| Message ID | 1423517653-11359-2-git-send-email-edubezval@gmail.com (mailing list archive) |
|---|---|
| State | RFC, archived |
| Headers | show |
On 02/09/15 13:34, Eduardo Valentin wrote: > + <chapter id="introduction"> > + <title>Introduction</title> > + <para>Thermal management is any method or technique implied to > + mitigate emergencies caused by operating devices within > + unsupported temperatures. The challenge consists of designing a I would flip the ending of that sentence: caused by operating devices outside of supported temperatures. > + product keeping the junction temperature of the IC components. > + The operating temperature of IC components used on products must > + operate within their design limits. Besides, temperature towards > + device enclosure must be in a comfort level for the user. > + Therefore, thermal management, by the time of this writing, > + starts in very early device design phase. Managing thermal may > + involve different disciplines, at different stages, such as > + temperature monitoring, floorplanning, microarchitectural > + techniques, compiler techniques, OS techniques, liquid cooling, > + and thermal reliability or security. This document covers what > + the Linux Kernel Thermal Framework provides as abstraction to > + users with respect to thermal management. > + </para> > + <para>One of the first proposals to provide a solution to cover > + the thermal problem appears in the Advanced Configuration and > + Power Interface (ACPI) specification. ACPI provides an open > + standard for device configuration and power management by the > + operating system. However, several computing devices which may > + have thermal issues in the market disregard the ACPI standard. > + Therefore, the Linux Kernel Thermal Framework has been designed > + to serve as abstraction for ACPI and non-ACPI systems. The core > + concepts applies in both types of systems. > + </para> > + <para>The Linux Kernel Thermal Framework has a design which > + represents the different thermal constraints found in an drop: an^^ > + end-products. The thermal constraints exist to serve different > + purposes. There two major types of thermal constraints. The There are two > + first is related to components junction temperature. The second > + is related to the level of comfort while end users are handling > + devices. > + </para> > + > + </chapter> > +</book> >
On Tue, Feb 10, 2015 at 02:50:36PM -0800, Randy Dunlap wrote: > On 02/09/15 13:34, Eduardo Valentin wrote: > > > + <chapter id="introduction"> > > + <title>Introduction</title> > > + <para>Thermal management is any method or technique implied to > > + mitigate emergencies caused by operating devices within > > + unsupported temperatures. The challenge consists of designing a > > I would flip the ending of that sentence: > caused by operating devices outside of > supported temperatures. > > > + product keeping the junction temperature of the IC components. > > + The operating temperature of IC components used on products must > > + operate within their design limits. Besides, temperature towards > > + device enclosure must be in a comfort level for the user. > > + Therefore, thermal management, by the time of this writing, > > + starts in very early device design phase. Managing thermal may > > + involve different disciplines, at different stages, such as > > + temperature monitoring, floorplanning, microarchitectural > > + techniques, compiler techniques, OS techniques, liquid cooling, > > + and thermal reliability or security. This document covers what > > + the Linux Kernel Thermal Framework provides as abstraction to > > + users with respect to thermal management. > > + </para> > > + <para>One of the first proposals to provide a solution to cover > > + the thermal problem appears in the Advanced Configuration and > > + Power Interface (ACPI) specification. ACPI provides an open > > + standard for device configuration and power management by the > > + operating system. However, several computing devices which may > > + have thermal issues in the market disregard the ACPI standard. > > + Therefore, the Linux Kernel Thermal Framework has been designed > > + to serve as abstraction for ACPI and non-ACPI systems. The core > > + concepts applies in both types of systems. > > + </para> > > + <para>The Linux Kernel Thermal Framework has a design which > > + represents the different thermal constraints found in an > > drop: an^^ > > > + end-products. The thermal constraints exist to serve different > > + purposes. There two major types of thermal constraints. The > > There are two > > > + first is related to components junction temperature. The second > > + is related to the level of comfort while end users are handling > > + devices. > > + </para> > > + > > + </chapter> > > +</book> > > > > > -- > ~Randy Thanks Randy for checking this up. I apologize for forgetting Ccing you in my original post. I will fix the text as per your suggestions and also copy you in next version. Thanks for you time. Eduardo Valentin
