal/qcom/qcom-spmi-temp-alarm.c | 91 +++++--- drivers/thermal/qcom/tsens-8960.c | 235 ++++++++++----------- drivers/thermal/qcom/tsens-v0_1.c | 98 ++++++++- drivers/thermal/qcom/tsens-v1.c | 4 +- drivers/thermal/qcom/tsens.c | 165 ++++++++++++--- drivers/thermal/qcom/tsens.h | 6 +- drivers/thermal/rcar_gen3_thermal.c | 3 +- drivers/thermal/sun8i_thermal.c | 4 +- drivers/thermal/tegra/soctherm.c | 15 +- drivers/thermal/thermal_core.c | 57 ++--- drivers/thermal/thermal_core.h | 1 + drivers/thermal/thermal_helpers.c | 27 ++- drivers/thermal/thermal_mmio.c | 5 +- drivers/thermal/thermal_of.c | 7 +- drivers/thermal/ti-soc-thermal/ti-bandgap.c | 37 ++-- include/linux/thermal.h | 7 +- include/uapi/linux/thermal.h | 2 +- 38 files changed, 863 insertions(+), 446 deletions(-) delete mode 100644 Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt create mode 100644 Documentation/devicetree/bindings/thermal/brcm,ns-thermal.yaml create mode 100644 drivers/thermal/intel/intel_tcc_cooling.c