Message ID | 20230103064615.5311-2-a-bhatia1@ti.com (mailing list archive) |
---|---|
State | Superseded |
Headers | show |
Series | dt-bindings: Introduce dual-link panels & panel-vendors | expand |
Context | Check | Description |
---|---|---|
conchuod/patch_count | success | Link |
conchuod/cover_letter | success | Series has a cover letter |
conchuod/tree_selection | success | Guessed tree name to be for-next |
conchuod/fixes_present | success | Fixes tag not required for -next series |
conchuod/maintainers_pattern | success | MAINTAINERS pattern errors before the patch: 13 and now 13 |
conchuod/verify_signedoff | success | Signed-off-by tag matches author and committer |
conchuod/kdoc | success | Errors and warnings before: 0 this patch: 0 |
conchuod/module_param | success | Was 0 now: 0 |
conchuod/alphanumeric_selects | success | Out of order selects before the patch: 57 and now 57 |
conchuod/build_rv32_defconfig | success | Build OK |
conchuod/build_warn_rv64 | success | Errors and warnings before: 2054 this patch: 2054 |
conchuod/dtb_warn_rv64 | success | Errors and warnings before: 0 this patch: 0 |
conchuod/header_inline | success | No static functions without inline keyword in header files |
conchuod/checkpatch | success | total: 0 errors, 0 warnings, 0 checks, 8 lines checked |
conchuod/source_inline | success | Was 0 now: 0 |
conchuod/build_rv64_nommu_k210_defconfig | success | Build OK |
conchuod/verify_fixes | success | No Fixes tag |
conchuod/build_rv64_nommu_virt_defconfig | success | Build OK |
On 03/01/2023 07:46, Aradhya Bhatia wrote: > Add document vendor prefix for Microtips Technology USA (microtips). > > Signed-off-by: Aradhya Bhatia <a-bhatia1@ti.com> > --- > Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 ++ Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Best regards, Krzysztof
Hi Aradhya, Thank you for the patch. On Tue, Jan 03, 2023 at 12:16:12PM +0530, Aradhya Bhatia wrote: > Add document vendor prefix for Microtips Technology USA (microtips). > > Signed-off-by: Aradhya Bhatia <a-bhatia1@ti.com> Reviewed-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com> > --- > Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 ++ > 1 file changed, 2 insertions(+) > > diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml > index 70ffb3780621..516134cbcb3c 100644 > --- a/Documentation/devicetree/bindings/vendor-prefixes.yaml > +++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml > @@ -821,6 +821,8 @@ patternProperties: > description: Microsoft Corporation > "^microsys,.*": > description: MicroSys Electronics GmbH > + "^microtips,.*": > + description: Microtips Technology USA > "^mikroe,.*": > description: MikroElektronika d.o.o. > "^mikrotik,.*":
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml index 70ffb3780621..516134cbcb3c 100644 --- a/Documentation/devicetree/bindings/vendor-prefixes.yaml +++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml @@ -821,6 +821,8 @@ patternProperties: description: Microsoft Corporation "^microsys,.*": description: MicroSys Electronics GmbH + "^microtips,.*": + description: Microtips Technology USA "^mikroe,.*": description: MikroElektronika d.o.o. "^mikrotik,.*":
Add document vendor prefix for Microtips Technology USA (microtips). Signed-off-by: Aradhya Bhatia <a-bhatia1@ti.com> --- Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 ++ 1 file changed, 2 insertions(+)