On Mon, Feb 09, 2015 at 09:34:02PM +0000, Eduardo Valentin wrote: > This patch adds a book about the Linux Kernel Thermal Framework. > In this change, only a brief introduction is added together with > Makefile changes. > > Signed-off-by: Eduardo Valentin <edubezval@gmail.com> > --- > Documentation/DocBook/Makefile | 3 +- > Documentation/DocBook/thermal.tmpl | 88 ++++++++++++++++++++++++++++++++++++++ > 2 files changed, 90 insertions(+), 1 deletion(-) > create mode 100644 Documentation/DocBook/thermal.tmpl > > diff --git a/Documentation/DocBook/Makefile b/Documentation/DocBook/Makefile > index 9c7d92d..8163508 100644 > --- a/Documentation/DocBook/Makefile > +++ b/Documentation/DocBook/Makefile > @@ -15,7 +15,8 @@ DOCBOOKS := z8530book.xml device-drivers.xml \ > 80211.xml debugobjects.xml sh.xml regulator.xml \ > alsa-driver-api.xml writing-an-alsa-driver.xml \ > tracepoint.xml drm.xml media_api.xml w1.xml \ > - writing_musb_glue_layer.xml crypto-API.xml > + writing_musb_glue_layer.xml crypto-API.xml thermal.xml > + writing_musb_glue_layer.xml Duplicated writing_musb_glue_layer.xml ? Looks like the second line should be removed. > > include Documentation/DocBook/media/Makefile > > diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl > new file mode 100644 > index 0000000..f8fb8a2 > --- /dev/null > +++ b/Documentation/DocBook/thermal.tmpl > @@ -0,0 +1,88 @@ > +<?xml version="1.0" encoding="UTF-8"?> > +<!DOCTYPE book PUBLIC "-//OASIS//DTD DocBook XML V4.1.2//EN" > + "http://www.oasis-open.org/docbook/xml/4.1.2/docbookx.dtd" []> > + > +<book id="thermal-api"> > + <bookinfo> > + <title>Linux Kernel Thermal Framework API</title> > + > + <authorgroup> > + <author> > + <firstname>Eduardo</firstname> > + <surname>Valentin</surname> > + <affiliation> > + <address> > + <email>evalenti@kernel.org</email> > + </address> > + </affiliation> > + </author> > + </authorgroup> > + > + <copyright> > + <year>2008-2014</year> > + <holder>Eduardo Valentin</holder> > + <holder>Sujith Thomas</holder> > + <holder>Zhang Rui</holder> > + </copyright> > + <legalnotice> > + <para> > + This documentation is free software; you can redistribute > + it and/or modify it under the terms of the GNU General Public > + License version 2 as published by the Free Software Foundation. > + </para> > + > + <para> > + This program is distributed in the hope that it will be > + useful, but WITHOUT ANY WARRANTY; without even the implied > + warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. > + See the GNU General Public License for more details. > + </para> > + > + <para> > + For more details see the file COPYING in the source > + distribution of Linux. > + </para> > + </legalnotice> > + </bookinfo> > + > +<toc></toc> > + > + <chapter id="introduction"> > + <title>Introduction</title> > + <para>Thermal management is any method or technique implied to > + mitigate emergencies caused by operating devices within > + unsupported temperatures. The challenge consists of designing a > + product keeping the junction temperature of the IC components. > + The operating temperature of IC components used on products must > + operate within their design limits. Besides, temperature towards > + device enclosure must be in a comfort level for the user. > + Therefore, thermal management, by the time of this writing, > + starts in very early device design phase. Managing thermal may > + involve different disciplines, at different stages, such as > + temperature monitoring, floorplanning, microarchitectural > + techniques, compiler techniques, OS techniques, liquid cooling, > + and thermal reliability or security. This document covers what > + the Linux Kernel Thermal Framework provides as abstraction to > + users with respect to thermal management. > + </para> > + <para>One of the first proposals to provide a solution to cover > + the thermal problem appears in the Advanced Configuration and > + Power Interface (ACPI) specification. ACPI provides an open > + standard for device configuration and power management by the > + operating system. However, several computing devices which may > + have thermal issues in the market disregard the ACPI standard. > + Therefore, the Linux Kernel Thermal Framework has been designed > + to serve as abstraction for ACPI and non-ACPI systems. The core > + concepts applies in both types of systems. > + </para> > + <para>The Linux Kernel Thermal Framework has a design which > + represents the different thermal constraints found in an > + end-products. The thermal constraints exist to serve different > + purposes. There two major types of thermal constraints. The are > + first is related to components junction temperature. The second > + is related to the level of comfort while end users are handling > + devices. > + </para> > + > + </chapter> > +</book> Cheers, Javi -- To unsubscribe from this list: send the line "unsubscribe linux-pm" in the body of a message to majordomo@vger.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html
diff --git a/Documentation/DocBook/Makefile b/Documentation/DocBook/Makefile index 9c7d92d..8163508 100644 --- a/Documentation/DocBook/Makefile +++ b/Documentation/DocBook/Makefile @@ -15,7 +15,8 @@ DOCBOOKS := z8530book.xml device-drivers.xml \ 80211.xml debugobjects.xml sh.xml regulator.xml \ alsa-driver-api.xml writing-an-alsa-driver.xml \ tracepoint.xml drm.xml media_api.xml w1.xml \ - writing_musb_glue_layer.xml crypto-API.xml + writing_musb_glue_layer.xml crypto-API.xml thermal.xml + writing_musb_glue_layer.xml include Documentation/DocBook/media/Makefile diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl new file mode 100644 index 0000000..f8fb8a2 --- /dev/null +++ b/Documentation/DocBook/thermal.tmpl @@ -0,0 +1,88 @@ +<?xml version="1.0" encoding="UTF-8"?> +<!DOCTYPE book PUBLIC "-//OASIS//DTD DocBook XML V4.1.2//EN" + "http://www.oasis-open.org/docbook/xml/4.1.2/docbookx.dtd" []> + +<book id="thermal-api"> + <bookinfo> + <title>Linux Kernel Thermal Framework API</title> + + <authorgroup> + <author> + <firstname>Eduardo</firstname> + <surname>Valentin</surname> + <affiliation> + <address> + <email>evalenti@kernel.org</email> + </address> + </affiliation> + </author> + </authorgroup> + + <copyright> + <year>2008-2014</year> + <holder>Eduardo Valentin</holder> + <holder>Sujith Thomas</holder> + <holder>Zhang Rui</holder> + </copyright> + <legalnotice> + <para> + This documentation is free software; you can redistribute + it and/or modify it under the terms of the GNU General Public + License version 2 as published by the Free Software Foundation. + </para> + + <para> + This program is distributed in the hope that it will be + useful, but WITHOUT ANY WARRANTY; without even the implied + warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. + See the GNU General Public License for more details. + </para> + + <para> + For more details see the file COPYING in the source + distribution of Linux. + </para> + </legalnotice> + </bookinfo> + +<toc></toc> + + <chapter id="introduction"> + <title>Introduction</title> + <para>Thermal management is any method or technique implied to + mitigate emergencies caused by operating devices within + unsupported temperatures. The challenge consists of designing a + product keeping the junction temperature of the IC components. + The operating temperature of IC components used on products must + operate within their design limits. Besides, temperature towards + device enclosure must be in a comfort level for the user. + Therefore, thermal management, by the time of this writing, + starts in very early device design phase. Managing thermal may + involve different disciplines, at different stages, such as + temperature monitoring, floorplanning, microarchitectural + techniques, compiler techniques, OS techniques, liquid cooling, + and thermal reliability or security. This document covers what + the Linux Kernel Thermal Framework provides as abstraction to + users with respect to thermal management. + </para> + <para>One of the first proposals to provide a solution to cover + the thermal problem appears in the Advanced Configuration and + Power Interface (ACPI) specification. ACPI provides an open + standard for device configuration and power management by the + operating system. However, several computing devices which may + have thermal issues in the market disregard the ACPI standard. + Therefore, the Linux Kernel Thermal Framework has been designed + to serve as abstraction for ACPI and non-ACPI systems. The core + concepts applies in both types of systems. + </para> + <para>The Linux Kernel Thermal Framework has a design which + represents the different thermal constraints found in an + end-products. The thermal constraints exist to serve different + purposes. There two major types of thermal constraints. The + first is related to components junction temperature. The second + is related to the level of comfort while end users are handling + devices. + </para> + + </chapter> +</book>
This patch adds a book about the Linux Kernel Thermal Framework. In this change, only a brief introduction is added together with Makefile changes. Signed-off-by: Eduardo Valentin <edubezval@gmail.com> --- Documentation/DocBook/Makefile | 3 +- Documentation/DocBook/thermal.tmpl | 88 ++++++++++++++++++++++++++++++++++++++ 2 files changed, 90 insertions(+), 1 deletion(-) create mode 100644 Documentation/DocBook/thermal.tmpl